公开(公告)号：US09418952B2

公开(公告)日：2016-08-16

申请号：US14632896

申请日：2015-02-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Jie Chen

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L24/09 ,  H01L21/56 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0214 ,  H01L2224/02175 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/02351 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/06131 ,  H01L2224/06136 ,  H01L2224/06179 ,  H01L2224/0912 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/00012

摘要： Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to a second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element comprises a first side and a second side coupled to the first side. The first side and the second side of the transition element are non-tangential to the PPI pad.

摘要翻译： 公开了用于半导体器件的封装装置及其制造方法。 在一些实施例中，包装装置包括设置在衬底上的接触焊盘以及设置在衬底上的钝化层和接触焊盘的第一部分。 后钝化互连（PPI）线设置在钝化层上并且耦合到接触焊盘的第二部分。 PPI垫设置在钝化层上。 过渡元件设置在钝化层上并且耦合在PPI线和PPI衬垫之间。 过渡元件包括联接到第一侧的第一侧和第二侧。 过渡元件的第一面和第二面与PPI垫非切线。

公开(公告)号：US09355978B2

公开(公告)日：2016-05-31

申请号：US13894107

申请日：2013-05-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Tsung-Yuan Yu ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L24/09 ,  H01L21/56 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0214 ,  H01L2224/02175 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/02351 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/06131 ,  H01L2224/06136 ,  H01L2224/06179 ,  H01L2224/0912 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/00012

摘要： Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A second portion of the contact pad is exposed. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to the second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes a hollow region.

摘要翻译： 公开了用于半导体器件的封装装置及其制造方法。 在一些实施例中，包装装置包括设置在衬底上的接触焊盘以及设置在衬底上的钝化层和接触焊盘的第一部分。 接触垫的第二部分被暴露。 后钝化互连（PPI）线设置在钝化层上并且耦合到接触焊盘的第二部分。 PPI垫设置在钝化层上。 过渡元件设置在钝化层上并且耦合在PPI线和PPI衬垫之间。 过渡元件包括中空区域。

公开(公告)号：US20160126217A1

公开(公告)日：2016-05-05

申请号：US14527534

申请日：2014-10-29

申请人： Elwha LLC

发明人： William David Duncan ,  Roderick A. Hyde ,  Jordin T. Kare ,  Thomas M. McWilliams ,  Thomas Allan Weaver ,  Lowell L. Wood, JR.

IPC分类号： H01L23/00

CPC分类号： H01L23/48 ,  H01F2038/146 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/051 ,  H01L2224/05571 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/11318 ,  H01L2224/11424 ,  H01L2224/11444 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13186 ,  H01L2224/1319 ,  H01L2224/13194 ,  H01L2224/13286 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14164 ,  H01L2224/81007 ,  H01L2224/81101 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/8181 ,  H01L2224/819 ,  H01L2225/06531 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets.

摘要翻译： 使用液滴的基板间耦合和对准可以包括电和等离子体模式。 例如，一组液滴可以放置在底部基板上。 顶部衬底可以放置在液滴上，液滴使用液滴来对准衬底。 使用电容或等离子体耦合模式中的液滴，可以使用液滴在基板之间传递信息或功率。

公开(公告)号：US09299606B2

公开(公告)日：2016-03-29

申请号：US14548583

申请日：2014-11-20

申请人： International Business Machines Corporation

发明人： Toyohiro Aoki ,  Hiroyuki Mori ,  Kazushige Toriyama

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/34 ,  H01L23/522 ,  H01L25/065 ,  H01L25/00 ,  H01L23/488

CPC分类号： H01L24/13 ,  B23K3/0623 ,  H01L21/4867 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/34 ,  H01L23/345 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49894 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/11013 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/11416 ,  H01L2224/1148 ,  H01L2224/11618 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/16111 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17519 ,  H01L2224/27 ,  H01L2224/27416 ,  H01L2224/27515 ,  H01L2224/27618 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/12042 ,  H01L2924/3512 ,  H01L2924/37001 ,  H01L2924/3841 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01026 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00013 ,  H01L2924/00012

摘要： A substrate bonding method is able to reliably bond substrates while avoiding a reduction in yield made worse by finer pitches. The substrate bonding method can include: forming an adhesive resin layer on a surface of a first substrate on which a pad has been formed; forming an opening on the adhesive resin layer above the pad; filling the opening with molten solder to form a pillar-shaped solder bump; and applying heat and pressure to the first substrate and a second substrate while a terminal formed on the second substrate is aligned with the solder bump.

摘要翻译： 基板接合方法能够可靠地接合基板，同时避免产率的降低，由较细的间距变差。 基板接合方法可以包括：在已经形成有焊盘的第一基板的表面上形成粘合树脂层; 在所述垫上方的所述粘合树脂层上形成开口; 用熔融焊料填充开口以形成柱状焊料凸块; 以及在形成在所述第二基板上的端子与所述焊料凸块对准的同时向所述第一基板和第二基板施加热和压力。

公开(公告)号：US20160043049A1

公开(公告)日：2016-02-11

申请号：US14879418

申请日：2015-10-09

申请人： Intel Corporation

发明人： Chia-Pin Chiu ,  Xiaorong Xiong ,  Linda Zhang ,  Robert Nickerson ,  Charles Gealer

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L21/56

CPC分类号： H01L24/13 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11013 ,  H01L2224/1132 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/1815 ,  H01L2924/00

摘要： Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.

公开(公告)号：US09240385B2

公开(公告)日：2016-01-19

申请号：US14583984

申请日：2014-12-29

申请人： Micron Technology, Inc.

发明人： Young Do Kweon ,  Tongbi Jiang

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L21/78 ,  H01L21/56

CPC分类号： H01L24/742 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/566 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/11013 ,  H01L2224/11015 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/7598 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/384 ,  H01L2924/00 ,  H01L2224/05599

摘要： Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

摘要翻译： 本文公开了在半导体工件上形成多个微电子器件的微电子器件和方法。 一种这样的方法包括将多个第一互连元件放置在半导体工件的一侧上，在工件侧面上形成层，通过加热第一互连元件来重塑第一互连元件，以及将多个第一互连元件的第一部分 单独的第二互连元件到相应的第一互连元件，其中所述单个第二互连元件的第二部分被暴露。

公开(公告)号：US20150357301A1

公开(公告)日：2015-12-10

申请号：US14828147

申请日：2015-08-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Guan-Yu Chen ,  Yu-Wei Lin ,  Yu-Jen Tseng ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC分类号： H01L23/00

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02125 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05114 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/10125 ,  H01L2224/11013 ,  H01L2224/11019 ,  H01L2224/1112 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13551 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/14051 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/81007 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81895 ,  H01L2224/8192 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/04941 ,  H01L2924/07025 ,  H01L2924/181 ,  H01L2924/301 ,  H01L2924/35 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2924/00012

摘要： An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal bump on the under bump metallurgy feature, and a substrate trace on a substrate, the substrate trace coupled to the metal bump through a solder joint and intermetallic compounds, a ratio of a first cross sectional area of the intermetallic compounds to a second cross sectional area of the solder joint greater than forty percent.

摘要翻译： 轨迹（BOT）结构上的实施例凸块包括由集成电路支撑的接触元件，电耦合到接触元件的凸块下金属（UBM）特征，凸起下金属冶金特征上的金属凸块，以及衬底迹线 衬底，通过焊接接头和金属间化合物耦合到金属凸块的衬底迹线，金属间化合物的第一横截面积与焊料接头的第二横截面积的比率大于百分之四十。

公开(公告)号：US20150303157A1

公开(公告)日：2015-10-22

申请号：US14754293

申请日：2015-06-29

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/00 ,  H01L21/3213

CPC分类号： H01L24/11 ,  H01L21/3213 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/0362 ,  H01L2224/03823 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05578 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05664 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/1111 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/81815 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00

摘要： An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.

公开(公告)号：US09165841B2

公开(公告)日：2015-10-20

申请号：US13828541

申请日：2013-03-14

申请人： Intel Mobile Communications GmbH

发明人： Thorsten Meyer

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L23/00 ,  G03F7/20 ,  G03F9/00 ,  H01L21/56

CPC分类号： H01L22/10 ,  G03F7/70991 ,  G03F9/7003 ,  G03F9/7011 ,  H01L21/568 ,  H01L24/19 ,  H01L24/64 ,  H01L24/96 ,  H01L2224/02311 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/11013 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly. The method includes aligning the laser assembly with the carrier and laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner.

摘要翻译： 处理半导体芯片的方法包括：利用扫描仪测量放置在载体上的半导体管芯的位置，以产生管芯位置信息。 该方法包括在半导体管芯上方施加电介质层并将管芯位置信息传送到激光器组件。 该方法包括：基于由扫描仪产生的管芯位置信息，将激光器组件与载体对准，激光器与激光器组件结合介电层。

公开(公告)号：US09159690B2

公开(公告)日：2015-10-13

申请号：US14036755

申请日：2013-09-25

申请人： Intel Corporation

发明人： Chia-Pin Chiu ,  Xiaorong Xiong ,  Linda Zhang ,  Robert Nickerson ,  Charles Gealer

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11013 ,  H01L2224/1132 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/1815 ,  H01L2924/00

摘要： Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. A package can include a chip package situated below a lower surface of a first substrate, the package including a die situated on a top surface of a second substrate, a molding disposed over the upper surface of the second substrate, the molding extending over the second die and including an opening extending from an upper surface of the molding towards an upper surface of the second substrate, wherein the opening is configured to admit at least a portion of the solder ball, and a solder column electrically and mechanically coupled to the second substrate, situated in the opening, conforming to the cylinder, and including at least two layers of solder with flux therebetween.

摘要翻译： 本文通常讨论的是包括扩展TSBA球的系统和装置及其制造技术。 封装可以包括位于第一基板的下表面下方的芯片封装，所述封装包括位于第二基板的顶表面上的模具，设置在所述第二基板的上表面上的模具，所述模制件在所述第二基板的上表面上延伸 并且包括从模制件的上表面朝向第二基板的上表面延伸的开口，其中开口被配置为允许焊球的至少一部分，并且焊料柱电和机械地耦合到第二基板 ，位于开口中，符合气缸，并且包括至少两层焊料，焊剂之间具有焊剂。