公开(公告)号：US20240021563A1

公开(公告)日：2024-01-18

申请号：US18351748

申请日：2023-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokhyun Lee

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/27 ,  H01L25/0657 ,  H01L25/50 ,  H01L24/48 ,  H01L24/32 ,  H01L2225/06506 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/27416 ,  H01L2224/27515 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2924/2021

Abstract: A method of manufacturing a semiconductor package includes preparing a wafer having a first surface on which a plurality of semiconductor chips are disposed and a second surface, opposite to the first surface. The second surface of the wafer is ground. The ground second surface of the wafer is coated with a liquid adhesive material to form an uncured adhesive layer having a thickness of 5 μm or less. The uncured adhesive layer on the wafer is semi-cured. The wafer is cut so as to separate the plurality of semiconductor chips from one another. The plurality of semiconductor chips are stacked using the semi-cured adhesive layer. The semi-cured adhesive layer disposed between the plurality of stacked semiconductor chips is fully cured.

公开(公告)号：US09929124B2

公开(公告)日：2018-03-27

申请号：US15317686

申请日：2014-06-26

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Jurgen Burggraf

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00 ,  C03C27/10 ,  C09J5/00 ,  C23C14/58

CPC classification number: H01L24/83 ,  C03C27/10 ,  C09J5/00 ,  C09J2400/143 ,  C23C14/5826 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L2224/038 ,  H01L2224/04026 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83022 ,  H01L2224/83048 ,  H01L2224/831 ,  H01L2224/83102 ,  H01L2224/83121 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83194 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.

公开(公告)号：US20180012860A1

公开(公告)日：2018-01-11

申请号：US15712680

申请日：2017-09-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Jen Lin ,  Tsung-Ding Wang ,  Chien-Hsiun Lee ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/31 ,  H01L21/56 ,  H01L23/525

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L21/768 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0347 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/21 ,  H01L2224/27318 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/2076 ,  H01L2224/81 ,  H01L2924/01029 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2924/00

Abstract: In some embodiments, the present disclosure relates to a package assembly having a bump on a first substrate. A molding compound is on the first substrate and contacts sidewalls of the bump. A no-flow underfill layer is on a conductive region of a second substrate. The no-flow underfill layer and the conductive region contact the bump. A mask layer is arranged on the second substrate and laterally surrounds the no-flow underfill layer. The no-flow underfill layer contacts the substrate between the conductive region and the mask layer.

公开(公告)号：US09780442B2

公开(公告)日：2017-10-03

申请号：US14735199

申请日：2015-06-10

Applicant: International Business Machines Corporation

Inventor： Toyohiro Aoki ,  Noam Kaminski ,  Keishi Okamoto ,  Kazushige Toriyama

IPC: H01Q1/50 ,  H01Q1/38 ,  H01L23/00 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/56

CPC classification number: H01Q1/38 ,  H01L21/563 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/27416 ,  H01L2224/27618 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/1421 ,  H01L2924/14215 ,  H01L2924/1422 ,  H01L2924/1426 ,  H01L2924/20271 ,  H01Q1/2283 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/0665

Abstract: A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

公开(公告)号：US09773698B2

公开(公告)日：2017-09-26

申请号：US14871305

申请日：2015-09-30

Applicant: International Business Machines Corporation

Inventor： Robert L. Bruce ,  Geraud J. Dubois ,  Gregory Fritz ,  Teddie P. Magbitang ,  Hiroyuki Miyazoe ,  Willi Volksen

IPC: H01L21/02 ,  H01L21/316 ,  H01L21/768 ,  H01L21/3105 ,  H01L23/528 ,  H01L23/532 ,  C09D183/04 ,  H01L23/52

CPC classification number: H01L21/76837 ,  C09D183/04 ,  H01L21/02118 ,  H01L21/02123 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/02348 ,  H01L21/7682 ,  H01L21/76825 ,  H01L21/76828 ,  H01L21/76885 ,  H01L23/528 ,  H01L23/5329 ,  H01L2221/1047 ,  H01L2224/27416 ,  H01L2224/85447

Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids. A method may include depositing a filling material including a silicon-based resin having a molecular weight of less than about 30,000 Da and a porogen having a molecular weight greater than about 400 Da onto a structure comprising a patterned metal. The deposited filling material may be subjected to a first thermal treatment to substantially fill all gaps, and subjected to a second thermal treatment and a UV radiation treatment.

公开(公告)号：US09617451B2

公开(公告)日：2017-04-11

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro Oda ,  Daisuke Kanamori ,  Toshihisa Nonaka

IPC: C09J9/02 ,  C09D163/00 ,  C09J7/02 ,  C09J179/08 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  C08G73/10 ,  C09J163/00 ,  C08K3/00 ,  H01L23/29 ,  H05K3/32

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：US20170092534A1

公开(公告)日：2017-03-30

申请号：US14871305

申请日：2015-09-30

Applicant: International Business Machines Corporation

Inventor： Robert L. Bruce ,  Geraud J. Dubois ,  Gregory Fritz ,  Teddie P. Magbitang ,  Hiroyuki Miyazoe ,  Willi Volksen

IPC: H01L21/768 ,  H01L23/528 ,  H01L23/532 ,  H01L21/02

CPC classification number: H01L21/76837 ,  C09D183/04 ,  H01L21/02118 ,  H01L21/02123 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/02348 ,  H01L21/7682 ,  H01L21/76825 ,  H01L21/76828 ,  H01L21/76885 ,  H01L23/528 ,  H01L23/5329 ,  H01L2221/1047 ,  H01L2224/27416 ,  H01L2224/85447

Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids. A method may include depositing a filling material including a silicon-based resin having a molecular weight of less than about 30,000 Da and a porogen having a molecular weight greater than about 400 Da onto a structure comprising a patterned metal. The deposited filling material may be subjected to a first thermal treatment to substantially fill all gaps, and subjected to a second thermal treatment and a UV radiation treatment.

公开(公告)号：US20170040286A1

公开(公告)日：2017-02-09

申请号：US15297948

申请日：2016-10-19

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/78 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L24/92 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0569 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/43 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

Abstract translation: 本公开的实施例提供半导体器件，半导体封装以及半导体器件的制造方法。 半导体器件包括：半导体管芯; 形成在所述半导体管芯的表面上的电隔离层; 底物; 以及设置在电隔离层和基板之间的非导电粘合剂层，以将电隔离层粘附到基板上。

公开(公告)号：US09508594B2

公开(公告)日：2016-11-29

申请号：US14930984

申请日：2015-11-03

Applicant: International Business Machines Corporation

Inventor： Toyohiro Aoki ,  Hiroyuki Mori ,  Kazushige Toriyama

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/34 ,  H01L23/522 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L21/48 ,  B23K3/06 ,  H01L23/488 ,  H01L23/48

CPC classification number: H01L24/13 ,  B23K3/0623 ,  H01L21/4867 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/34 ,  H01L23/345 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49894 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/11013 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/11416 ,  H01L2224/1148 ,  H01L2224/11618 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/16111 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17519 ,  H01L2224/27 ,  H01L2224/27416 ,  H01L2224/27515 ,  H01L2224/27618 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/12042 ,  H01L2924/3512 ,  H01L2924/37001 ,  H01L2924/3841 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01026 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00013 ,  H01L2924/00012

Abstract: A substrate bonding method is able to reliably bond substrates while avoiding a reduction in yield made worse by finer pitches. The substrate bonding method can include: forming an adhesive resin layer on a surface of a first substrate on which a pad has been formed; forming an opening on the adhesive resin layer above the pad; filling the opening with molten solder to form a pillar-shaped solder bump; and applying heat and pressure to the first substrate and a second substrate while a terminal formed on the second substrate is aligned with the solder bump.

公开(公告)号：US20160340558A1

公开(公告)日：2016-11-24

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro ODA ,  Daisuke KANAMORI ,  Toshihisa NONAKA

IPC: C09J9/02 ,  C08G73/10 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract translation: 本发明提供一种具有优异的破裂强度的粘合剂组合物，其特征在于含有聚酰亚胺（A），多官能环氧化合物（B），环氧固化剂（C）和无机颗粒（D） ，非挥发性有机成分中的聚酰亚胺（A）的比例为3.0重量％以上且30重量％以下，非挥发性有机成分中的环氧固化剂（C）的比例为0.5重量％以上且10重量％以下 重量％以下，T / M为400以上且8000以下，其中，T为非挥发性有机成分的总克数，M为非挥发性有机成分中的环氧基的摩尔数。