公开(公告)号：US12083626B2

公开(公告)日：2024-09-10

申请号：US17950109

申请日：2022-09-22

申请人： HIRATA CORPORATION

发明人： Toshiomi Ikeda ,  Tetsunori Matsuyoshi

IPC分类号： B23K3/00 ,  B23K3/06 ,  B23K3/08

CPC分类号： B23K3/0607 ,  B23K3/0623 ,  B23K3/063 ,  B23K3/08

摘要： A solder supply unit includes a base member, a reel holder that is provided on the base member and rotatably holds a reel of a tape-like solder material, a support member provided on the base member, and a guidance member that is provided on the support member and that guides at least a lower surface of the tape-like solder material wound around the reel when the tape-like solder material is fed out.

公开(公告)号：US11963307B2

公开(公告)日：2024-04-16

申请号：US17216863

申请日：2021-03-30

申请人： International Business Machines Corporation

发明人： Matthew Doyle ,  Thomas W. Liang ,  Layne A. Berge ,  John R. Dangler ,  Jason J. Bjorgaard ,  Kyle Schoneck ,  Matthew A. Walther

IPC分类号： B23K1/00 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34 ,  B23K101/36

CPC分类号： H05K3/3478 ,  B23K1/0008 ,  B23K3/0623 ,  B23K3/08 ,  H05K3/3436 ,  B23K2101/36 ,  H05K2201/09136 ,  H05K2203/041 ,  H05K2203/082

摘要： A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

公开(公告)号：US20240009747A1

公开(公告)日：2024-01-11

申请号：US18346838

申请日：2023-07-04

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  YOSHIAKI YUKIMORI ,  GEUNSIK AHN

IPC分类号： B23K3/06

CPC分类号： B23K3/0653 ,  B23K3/0623

摘要： According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

公开(公告)号：US20230328892A1

公开(公告)日：2023-10-12

申请号：US17714837

申请日：2022-04-06

申请人： Western Digital Technologies, Inc.

发明人： John Patrick Burke ,  Ibrahym bin Ahmad ,  Fakhrozi Bin Che Ani ,  Mohamad Solehin Bin Mohamed Sunar ,  Peir Ming Sing ,  Hari kiran Raavi

IPC分类号： H05K3/12 ,  B23K1/00 ,  H05K3/34 ,  B23K3/06

CPC分类号： H05K3/1225 ,  B23K1/0008 ,  H05K3/3485 ,  H05K3/1233 ,  B23K3/0623 ,  B23K2103/12

摘要： Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

公开(公告)号：US20190252257A1

公开(公告)日：2019-08-15

申请号：US16395745

申请日：2019-04-26

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yueh-Chuan Lee ,  Chia-Chan Chen ,  Ching-Heng Liu

IPC分类号： H01L21/82 ,  H01L27/146 ,  H01L21/66 ,  H01L23/12 ,  B23K20/00 ,  H01L27/144 ,  H01L23/31 ,  B23K3/08 ,  B23K3/06 ,  B23K1/20 ,  B23K1/008 ,  B23K1/00

CPC分类号： H01L21/82 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0623 ,  B23K3/08 ,  B23K20/007 ,  B23K2101/42 ,  H01L22/14 ,  H01L22/20 ,  H01L22/32 ,  H01L23/12 ,  H01L23/3114 ,  H01L27/144 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L2224/11

摘要： A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.

公开(公告)号：US20180358323A1

公开(公告)日：2018-12-13

申请号：US15850781

申请日：2017-12-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： David M. Audette ,  Sukjay Chey ,  Dennis R. Conti ,  Marc D. Knox ,  Sankeerth Rajalingam ,  Cedric Speltz ,  Grant Wagner

IPC分类号： H01L23/00 ,  B23K3/06

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L24/11 ,  H01L2224/10

摘要： A method of pressing solder bumps using a pressing apparatus before testing a wafer, including loading the wafer into the pressing apparatus, where the wafer includes a number of chips, and the wafer is aligned with respect to a test head of the pressing apparatus. The test head includes a substrate which has pressing structures arranged across a surface of the substrate facing the wafer. The pressing structures contact the solder bumps, where the solder bumps include a first surface topology and the pressing structures include a pressing surface topology prior to the contact. The caused contact includes altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps then a second surface topology after the caused contact, and the second surface topology of the solder bumps matches the pressing surface topology after the caused contact.

公开(公告)号：US20180358322A1

公开(公告)日：2018-12-13

申请号：US15847196

申请日：2017-12-19

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： David M. Audette ,  Sukjay Chey ,  Dennis R. Conti ,  Marc D. Knox ,  Sankeerth Rajalingam ,  Cedric Speltz ,  Grant Wagner

IPC分类号： H01L23/00 ,  B23K3/06

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L24/11 ,  H01L2224/10

摘要： A method of pressing solder bumps using a pressing apparatus before testing a wafer, including loading the wafer into the pressing apparatus, where the wafer includes a number of chips, and the wafer is aligned with respect to a test head of the pressing apparatus. The test head includes a substrate which has pressing structures arranged across a surface of the substrate facing the wafer. The pressing structures contact the solder bumps, where the solder bumps include a first surface topology and the pressing structures include a pressing surface topology prior to the contact. The caused contact includes altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps then a second surface topology after the caused contact, and the second surface topology of the solder bumps matches the pressing surface topology after the caused contact.

公开(公告)号：US20180211932A1

公开(公告)日：2018-07-26

申请号：US15413605

申请日：2017-01-24

申请人： ASM Technology Singapore Pte Ltd

发明人： Shui Cheung WOO ,  Liang Hong TANG ,  Wan Yin YAU

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K3/06

CPC分类号： H01L24/75 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/75702 ,  H01L2224/75823 ,  H01L2224/759

摘要： A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.

公开(公告)号：US20180200820A1

公开(公告)日：2018-07-19

申请号：US15405740

申请日：2017-01-13

申请人： HORNG TERNG AUTOMATION CO., LTD.

发明人： Eric WANG

IPC分类号： B23K3/06 ,  H01L23/00 ,  H05K3/40

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/75755 ,  H05K3/3478 ,  H05K3/4015 ,  H05K2201/10734 ,  H05K2203/041

摘要： A guiding board for a ball placement machine has a board body. The board body has a top surface, a bottom surface, a ball-dropping area, and multiple guiding grooves. The ball-dropping area is defined on the top surface. The guiding grooves are defined in the ball-dropping area and are parallel to each other. Each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body.

公开(公告)号：US20180174949A1

公开(公告)日：2018-06-21

申请号：US15896480

申请日：2018-02-14

申请人： International Business Machines Corporation

发明人： Peter A. Gruber ,  Jae-Woong Nah

IPC分类号： H01L23/48 ,  B23K26/382 ,  B23K1/00 ,  B23K3/06 ,  B23K26/384 ,  H01L23/00 ,  B23K26/40 ,  H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  B23K103/16 ,  B23K101/42

CPC分类号： H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.