公开(公告)号：US20180200820A1

公开(公告)日：2018-07-19

申请号：US15405740

申请日：2017-01-13

申请人： HORNG TERNG AUTOMATION CO., LTD.

发明人： Eric WANG

IPC分类号： B23K3/06 ,  H01L23/00 ,  H05K3/40

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/75755 ,  H05K3/3478 ,  H05K3/4015 ,  H05K2201/10734 ,  H05K2203/041

摘要： A guiding board for a ball placement machine has a board body. The board body has a top surface, a bottom surface, a ball-dropping area, and multiple guiding grooves. The ball-dropping area is defined on the top surface. The guiding grooves are defined in the ball-dropping area and are parallel to each other. Each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body.