-
公开(公告)号：US20240363580A1
公开(公告)日：2024-10-31
申请号：US18768219
申请日：2024-07-10
CPC分类号： H01L24/75 , B23K1/0016 , B23K20/16 , H01L2224/751
摘要： A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.
-
公开(公告)号：US12128493B2
公开(公告)日：2024-10-29
申请号：US16981777
申请日：2019-02-27
发明人： Olivier Farreyrol
IPC分类号： B23K1/00 , B23K35/26 , C22C13/00 , H01R4/62 , H01R12/53 , H01R12/57 , H01R43/02 , H05B3/84 , H01Q1/12 , H01Q1/36
CPC分类号： B23K1/0008 , B23K35/262 , C22C13/00 , H01R4/625 , H01R12/53 , H01R12/57 , H01R43/02 , H05B3/84 , H01Q1/1278 , H01Q1/364 , H05B2203/016 , H05B2203/017
摘要： A method of producing a vehicle glass assembly includes (A) providing a harness including a metal wire, a connector at a terminal of the metal wire, including a flat portion made of a metal plate, and a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector; (B) providing a glass substrate layer over which a conductive layer, including an electrically conductive wire pattern and a connecting terminal, is formed; (C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a solder connection between the connector and the connecting terminal; wherein the amount of the lead-free solder is between 4 mg and 13 mg.
-
公开(公告)号：US12115603B2
公开(公告)日：2024-10-15
申请号：US18054208
申请日：2022-11-10
发明人： Maki Yonetsu , Seiichi Suenaga , Sachiko Fujisawa , Takashi Sano
IPC分类号： B23K35/30 , H05K1/03 , B23K1/00 , B23K101/40 , B23K103/00 , H01L23/15 , H05K1/09
CPC分类号： B23K35/3006 , B23K35/302 , H05K1/0306 , B23K1/0016 , B23K2101/40 , B23K2103/56 , H01L23/15 , H05K1/09 , H05K2201/0338
摘要： A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.
-
公开(公告)号：US12114435B2
公开(公告)日：2024-10-08
申请号：US17744291
申请日：2022-05-13
发明人： Virgil Zhu , Vincent Jiang , Paul Qu , Shixing Zhu , Yuanheng Zhang , Enoch He , Yonglong Liu , Lian Chen , Guangqiang Li , Jingyun Chen
IPC分类号： B23K1/00 , B23K3/00 , B23K37/04 , H05K3/34 , B23K101/42
CPC分类号： H05K3/3494 , B23K1/0016 , B23K37/04 , H05K3/341 , H05K3/3457 , B23K2101/42
摘要： A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.
-
公开(公告)号：US12109640B2
公开(公告)日：2024-10-08
申请号：US17418888
申请日：2019-12-26
发明人： Akimasa Yuasa , Takahiro Nakamura , Koji Nishimura
IPC分类号： B23K1/00 , B22F1/05 , C04B37/02 , H01L23/373 , H05K1/03 , H05K1/09 , H05K3/06 , B23K101/42 , B23K103/00 , B23K103/12
CPC分类号： B23K1/0016 , C04B37/023 , H01L23/3735 , H05K1/0306 , H05K1/09 , H05K3/06 , B22F1/05 , B23K2101/42 , B23K2103/12 , B23K2103/52 , C04B2237/125 , C04B2237/368 , C04B2237/407 , C04B2237/52 , H05K2201/0355 , H05K2203/1126
摘要： A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.
-
公开(公告)号：US12103822B2
公开(公告)日：2024-10-01
申请号：US17935664
申请日：2022-09-27
发明人： Girija Marathe , David R. Torlai
IPC分类号： B66B5/22 , B23K1/00 , B23K101/34 , B23K103/00
CPC分类号： B66B5/22 , B23K1/0008 , B23K2101/34 , B23K2103/50
摘要： A braking mechanism includes a wedge selectably engageable with a guide rail, and a frictional surface defined on the wedge configured for selective engagement with the guide rail in an overspeed condition. The frictional surface includes a friction coating of polycrystalline blocky diamond material. An elevator system includes an elevator car, a guide rail along which the elevator car travels, and a braking mechanism located at the elevator car and selectably engageable with the guide rail to slow or stop travel of the elevator car along the guide rail. The braking mechanism includes a wedge having a frictional surface configured for selective engagement with the guide rail in an overspeed condition. The frictional surface includes a friction coating of polycrystalline blocky diamond material.
-
公开(公告)号：US12097575B2
公开(公告)日：2024-09-24
申请号：US17983061
申请日：2022-11-08
申请人： ERSA GmbH
IPC分类号： B23K3/00 , B23K1/00 , B23K3/08 , H05K3/10 , B23K101/42
CPC分类号： B23K3/085 , B23K1/0016 , H05K3/10 , B23K2101/42 , H05K2203/1509 , H05K2203/1545
摘要： A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.
-
公开(公告)号：US12080671B2
公开(公告)日：2024-09-03
申请号：US18288636
申请日：2022-04-18
发明人： Naoto Kameda , Kanta Dei , Masato Tsuchiya
IPC分类号： H01L23/00 , B23K1/00 , B23K101/40 , B23K103/12 , B23K103/16 , B32B15/01
CPC分类号： H01L24/29 , B23K1/0016 , B32B15/01 , H01L24/32 , B23K2101/40 , B23K2103/12 , B23K2103/166 , H01L2224/29083 , H01L2224/29111 , H01L2224/29147 , H01L2224/29155 , H01L2224/2918 , H01L2224/29184 , H01L2224/32225
摘要： A layered bonding material 10 includes a base material 11, a first solder section 12a stacked on a first surface of the base material 11, and a second solder section 12b stacked on a second surface of the base material 11. A coefficient of linear expansion of the base material 11 is 5.5 to 15.5 ppm/K, the first solder section 12a and the second solder section 12b are made of lead-free solder, and both of a thickness of the first solder section 12a and a thickness of the second solder section 12b are 0.05 to 1.0 mm.
-
公开(公告)号：US12076805B2
公开(公告)日：2024-09-03
申请号：US17103368
申请日：2020-11-24
申请人： RAYTHEON COMPANY
发明人： Trae M. Blain , James S. Wilson
CPC分类号： B23K1/0012 , B23K1/0008 , C23C14/16 , C25D5/02 , H05K7/2039 , C25D5/50
摘要： A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.
-
公开(公告)号：US12074001B2
公开(公告)日：2024-08-27
申请号：US17310430
申请日：2020-01-31
IPC分类号： H01G9/20 , B23K1/00 , B23K101/40 , H10K30/88
CPC分类号： H01G9/2077 , B23K1/0008 , H10K30/88 , B23K2101/40
摘要： The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3′) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3′) is at least temporarily raised above its melting temperature during the existence of the pressure difference.
-
-
-
-
-
-
-
-
-
搜索结果
5593 条记录 (耗时 0.024 秒)
