公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

申请人： CORNING INCORPORATED

发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC分类号： H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US20240357739A1

公开(公告)日：2024-10-24

申请号：US18639407

申请日：2024-04-18

申请人： TOPPAN Holdings Inc.

发明人： Tomoyuki Ishii

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K1/0306 ,  H05K3/0017 ,  H05K3/4644 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09154 ,  H05K2203/0548 ,  H05K2203/1105

摘要： A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second conductive layer is smaller than the area of the first insulating layer. A region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region. A surface roughness of the second region is larger than a surface roughness of the first region.

公开(公告)号：US20240349420A1

公开(公告)日：2024-10-17

申请号：US18613894

申请日：2024-03-22

申请人： JOHNAN Corporation

发明人： Yoshinari MATSUDA ,  Kazuhiro KITAGAWA ,  Tsuyoshi NAKAMURA

IPC分类号： H05K1/02 ,  H05K1/03

CPC分类号： H05K1/028 ,  H05K1/0386

摘要： A circuit board includes a base material portion having a sheet-like shape, an electric circuit pattern portion being formed on at least one of surfaces of the base material portion and being conductive, a folding portion where a linear fold is to be formed to divide, when the circuit board is bent, each of the base material portion and the electric circuit pattern portion into a first area and a second area, and a disconnection preventing portion that prevents disconnection between the first area and the second area in the electric circuit pattern portion in a state where the circuit board is bent at the folding portion.

公开(公告)号：US20240342968A1

公开(公告)日：2024-10-17

申请号：US18632326

申请日：2024-04-11

申请人： NANJING UNIVERSITY ,  JIANGSU HHCK ADVANCED MATERIALS CO., LTD.

发明人： Wei CHEN ,  Qi XUE ,  Huijie ZHUANG ,  Linling LI ,  Jianglong HAN ,  Dongshan ZHOU ,  Xiaoliang WANG

IPC分类号： B29C45/14 ,  B29C35/16 ,  B29C45/73 ,  B29K33/00 ,  B29K81/00 ,  B29L31/34 ,  C25D11/02 ,  H05K1/02 ,  H05K1/03

CPC分类号： B29C45/14311 ,  B29C35/16 ,  C25D11/02 ,  H05K1/0237 ,  H05K1/0353 ,  B29C2035/165 ,  B29C2045/14868 ,  B29C45/73 ,  B29K2033/12 ,  B29K2081/04 ,  B29L2031/3425

摘要： A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.

公开(公告)号：US12120823B2

公开(公告)日：2024-10-15

申请号：US17787076

申请日：2020-12-18

申请人： MYANT INC.

发明人： Tony Chahine ,  Godfried Gysbrecht Edelman ,  Sahar Golmohammadi Rostami ,  Christopher Robin Leiphart

IPC分类号： D04B1/12 ,  D06N3/10 ,  H05K1/03 ,  H05K1/18 ,  H05K3/34

CPC分类号： H05K1/189 ,  D04B1/12 ,  D06N3/106 ,  H05K1/038 ,  H05K1/181 ,  H05K3/3442 ,  D06N2209/041 ,  D10B2401/16 ,  D10B2401/18 ,  D10B2403/02431 ,  H05K2201/0281 ,  H05K2203/0285

摘要： Methods for manufacturing a textile article having conductive yarn and an integrated electronic device are disclosed. An embodiment of the method includes receiving computer-readable instruction indicative of a knitting pattern of the textile article. Based on the instructions, a textile is formed by knitting conductive yarn and non-conductive yarn. A weld is applied at a junction where two or more conductive paths meet to create a bond between the two or more conductive paths.

公开(公告)号：US12114433B2

公开(公告)日：2024-10-08

申请号：US17635756

申请日：2020-05-26

申请人： FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

发明人： Hiroshi Nakano ,  Norikazu Ozaki

IPC分类号： H05K3/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/04 ,  H05K3/42

CPC分类号： H05K3/0094 ,  H01L23/49827 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/043 ,  H05K3/428

摘要： A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.

公开(公告)号：US20240334598A1

公开(公告)日：2024-10-03

申请号：US18614865

申请日：2024-03-25

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Yuki KOBAYASHI ,  Tomoo YAMASAKI

IPC分类号： H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K1/09 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/108 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2203/072 ,  H05K2203/0723

摘要： A wiring substrate includes a first wiring layer, an insulation layer covering a side surface of the first wiring layer and exposing part of the first wiring layer, and a second wiring layer formed on the first wiring layer exposed from the insulation layer. The insulation layer includes a resin and a filler. The insulation layer includes an upper surface having a structure in which the filler is exposed from the resin. The second wiring layer includes a first metal film, covering the upper surface of the insulation layer and the wiring layer exposed from the insulation layer, and a metal layer, formed above the first metal film. The first metal film is formed from a CuNiTi alloy and has a Ni content rate of 5 wt % or greater and 30 wt % or less and a Ti content rate of 5 wt % or greater and 15 wt % or less.

公开(公告)号：US12103999B2

公开(公告)日：2024-10-01

申请号：US17440499

申请日：2020-05-25

申请人： Showa Denko Materials Co., Ltd.

发明人： Akihiro Nakamura ,  Yuji Takase ,  Hayato Sawamoto ,  Yoshikazu Suzuki ,  Shuji Nomoto ,  Shota Okade

IPC分类号： C08F290/14 ,  G03F7/031 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46

CPC分类号： C08F290/144 ,  G03F7/031 ,  H01L23/145 ,  H05K1/032 ,  H05K3/4676 ,  H05K1/0373

摘要： The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

公开(公告)号：US20240324116A1

公开(公告)日：2024-09-26

申请号：US18499899

申请日：2023-11-01

申请人： Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

发明人： Hayato YAMAGUCHI ,  Masahide TAKAZAWA ,  Shinra YAMANAKA ,  Nobuhiro YAMAMOTO ,  Taichi OKANO

IPC分类号： H05K5/00 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K5/0069 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/116 ,  H05K3/0094 ,  H05K2201/10303

摘要： According to one embodiment, a storage includes a flexible printed circuit board and an electronic component. The flexible printed circuit board includes a first insulating layer, a first conductive layer on a first surface of the first insulating layer, and a second conductive layer on a second surface of the first insulating layer. The second surface is opposite the first surface. The first conductive layer is provided with a land. The second conductive layer covers the land via the first insulating layer in a first direction in which the first surface faces. The electronic component includes a pin joined to the land.

公开(公告)号：US20240324105A1

公开(公告)日：2024-09-26

申请号：US18670986

申请日：2024-05-22

申请人： KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

发明人： Kentaro IWAI ,  Akito SASAKI

IPC分类号： H05K3/00 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/0044 ,  H05K1/0306 ,  H05K3/4629

摘要： A ceramic substrate for which the yield when forming a notched portion is improved is provided. A ceramic substrate according to an embodiment includes a front surface and a back surface. A notched portion is provided at one or more locations of the ceramic substrate. The notched portion has an opening portion. At least one angle (θ3) where the ceramic substrate is present when viewed from the front surface among angles of end portions of the opening portion is greater than 90 degrees.