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公开(公告)号：US20250026951A1
公开(公告)日：2025-01-23
申请号：US18885892
申请日：2024-09-16
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Kohei SHIMOMURA , Saki SUDO
IPC: C09D163/08 , C08G59/02 , C08G59/24 , C08G59/50 , C08G59/68 , C08K3/38 , C09D5/00 , C09D7/61 , H05K1/05
Abstract: An epoxy resin composition for interlayer insulation, a resin sheet for interlayer insulation, a laminate for a circuit board, a metal-based circuit board, and a power module which realize an excellent adhered-state heat resistance and which allow for the retention of good voltage resistance at a high level are provided. An epoxy resin composition for interlayer insulation according to an embodiment of the present invention contains an epoxy resin, an epoxy-modified polybutadiene compound, and an aromatic amine compound. The epoxy-modified polybutadiene compound contains a repeating unit represented by the general formula (I), a repeating unit represented by the general formula (II), and a repeating unit represented by the general formula (III), and contains at least one of a repeating unit represented by the general formula (i), a repeating unit represented by the general formula (ii), and a repeating unit represented by the general formula (iii):
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公开(公告)号：US12207401B2
公开(公告)日：2025-01-21
申请号：US17963188
申请日：2022-10-10
Applicant: National Taipei University of Technology
Inventor： Syang-Peng Rwei , Yuan-Fu Cheng , Lih Jen Kau
Abstract: An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.
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公开(公告)号：US20250008645A1
公开(公告)日：2025-01-02
申请号：US18753385
申请日：2024-06-25
Applicant: IBIDEN CO., LTD.
Inventor： Youhong WU
Abstract: A printed wiring board includes a first resin insulating layer, a first conductor layer formed on the first insulating layer, a second resin insulating layer formed on the first conductor layer, a second conductor layer formed on the second insulating layer, and a via conductor formed in the second insulating layer such that the via conductor is connecting the first conductor layer and second conductor layer. The second conductor layer includes a seed layer formed on the second insulating layer and an electrolytic plating film on the seed layer such that the seed layer includes a first film formed in contact with the second insulating layer and a second film formed on the first film, and the seed layer in the second conductor layer is formed such that the first film includes an alloy including copper, titanium and impurities including carbon, oxygen, and silicon and the second film includes copper.
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公开(公告)号：US12137522B2
公开(公告)日：2024-11-05
申请号：US17783537
申请日：2020-12-15
Applicant: NITTO DENKO CORPORATION
Inventor： Rihito Fukushima , Shusaku Shibata , Teppei Niino
Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
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公开(公告)号：US12108529B2
公开(公告)日：2024-10-01
申请号：US17798810
申请日：2020-11-12
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura
CPC classification number: H05K1/111 , H05K1/056 , H05K2201/10083
Abstract: A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.
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公开(公告)号：US12075563B2
公开(公告)日：2024-08-27
申请号：US17783078
申请日：2020-09-24
Applicant: Sony Interactive Entertainment Inc.
Inventor： Minoru Wakabayashi , Yosuke Maki , Yuito Tsuji
CPC classification number: H05K1/0298 , H05K1/05 , H05K1/09 , H05K3/46 , H05K2201/10098
Abstract: A multilayer printed circuit board includes a plurality of conductive layers formed by a conductive material, in which a blank region with the conductive material removed is formed in at least part of at least an intermediate conductive layer that is formed inside the multilayer printed circuit board, among the plurality of conductive layers, a plurality of island regions are formed by the conductive material included in the intermediate conductive layer in the blank region, and each of the plurality of island regions is not electrically connected to other regions included in the intermediate conductive layer and is disposed so as to be dispersed from one another.
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7.发明公开
公开(公告)号：US20240284599A1
公开(公告)日：2024-08-22
申请号：US18617514
申请日：2024-03-26
Applicant: LongKai LI
Inventor： LongKai LI
CPC classification number: H05K3/0011 , H05K1/056 , H05K2201/0112 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2203/1581
Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.
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公开(公告)号：US12063750B2
公开(公告)日：2024-08-13
申请号：US17979150
申请日：2022-11-02
Applicant: Avary Holding (Shenzhen) Co., Limited. , QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
Inventor： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC: H05K1/02 , H05K1/05 , H05K1/09 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/38 , H05K3/40 , H05K3/46
CPC classification number: H05K3/246 , H05K1/095 , H05K3/067 , H05K3/4069 , H05K3/4664 , H05K3/28 , H05K2201/0347 , H05K2201/0379 , H05K2203/0514 , H05K2203/0723
Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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公开(公告)号：US20240237224A9
公开(公告)日：2024-07-11
申请号：US18231289
申请日：2023-08-08
Applicant: Samsung Display Co., LTD.
Inventor： SHINYA ONOUE , EUNJOONG MUN , HYEON DEUK HWANG , JUNGWOOK KIM , HEECHANG KIM , Kyounghee PARK , JIYUN BANG
CPC classification number: H05K3/0014 , H05K1/0274 , H05K1/056 , H05K3/125 , H05K3/1283 , H05K2201/10128
Abstract: A method of manufacturing an electronic device includes providing a mold with a first opening defined therein and including a projection portion disposed in the first opening, forming, in the first opening, a first layer including a first material through an inkjet printing method, disposing the mold on a display panel in a way such that the first opening faces the display panel, and forming a display module by removing the mold. The display module is provided with a second opening defined therein and corresponding to the projection portion.
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公开(公告)号：US12022611B2
公开(公告)日：2024-06-25
申请号：US17440528
申请日：2020-03-26
Inventor： Yasunori Hoshino , Yuki Kitai , Atsushi Wada , Masashi Koda , Mikio Sato
CPC classification number: H05K1/036 , C08J5/244 , C08J5/248 , C08J5/249 , H05K1/0373 , H05K1/056 , C08J2325/16 , H05K2201/0209
Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less.
In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
