知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

19 条记录 (耗时 0.016 秒)

    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
    1.
    发明申请
    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY 有权

    公开(公告)号：US20210407896A1

    公开(公告)日：2021-12-30

    申请号：US17470519

    申请日：2021-09-09

    申请人： CORNING INCORPORATED

    发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

    IPC分类号： H01L23/498 ,  H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/03 ,  H05K1/11 ,  H01L21/768 ,  H01L23/15 ,  C03C17/06 ,  H01L23/48 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38

    摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

    EDGE STRESS USING DIFFERENTIAL COOLING
    3.
    发明申请
    EDGE STRESS USING DIFFERENTIAL COOLING 有权

    公开(公告)号：US20220185717A1

    公开(公告)日：2022-06-16

    申请号：US17602324

    申请日：2020-03-30

    申请人： CORNING INCORPORATED

    发明人： Vikram Bhatia ,  Ah-Young Park ,  Yousef Kayed Qaroush ,  Zheming Zheng

    IPC分类号： C03B23/03 ,  B32B17/06 ,  B32B7/12 ,  C03C27/10

    摘要： A cold-formed glass laminate may include a first ply of 3D formed glass with a first thickness and a first strength. The first ply may include pre-formed residual compressive stresses in a peripheral edge portion adapted to offset tensile stresses resulting from a cold-forming process. The laminate may also include a second ply of 3D formed glass with a second thickness less than the first thickness and a second strength greater than the first strength. An adhesive may be arranged between the first ply and the second ply and post-formed residual stresses in the peripheral edge portion of the first ply of the laminate may remain compressive. A method of forming a glass laminate with compressive edge stresses is also described.

    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
    4.
    发明申请
    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY 审中-公开

    公开(公告)号：US20200165160A1

    公开(公告)日：2020-05-28

    申请号：US16776663

    申请日：2020-01-30

    申请人： CORNING INCORPORATED

    发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

    IPC分类号： C03C17/06 ,  C23C18/38 ,  H05K1/03 ,  H01L23/498 ,  H01L23/15 ,  C23C14/18 ,  H01L21/768 ,  H05K1/11 ,  C23C28/02 ,  H05K1/02 ,  C25D7/12

    摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

    Hermetic fully-filled metallized through-hole vias
    7.
    发明授权
    Hermetic fully-filled metallized through-hole vias 有权

    公开(公告)号：US11171094B2

    公开(公告)日：2021-11-09

    申请号：US16744776

    申请日：2020-01-16

    申请人： CORNING INCORPORATED

    发明人： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

    IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/15 ,  H01L21/48 ,  H01L23/498

    摘要： According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 ⁢ ⁢ micron 1 / 2 .

    COLD-FORMABILITY OF GLASS LAMINATE ARTICLE UTILIZING STRESS PREDICTION ANALYSIS AND RELATED METHODS
    8.
    发明申请
    COLD-FORMABILITY OF GLASS LAMINATE ARTICLE UTILIZING STRESS PREDICTION ANALYSIS AND RELATED METHODS 审中-公开

    公开(公告)号：US20200239351A1

    公开(公告)日：2020-07-30

    申请号：US16753972

    申请日：2018-10-05

    申请人： CORNING INCORPORATED

    发明人： Vikram Bhatia ,  Ah-Young Park ,  Yousef Kayed Qaroush ,  Neng Wang

    IPC分类号： C03B23/023 ,  B32B17/10 ,  C03C21/00

    摘要： Articles and methods related to the cold-forming of glass laminate articles utilizing stress prediction analysis are provided. A cold-forming estimator (CFE) value that is related to the stress experienced by a glass sheet of a glass laminate during cold-forming is calculated based on a plurality of geometric parameters of glass layer(s) of a glass laminate article. The calculated CFE value is compared to a cold-forming threshold related to the probability that defects are formed in the complexly curved glass laminate article during cold-forming. Cold-formed glass laminate articles are also provided having geometric parameters such that the CFE value is below the cold-forming threshold.