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    METHODS FOR MAKING ELECTRODES AND PROVIDING ELECTRICAL CONNECTIONS IN SENSORS
    2.
    发明申请
    METHODS FOR MAKING ELECTRODES AND PROVIDING ELECTRICAL CONNECTIONS IN SENSORS 审中-公开

    公开(公告)号：US20200333279A1

    公开(公告)日：2020-10-22

    申请号：US16959236

    申请日：2018-12-28

    Applicant: CORNING INCORPORATED

    Inventor： Shrisudersan Jayaraman ,  Navaneetha Krishnan Subbaiyan

    IPC: G01N27/28 ,  H01L23/498

    Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

    HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS
    5.
    发明申请
    HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS 审中-公开

    公开(公告)号：US20200251424A1

    公开(公告)日：2020-08-06

    申请号：US16744776

    申请日：2020-01-16

    Applicant: CORNING INCORPORATED

    Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

    IPC: H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48

    Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20   micron 1 / 2 .

    METHOD OF FORMING CAPPED METALLIZED VIAS
    6.
    发明申请
    METHOD OF FORMING CAPPED METALLIZED VIAS 审中-公开

    公开(公告)号：US20200185272A1

    公开(公告)日：2020-06-11

    申请号：US16681330

    申请日：2019-11-12

    Applicant: Corning Incorporated

    Inventor： Navaneetha Krishnan Subbaiyan ,  William Richard Trutna

    IPC: H01L21/768 ,  H01L21/02 ,  H01L21/20

    Abstract: A method of forming an article, including: inserting a conductive material within a via a wafer, wherein the conductive material comprises a first alloy comprising a first metal and a second metal; and contacting the conductive material with a solution comprising ions of a third metal, wherein the ions of the third metal galvanically displace a portion of the second metal from the first alloy to form a second alloy with the first metal.

    Methods for making electrodes and providing electrical connections in sensors
    7.
    发明授权
    Methods for making electrodes and providing electrical connections in sensors 有权

    公开(公告)号：US12222308B2

    公开(公告)日：2025-02-11

    申请号：US18515508

    申请日：2023-11-21

    Applicant: CORNING INCORPORATED

    Inventor： Shrisudersan Jayaraman ,  Navaneetha Krishnan Subbaiyan

    IPC: G01N27/28 ,  C03C17/06 ,  C03C17/10 ,  G01N27/36 ,  H01L23/498

    Abstract: A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

    Hermetic fully-filled metallized through-hole vias
    8.
    发明授权
    Hermetic fully-filled metallized through-hole vias 有权

    公开(公告)号：US11171094B2

    公开(公告)日：2021-11-09

    申请号：US16744776

    申请日：2020-01-16

    Applicant: CORNING INCORPORATED

    Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

    IPC: H01L23/495 ,  H01L23/00 ,  H01L23/15 ,  H01L21/48 ,  H01L23/498

    Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 ⁢ ⁢ micron 1 / 2 .

    ASSEMBLY HAVING NANOPOROUS SURFACE LAYER WITH HYDROPHOBIC LAYER
    10.
    发明申请
    ASSEMBLY HAVING NANOPOROUS SURFACE LAYER WITH HYDROPHOBIC LAYER 审中-公开

    公开(公告)号：US20200240922A1

    公开(公告)日：2020-07-30

    申请号：US16839689

    申请日：2020-04-03

    Applicant: CORNING INCORPORATED

    Inventor： Jeffrey Stapleton King ,  Navaneetha Krishnan Subbaiyan

    IPC: G01N21/77 ,  G01N21/64 ,  G01N21/47

    Abstract: A waveguide sensor system is provided. The system includes a light source and a waveguide formed from a light transmitting material. Light from the light source enters the waveguide at an input area and travels within the waveguide by total internal reflection to an analyte area and light to be analyzed travels within the waveguide from the analyte area by total internal reflection to an output area. An optical sensor is coupled to the output area and is configured to interact with the light to be analyzed. The system includes a plurality of pores located along the outer surface within the analyte area and formed in the light transmitting material of the waveguide, and the pores are configured to enhance light interaction with the analyte within the analyte area. The pores and analyte area may be protected and/or enhanced with a hydrophobic layer overlaying the pores.

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