公开(公告)号：US20220380882A1

公开(公告)日：2022-12-01

申请号：US17752958

申请日：2022-05-25

Applicant: CORNING INCORPORATED ,  Fundació Institut de Ciències Fotòniques (ICFO) ,  Institució Catalana de Recerca i Estudis Avançats

Inventor： Rinu Abraham Maniyara ,  Daniel Martínez Cercós ,  Prantik Mazumder ,  Bruno Paulillo ,  Valerio Pruneri

IPC: C23C14/08 ,  H01B5/14 ,  C23C14/35 ,  C23C14/18 ,  G01N21/31

Abstract: An article comprising: (i) a body, the body comprising a material and a transmittance greater than or equal to 90% throughout an electromagnetic radiation wavelength range of 250 nm to 800 nm; and (ii) cupric oxide (CuO) in direct contact with the material of the body, the cupric oxide (CuO) comprising a thickness that is less than or equal to 1.3 nm. Also disclosed is the article further comprising: an ultra-thin metal film disposed directly on the cupric oxide (CuO). The article demonstrates a transmittance greater than or equal to 65% throughout an electromagnetic radiation wavelength range of 300 nm to 1400 nm. The ultra-thin metal film can be silver (Ag), gold (Au), copper (Cu), or platinum (Pt). The ultra-thin metal film comprises a thickness within a range of 1 nm to 5 nm. The article at the ultra-thin metal film has a sheet resistance of less than or equal to 2100 Ω/□. Additionally, a method of forming the article.

公开(公告)号：US20220098043A1

公开(公告)日：2022-03-31

申请号：US17546488

申请日：2021-12-09

Applicant: CORNING INCORPORATED ,  Fundació Institut de Ciències Fotòniques (ICFO) ,  Institució Catalana de Recerca i Estudis Avançats

Inventor： Therese Francoise Arliguie ,  Theresa Chang ,  Miriam Marchena Martín-Francés ,  Prantik Mazumder ,  Valerio Pruneri ,  Frederic Christian Wagner

IPC: C01B32/194 ,  B05D1/00 ,  B05D3/12

Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.

公开(公告)号：US11171094B2

公开(公告)日：2021-11-09

申请号：US16744776

申请日：2020-01-16

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/15 ,  H01L21/48 ,  H01L23/498

Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 ⁢ ⁢ micron 1 / 2 .

公开(公告)号：US20210210359A1

公开(公告)日：2021-07-08

申请号：US17123576

申请日：2020-12-16

Applicant: CORNING INCORPORATED

Inventor： Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprising: forming a first layer of a first metal on a glass substrate, the glass substrate comprising silicon dioxide and aluminum oxide; subjecting the glass substrate with the first layer of the first metal to a first thermal treatment; forming a second layer of a second metal over the first layer of the first metal; and subjecting the second layer of the second metal to a second thermal treatment, the first thermal treatment and the second thermal treatment inducing intermixing of the first metal, the second metal, and at least one of aluminum, aluminum oxide, silicon, and silicon dioxide of the glass substrate to form a metallic region comprising the first metal, the second metal, aluminum oxide, and silicon dioxide. The first metal can be silver. The second metal can be copper.

公开(公告)号：US10564157B2

公开(公告)日：2020-02-18

申请号：US15905011

申请日：2018-02-26

Applicant: Corning Incorporated

Inventor： Jeffrey Stapleton King ,  Prantik Mazumder ,  Elaine Victoria Seraya

IPC: G01N33/552 ,  G01N33/543 ,  G01N33/549

Abstract: An analyte capture device and related systems and methods are provided. The analyte capture device includes a glass material, an outer surface defined by the glass material, and a plurality of pores formed in the glass material along at least a portion of the outer surface. The analyte capture device is exposed to an environment containing an analyte for a period of time such that the analyte is captured within the plurality of pores of the glass material. The concentration of the analyte within the glass material is greater than a concentration of the analyte within the environment. The analyte capture device is then removed from the environment, and a property of the analyte within the analyte capture device is detected via an analyte detection system.

公开(公告)号：US20200039872A1

公开(公告)日：2020-02-06

申请号：US15739321

申请日：2016-06-22

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Robert George Manley ,  Prantik Mazumder

IPC: C03C15/02 ,  B32B17/10 ,  C03C17/32 ,  C03C27/10

Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.

公开(公告)号：US20180297324A1

公开(公告)日：2018-10-18

申请号：US15921034

申请日：2018-03-14

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B17/06 ,  C03C27/10 ,  C03C27/06 ,  C03C23/00 ,  C03C17/22 ,  B32B7/02 ,  B32B37/26

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US20180246091A1

公开(公告)日：2018-08-30

申请号：US15905011

申请日：2018-02-26

Applicant: Corning Incorporated

Inventor： Jeffrey Stapleton King ,  Prantik Mazumder ,  Elaine Victoria Seraya

IPC: G01N33/552 ,  G01N33/543

Abstract: An analyte capture device and related systems and methods are provided. The analyte capture device includes a glass material, an outer surface defined by the glass material, and a plurality of pores formed in the glass material along at least a portion of the outer surface. The analyte capture device is exposed to an environment containing an analyte for a period of time such that the analyte is captured within the plurality of pores of the glass material. The concentration of the analyte within the glass material is greater than a concentration of the analyte within the environment. The analyte capture device is then removed from the environment, and a property of the analyte within the analyte capture device is detected via an analyte detection system.

公开(公告)号：US09586858B2

公开(公告)日：2017-03-07

申请号：US14053139

申请日：2013-10-14

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shandon Dee Hart ,  Robert George Manley ,  Prantik Mazumder ,  Charles Andrew Paulson ,  Chandan Kumar Saha

IPC: C03C17/34 ,  C03C17/36 ,  G06F3/03 ,  C03C17/42 ,  C03C17/38 ,  C03C21/00

CPC classification number: C03C17/34 ,  C03C17/3417 ,  C03C17/3435 ,  C03C17/36 ,  C03C17/38 ,  C03C17/42 ,  C03C21/002 ,  C03C2217/425 ,  C03C2217/948 ,  G06F3/03 ,  Y10T428/24851 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/24983 ,  Y10T428/24996 ,  Y10T428/24999

Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. In one or more embodiments, interface exhibits the effective adhesion energy is about less than about 4 J/m2. In some embodiments, the interface is modified by the inclusion of a crack mitigating layer between the glass substrate and the film.

Abstract translation: 本公开的一个或多个方面涉及一种包括设置在玻璃基板上的膜的制品，其可以被加强，其中膜和玻璃基板之间的界面被改性，使得制品具有改善的平均弯曲强度，以及 该片保留了其应用的关键功能特性。 膜的一些关键功能特性包括光学，电学和/或机械性质。 在一个或多个实施方案中，界面表现出约小于约4J / m 2的有效粘附能。 在一些实施方案中，通过在玻璃基底和膜之间包含裂纹缓解层来修饰界面。

公开(公告)号：US20160176162A1

公开(公告)日：2016-06-23

申请号：US14968264

申请日：2015-12-14

Applicant: CORNING INCORPORATED

Inventor： Benedict Yorke Johnson ,  Prantik Mazumder ,  Kamal Kishore Soni

IPC: B32B17/06 ,  B32B38/00 ,  B32B37/00 ,  B32B37/18 ,  B32B9/00 ,  B32B18/00

CPC classification number: B32B17/06 ,  B32B9/007 ,  B32B18/00 ,  B32B37/025 ,  B32B37/18 ,  B32B38/00 ,  B32B2250/02 ,  B32B2313/04 ,  B32B2315/02 ,  B32B2315/08 ,  C01B32/194 ,  C04B2237/52 ,  C04B2237/86 ,  C23F1/18

Abstract: Described herein are methods for improved transfer of graphene from formation substrates to target substrates. In particular, the methods described herein are useful in the transfer of high-quality chemical vapor deposition-grown monolayers of graphene from metal, e.g., copper, formation substrates via non-polymeric methods. The improved processes provide graphene materials with less defects in the structure.

Abstract translation: 这里描述的是用于改善石墨烯从地层衬底转移到目标衬底的方法。 特别地，本文描述的方法可用于通过非聚合方法从金属例如铜，地层衬底转移高质量化学气相沉积生长的石墨烯单层。 改进的工艺为石墨烯材料提供了较少的结构缺陷。