公开(公告)号：US20240365672A1

公开(公告)日：2024-10-31

申请号：US18428711

申请日：2024-01-31

申请人： Elastimed Ltd.

发明人： Omer Zelka

IPC分类号： H10N30/88 ,  B29C55/02 ,  B29C65/00 ,  B29C65/48 ,  B29L31/34 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  H10N30/06 ,  H10N30/098 ,  H10N30/80 ,  H10N30/857 ,  H10N30/87

CPC分类号： H10N30/886 ,  B29C55/02 ,  B29C65/48 ,  B29C66/022 ,  B29C66/45 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12 ,  B32B37/182 ,  B32B38/0012 ,  H10N30/06 ,  H10N30/098 ,  H10N30/802 ,  H10N30/857 ,  H10N30/87 ,  B29K2995/0005 ,  B29K2995/0046 ,  B29L2031/3406 ,  B32B2038/0028 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/51 ,  B32B2457/00

摘要： A structure including an electro-active-polymer (“EAP”). The structure can take the form of a strap, which includes two or more EAP film layers. The structure can further include one or more holders or end-grabbing portions. Methods of making and using the EAP structure are also envisioned.

公开(公告)号：US12127648B2

公开(公告)日：2024-10-29

申请号：US17271187

申请日：2020-10-20

申请人： Shenzhen Romoss Technology Co., LTD

发明人： Guibin Lei ,  Bin Yao ,  Shuilin Lai

IPC分类号： A45C11/00 ,  B29C63/00 ,  B29C63/02 ,  B29L31/34

CPC分类号： A45C11/00 ,  B29C63/0004 ,  B29C63/02 ,  A45C2011/002 ,  A45C2011/003 ,  B29K2911/08 ,  B29L2031/34

摘要： The present application relates to a protective leather case and a positioning device for protecting a smart terminal. The protective leather case includes a leather layer; an adhesive layer; and a positioning release film including a first release film and a second release film. The leather layer, the adhesive layer and the positioning release film are laminated sequentially. The first release film is provided in a first direction. At least two second release films are provided, and are arranged on both sides of the first release film in a second direction perpendicular to the first direction. The protective leather case can be used to facilitate accurate positioning and lamination between the protective leather case and the smart terminal.

公开(公告)号：US20240351274A1

公开(公告)日：2024-10-24

申请号：US18751092

申请日：2024-06-21

申请人： Hewlett-Packard Development Company, L.P.

发明人： Jarrid A. Wittkopf ,  Kristopher J. Erickson ,  Lihua Zhao

IPC分类号： B29C64/165 ,  B29C35/08 ,  B29C70/88 ,  B29K105/16 ,  B29K505/00 ,  B29L31/34 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/065

CPC分类号： B29C64/165 ,  B29C70/882 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/06526 ,  B29C2035/0827 ,  B29C2795/005 ,  B29K2105/162 ,  B29K2505/00 ,  B29K2995/0005 ,  B29K2995/0006 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3487

摘要： In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.

公开(公告)号：US12122863B2

公开(公告)日：2024-10-22

申请号：US16061512

申请日：2017-01-17

申请人： DAIKIN INDUSTRIES, LTD.

发明人： Shingo Sakakibara ,  Jihong Liu ,  Yoshiyuki Takase ,  Ryouichi Fukagawa ,  Yosuke Shojima ,  Yukari Karasawa ,  Takeshi Shimono

IPC分类号： C08F214/28 ,  B29C48/06 ,  B29C48/154 ,  H01B13/14 ,  B29L31/34

CPC分类号： C08F214/282 ,  B29C48/06 ,  B29C48/154 ,  H01B13/147 ,  B29L2031/3406

摘要： The invention provides novel pellets having high fluidity in a hopper of an extruder and capable of forming a coating layer having good wire diameter stability and capacitance stability even when used for rapid molding of electric wire coating. The pellets contain a fluororesin. Each of the pellets, placed on a horizontal surface, has a substantially circular outline or a substantially elliptic outline and has a major axis D1 of 3.1 mm or shorter and a minor axis D2 of 3.1 mm or shorter when observed in the direction normal to the horizontal surface. Each pellet satisfies the following formula (1): (D1+D2)/2L=1.8 to 2.6, wherein D1 represents the major axis, D2 represents the minor axis, and L represents the height from the horizontal surface to the highest point of the pellet.

公开(公告)号：US12122078B2

公开(公告)日：2024-10-22

申请号：US17766550

申请日：2020-07-29

申请人： NISSHA CO., LTD.

发明人： Seiichi Yamazaki ,  Toshihiro Higashikawa ,  Hitoshi Hirai

IPC分类号： H05K1/02 ,  B29C45/14 ,  H05K3/00 ,  B29L31/34

CPC分类号： B29C45/14639 ,  B29C45/14008 ,  B29C45/1418 ,  B29C45/14819 ,  H05K1/028 ,  H05K3/0014 ,  B29C2045/14245 ,  B29L2031/3425 ,  H05K2201/09118 ,  H05K2203/1305

摘要： Object
There is provided a molded article or an electrical product in which layout of a member up to an external connection terminal for electrical connection of a circuit film integrally molded with the molded body is easy.
Solution means
A molded body 30 includes one main surface 31 with which a circuit film 20 is integrally molded, and another main surface 32 facing the one main surface 31. A flexible printed wiring board 40 includes an internal connection terminal 41 electrically connected to an electrical circuit of the circuit film 20, an external connection terminal 42 exposed outside from the other main surface 32 of the molded body 30, and a flexible wiring line 43 connected to the inner connection terminal 41 and the external connection terminal 42, passing through an inside of the molded body 30, and extending so as to reach the other main surface 32.

公开(公告)号：US12096562B2

公开(公告)日：2024-09-17

申请号：US18644647

申请日：2024-04-24

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC分类号： H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC分类号： H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

摘要： An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US12088007B2

公开(公告)日：2024-09-10

申请号：US17168715

申请日：2021-02-05

申请人： L'Garde, Inc.

发明人： Arthur Libornio Palisoc ,  Linden Bolisay

IPC分类号： H01Q15/14 ,  B29C70/30 ,  B29C70/54 ,  B29K307/04 ,  B29L31/34 ,  H01Q15/16

CPC分类号： H01Q15/141 ,  B29C70/30 ,  B29C70/545 ,  H01Q15/163 ,  B29K2307/04 ,  B29L2031/3456

摘要： Exemplary embodiments are described herein for compactable antennas and methods of making such an antenna. Exemplary compactable antennas include a support structure and a reflector surface. The support structure may directly or indirectly define the reflector shape. Exemplary embodiments comprise deployable support structures to permit the compactable antenna to have a smaller volume stowed configuration and a larger volume deployed configuration.

公开(公告)号：US20240286321A1

公开(公告)日：2024-08-29

申请号：US18417333

申请日：2024-01-19

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki IGUCHI ,  Toshio SHIOBARA ,  Tsutomu KASHIWAGI

IPC分类号： B29C43/02 ,  B29C43/00 ,  B29K79/00 ,  B29K509/00 ,  B29L31/34 ,  H01B1/22

CPC分类号： B29C43/021 ,  B29C43/003 ,  H01B1/22 ,  B29K2079/08 ,  B29K2509/00 ,  B29K2883/00 ,  B29L2031/3475

摘要： An anisotropic electro-conductive film having high reliability, which electrically connects circuit electrodes having a fine pattern. The anisotropic film contains an insulating resin and particle groups. The particle groups are groups of particles in which a plurality of particles are bound together with a binder. The particle groups are regularly arranged with an interval of 1 μm to 1,000 μm.

公开(公告)号：US20240278464A1

公开(公告)日：2024-08-22

申请号：US18439090

申请日：2024-02-12

申请人： Continental Automotive Technologies GmbH

发明人： Hervé Contet ,  Martin Throm ,  Marco Benner

IPC分类号： B29C45/14 ,  B29L31/34 ,  G01D11/24 ,  G01D11/30

CPC分类号： B29C45/14639 ,  G01D11/245 ,  G01D11/30 ,  B29L2031/3406

摘要： A method for manufacturing a sensor for a motor vehicle. The method includes the steps of placing leads on a support, positioning a mold, injecting overmolding material into the mold so as to obtain a sealing housing comprising a body and a hatch, the hatch being formed adjacently to the belt in the plane of the lower face of the body by being connected to the joining lateral face by at least one portion of overmolding material, called “connecting portion”, removing the mold, applying a force to the hatch in order to insert it by sliding and close the lower face of the sealing housing, filling the internal space of the sealing housing with a sealing gel in order to seal the leads, and externally overmolding the entire sensor.

公开(公告)号：US20240264202A1

公开(公告)日：2024-08-08

申请号：US18291099

申请日：2022-07-19

申请人： EGSTON SYSTEM ELECTRONICS EGGENBURG GMBH

发明人： Roman Jamy ,  Ernst Prand-Stritzko ,  Daniel Erdösi ,  Martin Högenauer

IPC分类号： G01R15/18 ,  B29C39/00 ,  B29C39/10 ,  B29K63/00 ,  B29K75/00 ,  B29K105/16 ,  B29K507/04 ,  B29K509/02 ,  B29L31/34

CPC分类号： G01R15/181 ,  B29C39/003 ,  B29C39/10 ,  B29K2063/00 ,  B29K2075/00 ,  B29K2105/16 ,  B29K2507/04 ,  B29K2509/02 ,  B29K2995/0007 ,  B29L2031/3481

摘要： In a current sensor coil assembly (1) comprising at least one sensor air coil (2), which sensor air coil (2) is designed as a Rogowski coil (3), wherein the current sensor coil assembly (1) has a housing (4), which housing (4) comprises the Rogowski coil (3), it is proposed that the Rogowski coil (3) is embedded in a potting compound (5), that the potting compound (5) comprises at least one first material and one second material, that the first material is an electrical insulating material, in that the second material comprises particles having predeterminable electrical conductivity, and that the potting compound (5) has a specific electric resistance between 10 Ω·cm and 6000 Ω·cm, in particular between 500 Ω·cm and 5000 Ω·cm, preferably between 2000 Ω·cm and 3000 Ω·cm.