知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.02 秒)

    Integrated optically functional multilayer structure and related method of manufacture
    3.
    发明授权
    Integrated optically functional multilayer structure and related method of manufacture 有权

    公开(公告)号：US11385399B1

    公开(公告)日：2022-07-12

    申请号：US17704393

    申请日：2022-03-25

    申请人： TactoTek Oy

    发明人： Vinski Bräysy ,  Jarmo Sääski ,  Mikko Heikkinen ,  Ilpo Hänninen ,  Pasi Korhonen ,  Giovanni Ferri

    IPC分类号： F21V8/00

    摘要： An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.

    Optically functional multilayer structure and related method of manufacture
    6.
    发明授权
    Optically functional multilayer structure and related method of manufacture 有权

    公开(公告)号：US12095016B1

    公开(公告)日：2024-09-17

    申请号：US18398773

    申请日：2023-12-28

    申请人： TactoTek Oy

    发明人： Miikka Kärnä ,  Ilpo Hänninen ,  Samuli Yrjänä ,  Simo Koivikko

    IPC分类号： H01L33/60 ,  H01L25/075 ,  H01L33/48 ,  H10K50/842 ,  H10K50/856

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/483 ,  H10K50/842 ,  H10K50/856 ,  H01L2933/0058

    摘要： An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.

    Method for manufacturing electronics assembly
    7.
    发明授权
    Method for manufacturing electronics assembly 有权

    公开(公告)号：US11950367B2

    公开(公告)日：2024-04-02

    申请号：US18353143

    申请日：2023-07-17

    申请人： TactoTek Oy

    发明人： Vinski Bräysy ,  Ilpo Hänninen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Topi Wuori ,  Mikko Sippari ,  Heikki Alamäki

    IPC分类号： H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

    CPC分类号： H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

    摘要： A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

    Multilayer structure and method of manufacturing such
    9.
    发明授权
    Multilayer structure and method of manufacturing such 有权

    公开(公告)号：US11461609B1

    公开(公告)日：2022-10-04

    申请号：US17704181

    申请日：2022-03-25

    申请人： TactoTek Oy

    发明人： Vinski Bräysy ,  Mikko Heikkinen ,  Mikko Sippari ,  Pälvi Apilo ,  Ilpo Hänninen ,  Samuli Yrjänä ,  Pasi Korhonen ,  Taneli Salmi

    IPC分类号： G06K19/02 ,  G06K19/077

    摘要： The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.