公开(公告)号：US11817534B1

公开(公告)日：2023-11-14

申请号：US17856958

申请日：2022-07-02

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US12096562B2

公开(公告)日：2024-09-17

申请号：US18644647

申请日：2024-04-24

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC: H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC classification number: H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US11914184B2

公开(公告)日：2024-02-27

申请号：US18339467

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: F21V8/00 ,  G02B5/08

CPC classification number: G02B6/0031 ,  G02B6/004 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US12130005B2

公开(公告)日：2024-10-29

申请号：US18339427

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: F21V7/28 ,  F21V7/00 ,  H05K1/02 ,  H05K1/18 ,  F21V7/10 ,  F21V8/00

CPC classification number: F21V7/00

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US11910530B2

公开(公告)日：2024-02-20

申请号：US17704264

申请日：2022-03-25

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Ilpo Hänninen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Topi Wuori ,  Mikko Sippari ,  Heikki Alamäki

IPC: H05K3/32 ,  H05K1/18 ,  H05K1/11 ,  H05K3/12 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US12159965B2

公开(公告)日：2024-12-03

申请号：US18476676

申请日：2023-09-28

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US12004299B1

公开(公告)日：2024-06-04

申请号：US18104479

申请日：2023-02-01

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC: H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC classification number: H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US11703627B1

公开(公告)日：2023-07-18

申请号：US17945247

申请日：2022-09-15

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: F21V8/00 ,  G02B5/08

CPC classification number: G02B6/0031 ,  G02B6/004 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US12232267B2

公开(公告)日：2025-02-18

申请号：US18609232

申请日：2024-03-19

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Ilpo Hänninen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Topi Wuori ,  Mikko Sippari ,  Heikki Alamäki

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32

Abstract: An electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The electronics assembly further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US12137523B1

公开(公告)日：2024-11-05

申请号：US18775176

申请日：2024-07-17

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC: H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.