公开(公告)号：US12130005B2

公开(公告)日：2024-10-29

申请号：US18339427

申请日：2023-06-22

申请人： TactoTek Oy

发明人： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC分类号： F21V7/28 ,  F21V7/00 ,  H05K1/02 ,  H05K1/18 ,  F21V7/10 ,  F21V8/00

CPC分类号： F21V7/00

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US10575407B2

公开(公告)日：2020-02-25

申请号：US16018127

申请日：2018-06-26

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC分类号： H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  B29C45/14 ,  B29L31/34

摘要： A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

公开(公告)号：US10485094B1

公开(公告)日：2019-11-19

申请号：US16113198

申请日：2018-08-27

申请人： TactoTek Oy

发明人： Anne Isohätälä ,  Hasse Sinivaara ,  Heikki Tuovinen ,  Ville Wallenius ,  Vinski Bräysy ,  Tomi Simula ,  Mikko Heikkinen ,  Minna Pirkonen ,  Tuukka Junkkari ,  Jarmo Sääski ,  Janne Asikkala ,  Antti Keränen

IPC分类号： G01R27/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/16 ,  G06F3/044

摘要： Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

公开(公告)号：US20160209251A1

公开(公告)日：2016-07-21

申请号：US15082059

申请日：2016-03-28

申请人： TactoTek Oy

发明人： Antti Keränen ,  Mikko Heikkinen

IPC分类号： G01D11/28 ,  F21V23/04 ,  F21K99/00

CPC分类号： G01D11/28 ,  F21K9/60 ,  F21V23/04 ,  H01H13/83 ,  H01H2219/028 ,  H01H2219/039 ,  H01H2219/056 ,  H01H2219/06

摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

公开(公告)号：US12096562B2

公开(公告)日：2024-09-17

申请号：US18644647

申请日：2024-04-24

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC分类号： H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC分类号： H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

摘要： An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US11914184B2

公开(公告)日：2024-02-27

申请号：US18339467

申请日：2023-06-22

申请人： TactoTek Oy

发明人： Antti Keränen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC分类号： F21V8/00 ,  G02B5/08

CPC分类号： G02B6/0031 ,  G02B6/004 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B5/0883

摘要： An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US11357111B2

公开(公告)日：2022-06-07

申请号：US16113388

申请日：2018-08-27

申请人： TactoTek Oy

发明人： Janne Asikkala ,  Tomi Simula ,  Antti Keränen

IPC分类号： H05K3/46 ,  H01L23/485 ,  H01L23/498 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/10 ,  H01R13/405 ,  H05K1/02

摘要： A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.

公开(公告)号：US11166364B2

公开(公告)日：2021-11-02

申请号：US16833744

申请日：2020-03-30

申请人： TACTOTEK OY

发明人： Antti Keränen ,  Tomi Simula ,  Mikko Heikkinen ,  Jarmo Sääski ,  Pasi Raappana ,  Minna Pirkonen

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K5/06

摘要： An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

公开(公告)号：US11166363B2

公开(公告)日：2021-11-02

申请号：US16245643

申请日：2019-01-11

申请人： TACTOTEK OY

发明人： Antti Keränen ,  Tomi Simula ,  Mikko Heikkinen ,  Jarmo Sääski ,  Pasi Raappana ,  Minna Pirkonen

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K5/06 ,  H05K3/28

摘要： An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

公开(公告)号：US20210243898A1

公开(公告)日：2021-08-05

申请号：US17215001

申请日：2021-03-29

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC分类号： H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03

摘要： A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.