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公开(公告)号：US11528802B2
公开(公告)日：2022-12-13
申请号：US16724631
申请日：2019-12-23
申请人： TACTOTEK OY
发明人： Tapio Rautio , Tomi Simula , Minna Pirkonen , Jarkko Torvinen , Tuukka Junkkari , Janne Asikkala , Hasse Sinivaara
IPC分类号： H05K1/02
摘要： A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
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公开(公告)号：US11166364B2
公开(公告)日：2021-11-02
申请号：US16833744
申请日：2020-03-30
申请人： TACTOTEK OY
发明人： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
摘要： An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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公开(公告)号：US11166363B2
公开(公告)日：2021-11-02
申请号：US16245643
申请日：2019-01-11
申请人： TACTOTEK OY
发明人： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
摘要： An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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4.发明授权公开(公告)号：US10485094B1
公开(公告)日：2019-11-19
申请号：US16113198
申请日：2018-08-27
申请人： TactoTek Oy
发明人： Anne Isohätälä , Hasse Sinivaara , Heikki Tuovinen , Ville Wallenius , Vinski Bräysy , Tomi Simula , Mikko Heikkinen , Minna Pirkonen , Tuukka Junkkari , Jarmo Sääski , Janne Asikkala , Antti Keränen
摘要： Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.
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公开(公告)号：US10225932B1
公开(公告)日：2019-03-05
申请号：US16113555
申请日：2018-08-27
申请人： TactoTek Oy
发明人： Tomi Simula , Vinski Bräysy , Mikko Heikkinen , Juha-Matti Hintikka , Minna Pirkonen , Pasi Raappana , Tuomas Heikkilä , Jarmo Sääski , Juhani Harvela
摘要： Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.
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公开(公告)号：US10194526B1
公开(公告)日：2019-01-29
申请号：US16113467
申请日：2018-08-27
申请人： TactoTek Oy
发明人： Tomi Simula , Vinski Bräysy , Mikko Heikkinen , Juha-Matti Hintikka , Juhani Harvela , Minna Pirkonen , Pasi Raappana , Tuomas Heikkilä , Jarmo Sääski
摘要： An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.
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公开(公告)号：US20210195731A1
公开(公告)日：2021-06-24
申请号：US16724631
申请日：2019-12-23
申请人： TACTOTEK OY
发明人： Tapio RAUTIO , Tomi Simula , Minna Pirkonen , Jarkko Torvinen , Tuukka Junkkari , Janne Asikkala , Hasse Sinivaara
IPC分类号： H05K1/02
摘要： A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
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公开(公告)号：US10645796B1
公开(公告)日：2020-05-05
申请号：US16245643
申请日：2019-01-11
申请人： TACTOTEK OY
发明人： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
摘要： An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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公开(公告)号：US10285261B1
公开(公告)日：2019-05-07
申请号：US16202145
申请日：2018-11-28
申请人： TactoTek Oy
发明人： Tomi Simula , Vinski Bräysy , Mikko Heikkinen , Juha-Matti Hintikka , Juhani Harvela , Minna Pirkonen , Pasi Raappana , Tuomas Heikkilä , Jarmo Sääski
摘要： An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.
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