公开(公告)号：US20240349420A1

公开(公告)日：2024-10-17

申请号：US18613894

申请日：2024-03-22

申请人： JOHNAN Corporation

发明人： Yoshinari MATSUDA ,  Kazuhiro KITAGAWA ,  Tsuyoshi NAKAMURA

IPC分类号： H05K1/02 ,  H05K1/03

CPC分类号： H05K1/028 ,  H05K1/0386

摘要： A circuit board includes a base material portion having a sheet-like shape, an electric circuit pattern portion being formed on at least one of surfaces of the base material portion and being conductive, a folding portion where a linear fold is to be formed to divide, when the circuit board is bent, each of the base material portion and the electric circuit pattern portion into a first area and a second area, and a disconnection preventing portion that prevents disconnection between the first area and the second area in the electric circuit pattern portion in a state where the circuit board is bent at the folding portion.

公开(公告)号：US20240188219A1

公开(公告)日：2024-06-06

申请号：US18285860

申请日：2022-03-23

申请人： JOHNAN Corporation

发明人： Yoshinari MATSUDA ,  Takamitsu OKA ,  Kazuhiro KITAGAWA ,  Yuuichi HIGASHIDANI ,  Hidetoshi ARASUNA

IPC分类号： H05K1/18 ,  H05K3/12 ,  H05K3/32

CPC分类号： H05K1/181 ,  H05K3/1283 ,  H05K3/321 ,  H05K2201/10886

摘要： One or more embodiments may include a method for mounting an electronic component to fix an electronic component including an electrode to a circuit board. The method includes applying a first conductive adhesive on a pattern; fixing the electronic component on the circuit board by the first conductive adhesive; applying a second conductive adhesive so as to cover the pattern and at least a half part, on a circuit board side, of each side surface of the electrode; and curing the first conductive adhesive by heating after the fixing and furthermore curing the second conductive adhesive by heating after applying the second conductive adhesive, or curing the first conductive adhesive and the second conductive adhesive by heating after applying the second conductive adhesive.