公开(公告)号：US20240188219A1

公开(公告)日：2024-06-06

申请号：US18285860

申请日：2022-03-23

Applicant: JOHNAN Corporation

Inventor： Yoshinari MATSUDA ,  Takamitsu OKA ,  Kazuhiro KITAGAWA ,  Yuuichi HIGASHIDANI ,  Hidetoshi ARASUNA

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K3/1283 ,  H05K3/321 ,  H05K2201/10886

Abstract: One or more embodiments may include a method for mounting an electronic component to fix an electronic component including an electrode to a circuit board. The method includes applying a first conductive adhesive on a pattern; fixing the electronic component on the circuit board by the first conductive adhesive; applying a second conductive adhesive so as to cover the pattern and at least a half part, on a circuit board side, of each side surface of the electrode; and curing the first conductive adhesive by heating after the fixing and furthermore curing the second conductive adhesive by heating after applying the second conductive adhesive, or curing the first conductive adhesive and the second conductive adhesive by heating after applying the second conductive adhesive.