公开(公告)号：US20240365523A1

公开(公告)日：2024-10-31

申请号：US18566466

申请日：2022-04-28

申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

发明人： Sei UEMURA ,  Takashi NAKAMURA ,  Masateru NISHIOKA ,  Naoko UENO

IPC分类号： H05K13/04 ,  H05B6/74 ,  H05B6/80 ,  H05K3/34 ,  H05K9/00

CPC分类号： H05K13/0465 ,  H05B6/74 ,  H05B6/80 ,  H05K3/3494 ,  H05K9/0028 ,  H05K2203/101

摘要： A method of mounting electronic devices, including the steps of:



irradiating with microwaves a board for mounting electronic devices including a base, a plurality of solder parts on the base, and a plurality of electronic devices corresponding to the plurality of solder parts placed in contact with the plurality of solder parts, the microwave irradiation is performed in a state in which electromagnetic shielding is performed for some of the plurality of solder parts; and
heating and melting at least the solder parts for which the electromagnetic shielding is not performed by an action of a magnetic field of a standing wave formed by the microwave irradiation.

公开(公告)号：US12035483B2

公开(公告)日：2024-07-09

申请号：US16839798

申请日：2020-04-03

申请人： DELL PRODUCTS L.P.

发明人： Subramanian Vasudevan ,  Edward Rhem ,  Philip Conde ,  Wallace Ables ,  Edwin C. Tinsley

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K35/26 ,  B23K101/42

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3489 ,  B23K2101/42

摘要： Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

公开(公告)号：US20240090130A1

公开(公告)日：2024-03-14

申请号：US17931651

申请日：2022-09-13

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Chad CHEN ,  Jiahui LIU ,  Wuxing XIA ,  Jingyan LIU

IPC分类号： H05K1/18 ,  H01L23/495 ,  H05K3/34

CPC分类号： H05K1/18 ,  H01L23/49555 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10946

摘要： A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.

公开(公告)号：US20240030575A1

公开(公告)日：2024-01-25

申请号：US18478858

申请日：2023-09-29

申请人： ALLEN-VANGUARD CORPORATION

发明人： Sulav ADHIKARI ,  Ernst WALLISCH, JR.

IPC分类号： H01P1/213 ,  H01P1/207 ,  H01P3/12 ,  H04W88/08 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P1/208 ,  H01P11/00

CPC分类号： H01P1/2138 ,  H01P1/207 ,  H01P3/121 ,  H04W88/08 ,  H05K1/115 ,  H05K1/18 ,  H05K3/3494 ,  H01P1/2088 ,  H01P11/007 ,  H05K2201/09985 ,  H05K2201/015 ,  H05K2201/037 ,  H05K2201/09609

摘要： System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

公开(公告)号：US20230373023A1

公开(公告)日：2023-11-23

申请号：US18030387

申请日：2021-10-05

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

发明人： Rob Jacob HENDRIKS

IPC分类号： B23K3/047 ,  H05K3/34 ,  B23K1/00

CPC分类号： B23K3/0478 ,  H05K3/3494 ,  B23K1/0016 ,  H01L2224/83815 ,  H01L24/83

摘要： An apparatus is described for carrying out controlled local heating a target surface of a substrate provided with a heat sensitive material to change a state of the heat sensitive material. The apparatus includes a carrier having a carrier surface for carrying the substrate at a carried surface opposite the target surface. The carrier has a plurality of laterally distributed heating zones that are thermally insulated from each other by slits that are in communication with an evacuation channel. The respective heating zones include respective resistive heating elements and are thermally coupled to a heat sink. The apparatus further includes a controller configured to control a selective supply of electric energy to at least one of the respective resistive heating elements of at least one of the plurality of laterally distributed heating zones.

公开(公告)号：US11770899B2

公开(公告)日：2023-09-26

申请号：US17431653

申请日：2020-02-25

申请人： SAFRAN ELECTRONICS & DEFENSE

发明人： Philippe Chocteau ,  Denis Lecordier

IPC分类号： H05K1/18 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K1/181 ,  H05K1/183 ,  H05K1/184 ,  H05K3/3494 ,  H05K3/4697

摘要： An electronic circuit board includes a printed circuit board and first and second electronic components. The printed circuit board includes a first insulating layer, a second insulating layer attached to the first insulating layer and in which is formed an open cavity, and a second conductive layer attached to the second insulating layer. The second conductive layer is treated to form a surface solder pad. The first electronic component is housed in the open cavity of the second insulating layer. The second electronic component is placed on the second insulating layer without overlapping with the open cavity. The first electronic component and the second electronic component each include a termination soldered on the surface solder pad, the surface solder pad being shared by the first and second electronic components.

公开(公告)号：US11765837B2

公开(公告)日：2023-09-19

申请号：US17504812

申请日：2021-10-19

申请人： Jabil Inc.

发明人： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC分类号： H05K3/36 ,  H05K3/34 ,  H01L23/00 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00 ,  B23K101/42 ,  B23K103/08 ,  B32B37/06

CPC分类号： H05K3/3494 ,  B23K20/007 ,  B23K20/025 ,  B23K20/233 ,  B23K20/24 ,  B23K35/0222 ,  B23K35/3013 ,  H01L21/84 ,  H01L24/80 ,  H05K1/111 ,  H05K1/117 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K3/4015 ,  H05K13/0015 ,  B23K2101/42 ,  B23K2103/08 ,  B32B37/06 ,  H05K2203/049 ,  H05K2203/166 ,  Y02P70/50 ,  Y02P70/62

摘要： A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US11697168B2

公开(公告)日：2023-07-11

申请号：US17047971

申请日：2019-04-18

申请人： ILLINOIS TOOL WORKS INC.

发明人： Yuwei Wang

IPC分类号： B23K3/04 ,  B23K1/008 ,  H05K3/34 ,  B23K101/42 ,  B23K3/08

CPC分类号： B23K1/008 ,  H05K3/3494 ,  B23K3/08 ,  B23K2101/42 ,  H05K2203/111 ,  H05K2203/1121

摘要： The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow oven further comprises a first pipeline, a second pipeline and a third pipeline. When the reflow oven operates in air mode, external clean air is delivered to the heating zone and is discharged from the heating zone and the blocked exhaust zone. When the reflow oven operates in inert gas mode, an inert gas is delivered from the blocked exhaust zone to the heating zone and is discharged from the heating zone. Satisfying the accurate temperature profiling necessary for reflow processing in the operation atmosphere of air or an inert gas, the reflow oven in the present application can effectively discharge volatile pollutants to reduce the number of follow-up services and maintenances. In addition, the reflow oven in the present application can save the expensive inert gas.

公开(公告)号：US11696411B2

公开(公告)日：2023-07-04

申请号：US16874711

申请日：2020-05-15

申请人： DENSO CORPORATION

发明人： Hayato Kiuchi ,  Atsushi Furumoto ,  Kazuyuki Hamamoto ,  Teruhiko Iwase ,  Masayuki Fujihira

IPC分类号： B23K3/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/047 ,  B23K3/03 ,  G05D23/24 ,  B23K101/42

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K3/0478 ,  H05K3/3447 ,  B23K3/033 ,  B23K2101/42 ,  G05D23/24 ,  H05K2203/0405

摘要： A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

公开(公告)号：US20230180395A1

公开(公告)日：2023-06-08

申请号：US18162413

申请日：2023-01-31

申请人： IIIinois Tool Works Inc.

发明人： Eric Wayne Becker ,  Hasan Imamus Saleheen

IPC分类号： H05K3/34

CPC分类号： H05K3/3494 ,  H05K3/341

摘要： A method of joining electronic components to an electronic substrate in an apparatus includes: (1) transporting electronic substrates through a chamber housing including a tunnel extending through multiple processing zones; (2) detecting temperatures of the electronic substrates passing proximate to a heat detection system including at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the heat detection system with a controller coupled to the multiple processing zones, the conveyor, and the heat detection system; (4) determining, by the controller, with reference to the detected temperatures of the electronic substrates, an adjustment to at least one of (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor, and (c) an operational speed of a blower within the chamber housing; and (5) performing the determined adjustment.