公开(公告)号：US20240090130A1

公开(公告)日：2024-03-14

申请号：US17931651

申请日：2022-09-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chad CHEN ,  Jiahui LIU ,  Wuxing XIA ,  Jingyan LIU

IPC: H05K1/18 ,  H01L23/495 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L23/49555 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10946

Abstract: A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.