公开(公告)号：US20240304507A1

公开(公告)日：2024-09-12

申请号：US18179036

申请日：2023-03-06

申请人： Wolfspeed, Inc.

发明人： Geza Dezsi ,  Yusheng Lin ,  Kuldeep Saxena

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/3107 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/49111 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/13091

摘要： Power semiconductor packages are provided. In one example, a power semiconductor package may include a power semiconductor die. The power semiconductor package may include a housing having a first side and a second side opposing the first side. The power semiconductor package may include one or more electrical leads extending from the first side. The power semiconductor package may include one or more leadless surface mount type (SMT) connection structures on the second side.

公开(公告)号：US20240258288A1

公开(公告)日：2024-08-01

申请号：US18160818

申请日：2023-01-27

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Makoto Shibuya ,  Kwang-Soo Kim

IPC分类号： H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L25/165 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45541 ,  H01L2224/45624 ,  H01L2224/45647 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104

摘要： In a described example, an apparatus includes: a package substrate with conductive leads; a semiconductor die mounted to the package substrate, the semiconductor die having a first thickness; electrical connections coupling bond pads on the semiconductor die to conductive leads on the package substrate; brackets attached to the package substrate spaced from the semiconductor die and extending away from the package substrate to a distance from the package substrate that is greater than the first thickness of the semiconductor die; and mold compound covering the package substrate, the semiconductor die, the brackets, and the semiconductor die to form a semiconductor device package having a board side surface and a top surface opposite the board side surface, and having portions of the brackets exposed from the mold compound on the top surface of the semiconductor device package to form mounts for a passive component.

公开(公告)号：US20240258207A1

公开(公告)日：2024-08-01

申请号：US18631535

申请日：2024-04-10

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Dave Anderson ,  Adam Brown

IPC分类号： H01L23/495

CPC分类号： H01L23/49524 ,  H01L23/49555

摘要： This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to contact a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion. The continuous lead portion is integrally formed with the die connection portion.

公开(公告)号：US12040260B2

公开(公告)日：2024-07-16

申请号：US17139987

申请日：2020-12-31

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Makoto Shibuya ,  Ayumu Kuroda ,  Kengo Aoya

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49555 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48245 ,  H01L2224/85205

摘要： An electronic package includes an electronic component including terminals, a plurality of surface contacts, at least some of the surface contacts being electrically coupled to the terminals within the electronic package, a mold compound covering the electronic component and partially covering the surface contacts with a bottom surface exposed from the mold compound, and a plurality of wires extending from exposed surfaces of the surface contacts, each of the wires providing a solderable surface for mounting the electronic package at a standoff on an external board.

公开(公告)号：US20240201223A1

公开(公告)日：2024-06-20

申请号：US18068089

申请日：2022-12-19

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Toshitsugu ISHII

IPC分类号： G01R1/04 ,  H01L23/31 ,  H01L23/495

CPC分类号： G01R1/0441 ,  H01L23/3107 ,  H01L23/49555 ,  H01L24/48 ,  H01L2224/48153

摘要： A manufacturing method of a semiconductor device includes a step of preparing a test object including a body for sealing a semiconductor chip and a lead terminal, a step of preparing a test socket including a first contact pin, and a step of electrically testing the semiconductor chip by contacting the first contact pin with the lead terminal. The lead terminal includes a lead upper surface located on an upper surface side of the body and a lead bottom surface located on an bottom surface side of the body. The lead terminal includes a protruding portion protruding from the body, and a connecting portion. The lead terminal further includes a bending portion that connects the protruding portion and the connecting portion. Then, in the electrical test step, the first contact pin is contacted with the lead bottom surface of the protruding portion.

公开(公告)号：US20240162123A1

公开(公告)日：2024-05-16

申请号：US18419222

申请日：2024-01-22

申请人： ROHM CO., LTD.

发明人： Hideo HARA

IPC分类号： H01L23/495 ,  H01L23/36

CPC分类号： H01L23/49555 ,  H01L23/36 ,  H01L23/49575

摘要： A power semiconductor module includes a first terminal which protrudes from a first body side surface of a module body, and a second terminal which protrudes from a second body side surface. The first terminal includes a first portion which protrudes from the first body side surface, a second portion which extends the first portion beyond a body rear surface on the reverse side from from a body main surface, and a third portion which extends from the second portion. The second terminal includes a first portion which protrudes from the second body side surface, a second portion which extends from the first portion beyond the body rear surface on the reverse side from the body main surface, and a third portion which extends from the second portion.

公开(公告)号：US20240145340A1

公开(公告)日：2024-05-02

申请号：US18406832

申请日：2024-01-08

申请人： Infineon Technologies AG

发明人： Jayaganasan Narayanasamy ,  Angel Enverge ,  Chii Shang Hong ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Subaramaniym Senivasan

IPC分类号： H01L23/433 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/84 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40175 ,  H01L2224/73263

摘要： A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to a pad at the second side of the semiconductor die; and a molding compound encapsulating the die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

公开(公告)号：US11973009B2

公开(公告)日：2024-04-30

申请号：US16919426

申请日：2020-07-02

申请人： NEXPERIA B.V.

发明人： Ricardo Lagmay Yandoc ,  Dave Anderson ,  Adam Richard Brown

IPC分类号： H01L23/495

CPC分类号： H01L23/49524 ,  H01L23/49555

摘要： This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to contact a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion. The continuous lead portion is integrally formed with the die connection portion.

公开(公告)号：US20240128140A1

公开(公告)日：2024-04-18

申请号：US18485966

申请日：2023-10-12

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Seungwon IM ,  Jeonghyuk PARK ,  Keunhyuk LEE ,  Jerome TEYSSEYRE ,  Paolo BILARDO

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/495

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/367 ,  H01L23/49555

摘要： In one general aspect, an apparatus can include a semiconductor die, a molding material disposed around at least a portion of the semiconductor die, and a pair of leads electrically coupled to the semiconductor die and aligned along a first direction from the molding material. The molding material can define an elongated protrusion aligned along a second direction orthogonal to the first direction, and a notch disposed between the pair of leads.

公开(公告)号：US20240071875A1

公开(公告)日：2024-02-29

申请号：US18272103

申请日：2022-01-20

申请人： ROHM CO., LTD.

发明人： Hiroyuki TAJIRI

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32503 ,  H01L2224/48108 ,  H01L2224/48177 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/4903 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2924/351

摘要： A semiconductor device, includes: a substrate having an obverse surface facing in a thickness direction; a first lead having a loading surface facing a side same as a side the obverse surface faces as to the thickness direction and being fixed on the obverse surface; and a first semiconductor element arranged on the loading surface. A dimension of the substrate in a first direction orthogonal to the thickness direction is larger than a dimension of the substrate in a second direction orthogonal to the thickness direction and the first direction. The first lead includes a first region overlapped with the first semiconductor element as viewed in the thickness direction and a second region separated from the first semiconductor element as viewed in the thickness direction, and at least a part of the second region extends along the second direction.