公开(公告)号：US20190221537A1

公开(公告)日：2019-07-18

申请号：US15980948

申请日：2018-05-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Han ZHONG ,  Yong Qiang TANG ,  Chen XIONG ,  Zi Qi WANG ,  Xi Lin LI

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/05 ,  H01L24/45 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/4502 ,  H01L2224/45124 ,  H01L2224/45565 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/48724 ,  H01L2224/48769 ,  H01L2924/35121

Abstract: A method of interconnecting components of a semiconductor device using wire bonding is presented. The method includes creating a free air ball at a first end of an aluminum wire that has a coating surrounding the aluminum wire, wherein the coating comprises palladium, and wherein the free air ball is substantially free of the coating. The method further includes the step of bonding the free air ball to a bond pad on a semiconductor chip, the bond pad having an aluminum surface layer, wherein the resultant ball bond and the bond pad form a substantially homogenous, aluminum-to-aluminum bond. The method may further include bonding a second, opposing end of the coated-aluminum wire to a bond site separate from the semiconductor chip, the bond site having a palladium surface layer, wherein the second end of the coated-aluminum wire and the bond site form a substantially homogenous, palladium-to-palladium bond.

公开(公告)号：US20190027667A1

公开(公告)日：2019-01-24

申请号：US16143383

申请日：2018-09-26

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/00 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/095 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20752 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting apparatus includes a positive lead terminal and a negative lead terminal, each of which includes a first main surface, a second main surface, and an end surface including a first recessed surface area extending from a first point of the first main surface in cross section, and a second recessed surface area extending from a second point of the second main surface in cross section. A distance between a first part of the end surface of the positive lead terminal and a second part of the end surface of the negative lead terminal than a first distance between the first points of the positive lead terminal and the negative lead terminal and a second distance between the second points of the positive lead terminal and the negative lead terminal. The first part and the second part are separated from the first point and the second point.

公开(公告)号：US20160155917A1

公开(公告)日：2016-06-02

申请号：US15015246

申请日：2016-02-04

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L23/495 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.

Abstract translation: 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极和负极引线端子中的每一个包括第一主表面，第二主表面和端表面。 端面设置在第一主表面和第二主表面之间。 端面包括第一凹陷表面区域和第二凹入表面区域。 第一凹陷表面区域从第一主表面的第一点在横截面上延伸。 第二凹入表面区域从第二主表面的第二点以横截面延伸。 第一和第二凹入表面区域限定向外突出的突出部分。 树脂部分至少位于正引线端子的端面和负引线端子的端面之间。

公开(公告)号：US09214442B2

公开(公告)日：2015-12-15

申请号：US11688050

申请日：2007-03-19

Applicant: Karsten Guth ,  Holger Torwesten

Inventor： Karsten Guth ,  Holger Torwesten

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L24/32 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a power semiconductor module, a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged successively and fixedly connected with one another. The connection layer has a portion of intermetallic copper-tin phases of at least 90% by weight. For producing such a power semiconductor module the soldering partners and the solder arranged there between are pressed against one another with a predefined pressure and the solder is melted. After termination of a predefined period of time the diffused copper and the tin from the liquid solder form a connection layer comprising intermetallic copper-tin phases, the portion of which is at least 90% by weight of the connection layer created from the solder layer.

Abstract translation: 在功率半导体模块中，连续并且固定地连接有含铜的第一焊接对象，连接层和含铜的第二焊接对象。 连接层具有至少90重量％的金属间铜 - 锡相的一部分。 为了制造这样的功率半导体模块，焊接对象和布置在其间的焊料彼此以预定压力彼此压紧，并且焊料熔化。 在预定时间段结束之后，扩散的铜和来自液态焊料的锡形成包含金属间铜 - 锡相的连接层，该连接层的至少90％是由焊料层形成的连接层。

公开(公告)号：US20140209215A1

公开(公告)日：2014-07-31

申请号：US14157413

申请日：2014-01-16

Applicant: Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

Inventor： Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

IPC: H01L23/00

CPC classification number: H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45157 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033

Abstract: A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Abstract translation: 提供由选自铜 - 金合金，铜 - 钯合金和铜 - 金 - 钯合金的材料制成的铜基合金线。 合金丝具有面心立方晶格的多晶结构，由多个等轴晶粒构成。 具有退火双晶的晶粒的数量是铜基合金线的晶粒总量的10％以上。

公开(公告)号：US08692118B2

公开(公告)日：2014-04-08

申请号：US13168675

申请日：2011-06-24

Applicant: Cyprian Uzoh ,  Craig Mitchell

Inventor： Cyprian Uzoh ,  Craig Mitchell

IPC: H01B5/00

CPC classification number: H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

Abstract translation: 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US08685789B2

公开(公告)日：2014-04-01

申请号：US12776199

申请日：2010-05-07

Applicant: Christoph B. Luechinger

Inventor： Christoph B. Luechinger

IPC: H01L21/00

CPC classification number: H01L23/498 ,  B23K20/008 ,  B23K2101/32 ,  B23K2101/38 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/78316 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45655 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/01049

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract translation: 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。

公开(公告)号：US08450611B2

公开(公告)日：2013-05-28

申请号：US12607225

申请日：2009-10-28

Applicant: Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

Inventor： Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

IPC: H01R4/62

CPC classification number: H01L24/85 ,  B23K35/0227 ,  B23K35/286 ,  B32B15/01 ,  B32B15/018 ,  C22C27/02 ,  C22C27/04 ,  C23C14/3407 ,  C23C14/562 ,  C23C30/00 ,  H01L24/43 ,  H01L24/45 ,  H01L24/745 ,  H01L2224/435 ,  H01L2224/4381 ,  H01L2224/4382 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/43831 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4557 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45681 ,  H01L2224/45684 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/745 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2224/45138 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/05432 ,  H01L2924/013

Abstract: A connecting wire having an electrically conductive core, preferably provided by a wire or ribbon, with a coating provided on the surface of the core. The coating is composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally contains silicon as an additional alloy component. A manufacturing method for producing such a connecting wire involves passing a wire or ribbon core past a coating source to apply the coating.

Abstract translation: 一种连接线，其具有导电芯，优选地由线或带提供，其具有设置在芯的表面上的涂层。 该涂层由含氮钽合金或钨合金组成，并且还任选地含有作为附加合金成分的硅。 用于制造这种连接线​​的制造方法包括使线或带芯通过涂覆源以施加涂层。

公开(公告)号：US20110107595A1

公开(公告)日：2011-05-12

申请号：US13008928

申请日：2011-01-19

Applicant: Manfred Schneegans ,  Markus Leicht ,  Stefan Woehlert ,  Edmund Riedl

Inventor： Manfred Schneegans ,  Markus Leicht ,  Stefan Woehlert ,  Edmund Riedl

IPC: H01L21/58

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05611 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48611 ,  H01L2224/48711 ,  H01L2224/48799 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85815 ,  H01L2224/85825 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19042 ,  H01L2924/20751 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2924/013 ,  H01L2924/01006

Abstract: A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a copper electrical connector between the contact pins and the contact pad, and diffusion soldering the copper electrical connector to the active area with a solder material including tin to form a solder connection including a contiguous bronze coating disposed between and in direct contact with both the copper electrical connector and the contact pad.

Abstract translation: 一种将半导体芯片电连接到另一个电子设备的方法，包括提供包括接触引脚和附接到载体的芯片的载体，所述芯片具有背离载体的铜接触焊盘，在接触引脚之间延伸铜电连接器 以及接触焊盘，并且使用包括锡的焊料材料将铜电连接器扩散焊接到有源区域，以形成包括布置在铜电连接器和接触焊盘两者之间并且与铜电连接器和接触焊盘两者直接接触的连续青铜镀层的焊料连接。

公开(公告)号：US20080251918A1

公开(公告)日：2008-10-16

申请号：US12143029

申请日：2008-06-20

Applicant: SOHICHI KADOGUCHI ,  NORIHIRO KAWAKAMI

Inventor： SOHICHI KADOGUCHI ,  NORIHIRO KAWAKAMI

IPC: H01L23/49

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01205 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999% pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.

Abstract translation: 一种具有在弱绝缘材料（102）上具有至少一个金属接合焊盘（101）的芯片的半导体器件。 与该接合垫接触的是由金，铜或银等至少99.999％的纯金属制成的扁平金属球（104）。 扁平球的直径（104a）小于或等于接合垫的直径（103a）。 线（110）连接到接合焊盘，使得导线具有导电地附接到扁平金属球的加厚部分（111）。 电线优选由金合金等组成金属制成。 扁平球的组成比线更软。 扁平球的柔软度保护下层绝缘体免受压力或应力造成的损伤，当组合球被附着时。