公开(公告)号：US20100140327A1

公开(公告)日：2010-06-10

申请号：US12703262

申请日：2010-02-10

Applicant: Norihiro KAWAKAMI ,  Yoshikatsu UMEDA ,  Sohichi KADOGUCHI

Inventor： Norihiro KAWAKAMI ,  Yoshikatsu UMEDA ,  Sohichi KADOGUCHI

IPC: B23K1/06 ,  B23K31/02

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

Abstract translation: 公开了用于在电子设备组件中的电触点之间形成牢固的引线键的方法和系统。 描述了用于形成引线键的本发明的代表性实施例，其包括用于从热源产生电磁能并将热量传递到形成在接合线上的球的系统部件和方法步骤。 随后，在引线接合的形成中使用在接合部位施加到球的压力。

公开(公告)号：US20060144907A1

公开(公告)日：2006-07-06

申请号：US11026840

申请日：2004-12-30

Applicant: Sohichi Kadoguchi ,  Norihiro Kawakami

Inventor： Sohichi Kadoguchi ,  Norihiro Kawakami

IPC: B23K31/02

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01205 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999 % pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.

Abstract translation: 一种具有在弱绝缘材料（102）上具有至少一个金属接合焊盘（101）的芯片的半导体器件。 与该接合垫接触的是由金，铜或银等至少99.999％的纯金属制成的扁平金属球（104）。 扁平球的直径（104a）小于或等于接合垫的直径（103a）。 线（110）连接到接合焊盘，使得导线具有导电地附接到扁平金属球的加厚部分（111）。 电线优选由金合金等组成金属制成。 扁平球的组成比线更软。 扁平球的柔软度保护下层绝缘体免受压力或应力造成的损伤，当组合球被附着时。

公开(公告)号：US07926698B2

公开(公告)日：2011-04-19

申请号：US12703262

申请日：2010-02-10

Applicant: Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

Inventor： Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

IPC: B23K31/02 ,  B23K1/06

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

Abstract translation: 公开了用于在电子设备组件中的电触点之间形成牢固的引线键的方法和系统。 描述了用于形成引线键的本发明的代表性实施例，其包括用于从热源产生电磁能并将热量传递到形成在接合线上的球的系统部件和方法步骤。 随后，在引线接合的形成中使用在接合部位施加到球的压力。

公开(公告)号：US07677432B2

公开(公告)日：2010-03-16

申请号：US11120773

申请日：2005-05-03

Applicant: Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

Inventor： Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

IPC: B23K31/02 ,  B23K37/00

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

Abstract translation: 公开了用于在电子设备组件中的电触点之间形成牢固的引线键的方法和系统。 描述了用于形成引线键的本发明的代表性实施例，其包括用于从热源产生电磁能并将热量传递到形成在接合线上的球的系统部件和方法步骤。 随后，在引线接合的形成中使用在接合部位施加到球的压力。

公开(公告)号：US07404513B2

公开(公告)日：2008-07-29

申请号：US11026840

申请日：2004-12-30

Applicant: Sohichi Kadoguchi ,  Norihiro Kawakami

Inventor： Sohichi Kadoguchi ,  Norihiro Kawakami

IPC: B23K31/02 ,  B23K1/06

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01205 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999% pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.

Abstract translation: 一种具有在弱绝缘材料（102）上具有至少一个金属接合焊盘（101）的芯片的半导体器件。 与该接合垫接触的是由金，铜或银等至少99.999％的纯金属制成的扁平金属球（104）。 扁平球的直径（104a）小于或等于接合垫的直径（103a）。 线（110）连接到接合焊盘，使得导线具有导电地附接到扁平金属球的加厚部分（111）。 电线优选由金合金等组成金属制成。 扁平球的组成比线更软。 扁平球的柔软度保护下层绝缘体免受压力或应力造成的损伤，当组合球被附着时。

公开(公告)号：US20060249561A1

公开(公告)日：2006-11-09

申请号：US11120773

申请日：2005-05-03

Applicant: Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

Inventor： Norihiro Kawakami ,  Yoshikatsu Umeda ,  Sohichi Kadoguchi

IPC: B23K37/00

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

Abstract translation: 公开了用于在电子设备组件中的电触点之间形成牢固的引线键的方法和系统。 描述了用于形成引线键的本发明的代表性实施例，其包括用于从热源产生电磁能并将热量传递到形成在接合线上的球的系统部件和方法步骤。 随后，在引线接合的形成中使用在接合部位施加到球的压力。

公开(公告)号：US20080251918A1

公开(公告)日：2008-10-16

申请号：US12143029

申请日：2008-06-20

Applicant: SOHICHI KADOGUCHI ,  NORIHIRO KAWAKAMI

Inventor： SOHICHI KADOGUCHI ,  NORIHIRO KAWAKAMI

IPC: H01L23/49

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01205 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999% pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.

Abstract translation: 一种具有在弱绝缘材料（102）上具有至少一个金属接合焊盘（101）的芯片的半导体器件。 与该接合垫接触的是由金，铜或银等至少99.999％的纯金属制成的扁平金属球（104）。 扁平球的直径（104a）小于或等于接合垫的直径（103a）。 线（110）连接到接合焊盘，使得导线具有导电地附接到扁平金属球的加厚部分（111）。 电线优选由金合金等组成金属制成。 扁平球的组成比线更软。 扁平球的柔软度保护下层绝缘体免受压力或应力造成的损伤，当组合球被附着时。

公开(公告)号：US20070200234A1

公开(公告)日：2007-08-30

申请号：US11424555

申请日：2006-06-16

Applicant: Mark Gerber ,  Sohichi Kadoguchi ,  Masakazu Hakuno

Inventor： Mark Gerber ,  Sohichi Kadoguchi ,  Masakazu Hakuno

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A flip-chip and underfilled device, which includes a semiconductor chip (101) with contact pads and a workpiece (102) with contact pads in matching locations; the workpiece may be an insulating substrate or another semiconductor chip. The workpiece and the chip are spaced by a gap (103) of substantially uniform average width. Attached to each chip contact pad is a column-shaped spacer (140), which includes two or more deformed spheres of non-reflow metals, preferably gold, bonded together to a height about equal to the gap width. The spacer is attached to the contact pad (110) substantially normal to the chip surface and extends from the chip pad to the matching workpiece pad (120); it is bonded to the workpiece pad by reflow metals (141) such as tin or tin alloy, which covers at least portions of the workpiece pad and the spacer. The gap may be filled with a polymer material (105) surrounding the reflow metal and spacers.

Abstract translation: 一种倒装芯片和底层装置，其包括具有接触焊盘的半导体芯片（101）和在匹配位置具有接触焊盘的工件（102）; 工件可以是绝缘基板或另一半导体芯片。 工件和芯片间隔开具有基本均匀的平均宽度的间隙（103）。 连接到每个芯片接触垫的是柱形间隔件（140），其包括两个或更多个变形的非回流金属球体，优选为金，其接合在一起等于间隙宽度的高度。 间隔件大致垂直于芯片表面附接到接触焊盘（110），并从芯片焊盘延伸到匹配的工件焊盘（120）; 它通过覆盖工件衬垫和间隔件的至少一部分的回流金属（141）如锡或锡合金粘合到工件衬垫上。 间隙可以填充有围绕回流金属和间隔物的聚合物材料（105）。

公开(公告)号：US06768212B2

公开(公告)日：2004-07-27

申请号：US10342989

申请日：2003-01-15

Applicant: Akira Karashima ,  Margaret Simmons-Matthews ,  Sohichi Kadoguchi

Inventor： Akira Karashima ,  Margaret Simmons-Matthews ,  Sohichi Kadoguchi

IPC: H01L2348

CPC classification number: H01L23/49811 ,  H01L23/49513 ,  H01L23/49517 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48233 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package according to the present invention includes a die attachment area for receiving a die attachment material and a stitch bond area for receiving a wire lead from a die. The stitch bond area is adjacent to said die attachment area on the substrate. Moreover, a stud bump is formed on the substrate for preventing the die attachment material from contacting the stitch bond area when a die is attached to the die attachment area. A method for manufacturing a semiconductor package according to the present invention also is disclosed.

Abstract translation: 根据本发明的半导体封装包括用于接收管芯附接材料的管芯附接区域和用于从管芯接收引线的缝合区域。 针迹结合区域与基底上的所述管芯附着区域相邻。 此外，在基板上形成柱状凸块，以防止当模具附接到模具安装区域时模具安装材料接触线圈接合区域。 本发明还公开了一种半导体封装的制造方法。