公开(公告)号：US12027465B2

公开(公告)日：2024-07-02

申请号：US17952838

申请日：2022-09-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Christopher Wyland

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L23/66 ,  H01P1/04 ,  H05K1/02

CPC classification number: H01L23/5383 ,  H01L23/5226 ,  H01L23/5387 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/91 ,  H01P1/047 ,  H05K1/0243 ,  H01L24/45 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K2203/049 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2224/49111 ,  H01L2224/48472 ,  H01L2924/00 ,  H01L2224/48472 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/85207 ,  H01L2924/00 ,  H01L2224/49175 ,  H01L2224/48472 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2924/206

Abstract: A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US20190198477A1

公开(公告)日：2019-06-27

申请号：US16290804

申请日：2019-03-01

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/67 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L24/83 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

公开(公告)号：US09508672B2

公开(公告)日：2016-11-29

申请号：US14722895

申请日：2015-05-27

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Okumura

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L23/00 ,  H01L23/522 ,  H01L23/525 ,  H01L23/532

CPC classification number: H01L23/3128 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/525 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0346 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05541 ,  H01L2224/05555 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/1412 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48866 ,  H01L2224/48884 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/384 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device suitable for preventing malfunction is provided.The semiconductor device includes a semiconductor chip 1, a first electrode pad 21 laminated on the semiconductor chip 1, an intermediate layer 4 having a rectangular shape defined by first edges 49a and second edges, and a plurality of bumps 5 arranged to sandwich the intermediate layer 4 by cooperating with the semiconductor chip 1. The first edges 49a extend in the direction x, whereas the second edges extend in the direction y. The plurality of bumps 5 include a first bump 51 electrically connected to the first electrode pad 21 and a second bump 52 electrically connected to the first electrode pad 21. The first bump 51 is arranged at one end in the direction x and one end in the direction y.

Abstract translation: 半导体器件包括：半导体芯片1，层叠在半导体芯片1上的第一电极焊盘21，具有由第一边缘49a和第二边缘限定的矩形形状的中间层4，以及多个凸块5， 第一边缘49a沿着x方向延伸，而第二边缘沿y方向延伸。 多个凸块5包括电连接到第一电极焊盘21的第一凸块51和与第一电极焊盘21电连接的第二凸起52.第一凸块51沿x方向的一端和 方向y

公开(公告)号：US09490224B2

公开(公告)日：2016-11-08

申请号：US14150153

申请日：2014-01-08

Applicant: Seiko Instruments Inc.

Inventor： Noriyuki Kimura

IPC: H01L23/488 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/85423 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin sealed semiconductor device includes a semiconductor element having a plurality of metal plated plastic particle core or metal particle core micro-balls including an internal terminal surface and an external connection electrode. Metal wires electrically connect the semiconductor element to the internal terminal and are bonded to the internal terminal surface by a wire bond connection coupling the metal wire to the metal plating, where the metal wire and the metal plating are different materials. A sealing body seals the semiconductor element, a part of each the plurality of the terminals, and the metal wires, where a back surface of the semiconductor element is exposed by the sealing body, and a part of each the plurality of micro-balls project from a bottom surface of the sealing body to provide the external connection electrodes.

Abstract translation: 树脂密封半导体器件包括具有多个金属电镀塑料粒子芯的半导体元件或包括内部端子表面和外部连接电极的金属粒子芯微球。 金属线将半导体元件与内部端子电连接，并通过将金属线耦合到金属电镀的金属丝接合连接到内部端子表面，金属线和金属电镀是不同的材料。 密封体密封半导体元件，多个端子的一部分和金属线，半导体元件的背面通过密封体露出，多个微球的一部分突出 从密封体的底表面提供外部连接电极。

公开(公告)号：US09461015B2

公开(公告)日：2016-10-04

申请号：US14270885

申请日：2014-05-06

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K1/11 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L27/146

CPC classification number: H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

Abstract translation: 微电子组件包括具有第一和第二表面的电介质元件，第一和第二孔在第一和第二表面之间延伸并且限定第一和第二孔之间的第一表面的中心区域，第一和第二微电子元件以及从 在第一和第二微电子元件的相应前表面处暴露在中央区域的中心端子的触点。 第一微电子元件的前表面可面向电介质元件的第二表面。 第二微电子元件的前表面可面对第一微电子元件的后表面。 第二微电子元件的触点可突出超过第一微电子元件的边缘。 至少第一和第二引线可以将中心端子的第一中心端子与第一和第二微电子元件中的每一个电互连。

公开(公告)号：US09425165B2

公开(公告)日：2016-08-23

申请号：US14702969

申请日：2015-05-04

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/67

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

公开(公告)号：US20160211196A1

公开(公告)日：2016-07-21

申请号：US15007607

申请日：2016-01-27

Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.

Inventor： Danny RETUTA ,  Hien Boon TAN ,  Anthony Yi Sheng SUN ,  Mary Annie CHEONG

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49506 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes form a structure of leads and a die pad on the electrically conductive layer. The plurality of holes are filled with a non-conductive material. Next; an electrically conductive foil is attached on the top surface of the electrically conductive layer and the non-conductive epoxy material. The, the electrically conductive foil is etched to create a network of leads, die pad, bus lines, dam bars and tie lines, wherein the bus lines connect the leads to the dam bar, the dam bar is connected to the tie line and the tie line is connected to the die pad.

Abstract translation: 制造引线框架的方法包括提供在顶表面具有多个孔的导电层。 多个孔在导电层上形成引线和管芯焊盘的结构。 多个孔填充有非导电材料。 下一个; 导电箔附着在导电层和非导电环氧材料的顶表面上。 导电箔被蚀刻以形成引线网络，管芯焊盘，总线，坝条和连接线，其中总线将引线连接到堤坝，坝条连接到连接线， 连接线连接到管芯焊盘。

公开(公告)号：US09209153B2

公开(公告)日：2015-12-08

申请号：US14466983

申请日：2014-08-23

Applicant: Renesas Electronics Corporation

Inventor： Norihiro Asamura ,  Takahiro Ishino

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L25/16 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/49 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/85801 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1304 ,  H01L2924/13091 ,  H01L2924/141 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45105

Abstract: Disclosed is a semiconductor device in which, when two adjacent semiconductor chips are coupled with bonding wires, a short circuit between the adjacent bonding wires can be suppressed. A first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire are lined up in this order along a first side. When viewed from a direction perpendicular to a chip mounting part, a maximum of the space between the first bonding wire and the second bonding wire is larger than that of the space between the second bonding wire and the third bonding wire. Further, a maximum of the space between the second bonding wire and the third bonding wire is larger than that of the space between the third bonding wire and the fourth bonding wire.

Abstract translation: 公开了一种半导体器件，其中当两个相邻的半导体芯片与接合线耦合时，可以抑制相邻接合线之间的短路。 第一接合线，第二接合线，第三接合线和第四接合线沿着第一侧依次排列。 当从垂直于芯片安装部分的方向观察时，第一接合线和第二接合线之间的空间的最大值大于第二接合线和第三接合线之间的空间的最大值。 此外，第二接合线和第三接合线之间的间隔的最大值大于第三接合线和第四接合线之间的空间的最大值。

公开(公告)号：US20150325763A1

公开(公告)日：2015-11-12

申请号：US14802347

申请日：2015-07-17

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kazunori ODA ,  Akira SAKAMOTO ,  Yoshinori MURATA ,  Kenzaburo KAWAI ,  Koichi SUZUKI ,  Megumi OISHI

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L33/52

CPC classification number: H01L21/6835 ,  H01L23/3121 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48669 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85469 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

Abstract translation: LED引线框或LED基板包括具有用于在其上安装LED元件的安装表面的主体部分。 作为用于反射来自LED元件的光的反射层的反射金属层设置在主体部的安装面上。 反射金属层包括铂和银的合金或金和银的合金。 反射金属层有效地反射从LED元件发出的光，并且抑制由于气体的存在引起的腐蚀，从而能够保持来自LED元件的光的反射特性。

公开(公告)号：US09129862B2

公开(公告)日：2015-09-08

申请号：US14331722

申请日：2014-07-15

Applicant: Micron Technology, Inc.

Inventor： Teck Kheng Lee ,  David Yih Ming Chai ,  Hong Wan Ng

IPC: H01L21/00 ,  H01L23/02 ,  H01L23/12 ,  H01L21/768 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L23/12 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  Y10T29/49826 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.

Abstract translation: 本文公开了微电子器件，相关联的组件和相关联的方法。 例如，本发明的某些方面涉及一种微电子装置，该微电子器件包括具有侧面和孔侧的微特征工件。 该装置还可包括具有表面的工件接触件。 工件接触面的至少一部分表面可以通过孔径和通过在孔和表面之间延伸的通道而接近。 本发明的其它方面涉及一种微电子支撑装置，其包括支撑构件，所述支撑构件具有承载能够连接到微特征工件的工件接触件的支撑触点的侧面。 该装置还可以包括由支撑构件承载的凹进的支撑接触装置。 凹入的支撑接触装置可以连接到微特征工件的第二工件接触件。