公开(公告)号：US12107070B2

公开(公告)日：2024-10-01

申请号：US17435696

申请日：2020-07-15

申请人： SHINKAWA LTD.

发明人： Hiroaki Yoshino ,  Shinsuke Tei

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L24/48 ,  H01L2224/48465 ,  H01L2224/78611 ,  H01L2224/78824 ,  H01L2224/85201 ,  H01L2224/85986

摘要： Provided is a method for manufacturing a semiconductor device which connects a first bond point and a second bond point by a wire. The method includes: a ball bonding step in which a crimping ball and a ball neck are formed at the first bond point by ball bonding; a thin-walled portion forming step in which a thin-walled portion having a reduced cross-sectional area is formed between the ball neck and the crimping ball; a wire tail separating step in which after a capillary is raised to unroll a wire tail, the capillary is moved in a direction to the second bond point, and the wire tail and the crimping ball are separated in the thin-walled portion; and a wire tail joining step in which the capillary is lowered and a side surface of the separated wire tail is joined onto the crimping ball.

公开(公告)号：US12094725B2

公开(公告)日：2024-09-17

申请号：US17546960

申请日：2021-12-09

申请人： STMicroelectronics, Inc.

发明人： Jefferson Talledo ,  Frederick Ray Gomez

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/54 ,  H01L21/78 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/78 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/83 ,  H05K1/111 ,  H05K1/181 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2224/83444 ,  H01L2924/01047 ,  H01L2224/85444 ,  H01L2924/01047 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/48105 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US20240290547A1

公开(公告)日：2024-08-29

申请号：US18588629

申请日：2024-02-27

申请人： TDK Corporation

发明人： Masahiro HIRAOKA ,  Hitoshi SAITA

IPC分类号： H01G4/33 ,  H01G4/012 ,  H01G4/228 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01G4/33 ,  H01G4/012 ,  H01G4/228 ,  H01L23/49822 ,  H01L24/48 ,  H01L28/55 ,  H01L28/60 ,  H01L2224/48465 ,  H01L2924/19041

摘要： Disclosed herein is a thin film capacitor that includes a capacitor part having a lower electrode, an inner electrode, and a dielectric layer positioned between the lower electrode and the inner electrode, an insulating layer covering the capacitor part, a terminal electrode provided on the insulating layer, and a plurality of via holes penetrating the insulating layer so that the terminal electrode and the inner electrode of the capacitor part are connected to each other via the plurality of via holes. The terminal electrode includes a via region on which the plurality of via holes are arranged and having a ring-shaped, and a bonding region surrounded by the via region and having flat-shaped.

公开(公告)号：US20240222235A1

公开(公告)日：2024-07-04

申请号：US18496383

申请日：2023-10-27

申请人： FUJI ELECTRIC CO., LTD.

发明人： Ryu ARAKI

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/48465 ,  H01L2224/4912 ,  H01L2924/13055 ,  H01L2924/13091

摘要： A wiring member is connected to an output electrode of a semiconductor chip and to a wiring region of a main current lead frame via an insulating spacer. In this case, a snubber capacitor is formed by the wiring member and spacer between the input electrode of a (high-side) semiconductor chip and the output electrode of a (low-side) semiconductor chip. This snubber capacitor absorbs back electromotive force produced due to the wiring inductance of the wiring member and main current lead frame.

公开(公告)号：US12021019B2

公开(公告)日：2024-06-25

申请号：US17515176

申请日：2021-10-29

申请人： Texas Instruments Incorporated

发明人： Anindya Poddar ,  Ashok Surendra Prabhu ,  Edgar Dorotyao Balidoy ,  Hau Nguyen ,  Makoto Yoshino ,  Ming Li

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H05K1/02

CPC分类号： H01L23/49861 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/49844 ,  H01L24/48 ,  H05K1/0204 ,  H01L2224/48177 ,  H01L2224/48178 ,  H01L2224/48248 ,  H01L2224/48465 ,  H01L2924/1811 ,  H01L2924/182

摘要： A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

公开(公告)号：US11973308B2

公开(公告)日：2024-04-30

申请号：US17103587

申请日：2020-11-24

申请人： KYOCERA SLD Laser, Inc.

发明人： James W. Raring ,  Paul Rudy ,  Eric Goutain ,  Troy Trottier ,  Melvin McLaurin ,  James Harrison ,  Sten Heikman ,  Michael Cantore

IPC分类号： H01S5/00 ,  F21K9/64 ,  H01S5/02212 ,  H01S5/02257 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/02326 ,  H01S5/0233 ,  H01S5/32 ,  H01S5/343 ,  H01L33/00 ,  H01S5/02 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/22 ,  H01S5/40

CPC分类号： H01S5/0087 ,  F21K9/64 ,  H01S5/02257 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/02326 ,  H01S5/0233 ,  H01S5/32 ,  H01S5/3203 ,  H01S5/34333 ,  H01L33/0045 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01S5/0202 ,  H01S5/0216 ,  H01S5/0217 ,  H01S5/02212 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/2201 ,  H01S5/320225 ,  H01S5/32025 ,  H01S5/320275 ,  H01S5/4056 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source. The phosphor material is provided with a plurality of scattering centers scribed on an excitation surface or inside bulk of a plate to scatter electromagnetic radiation of a laser beam from the excitation source incident on the excitation surface to enhance generation and quality of an emitted light from the phosphor material for outputting a white light emission either in reflection mode or transmission mode.

公开(公告)号：US11973052B2

公开(公告)日：2024-04-30

申请号：US17242380

申请日：2021-04-28

申请人： Texas Instruments Incorporated

发明人： Chien-Chang Li ,  Hung-Yu Chou ,  Sheng-Wen Huang ,  Zi-Xian Zhan ,  Byron Lovell Williams

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/85 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/85051 ,  H01L2224/85205

摘要： An electronic device includes a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. A wirebonding method includes bonding the first end of the conductive bond wire to the first conductive plate includes forming a ball bond to join the first end of the conductive bond wire to a planar side of the first conductive plate by a ball bond, and bonding the second end of the conductive bond wire to the conductive stud bump includes forming a stitch bond to join the second end of the conductive bond wire to the conductive stud bump.

公开(公告)号：US11894306B2

公开(公告)日：2024-02-06

申请号：US17985827

申请日：2022-11-12

申请人： Ping-Jung Yang

发明人： Ping-Jung Yang

IPC分类号： H01L23/538 ,  H01L23/15 ,  H01L23/498 ,  H10K77/10 ,  H01L23/00 ,  H01L25/16

CPC分类号： H01L23/5384 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H10K77/10 ,  C09K2323/00 ,  C09K2323/03 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13005 ,  H01L2224/1308 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  Y02E10/549 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/1308 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2224/48465 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/13109 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2224/13005 ,  H01L2924/206 ,  H01L2224/13005 ,  H01L2924/207 ,  H01L2224/03462 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/01029 ,  H01L2224/45139 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2224/48465 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45124 ,  H01L2924/00014

摘要： A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

公开(公告)号：US20240038698A1

公开(公告)日：2024-02-01

申请号：US18206579

申请日：2023-06-06

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Erh-Ju LIN

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L24/48 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/48458 ,  H01L2224/48453 ,  H01L2924/3651 ,  H01L2224/05647 ,  H01L2224/05547 ,  H01L2224/05557

摘要： A package structure is provided. The package structure includes a substrate, a conductive pad, and a conductive wire. The conductive pad is disposed over the substrate. The conductive wire includes an end portion connected to the conductive pad, wherein a grain arrangement of the end portion is distinct from a grain arrangement of the conductive pad.

公开(公告)号：US11876066B2

公开(公告)日：2024-01-16

申请号：US17395874

申请日：2021-08-06

申请人： TANAKA DENSHI KOGYO K. K.

发明人： Hiroyuki Amano ,  Yuki Antoku ,  Takeshi Kuwahara ,  Tsukasa Ichikawa

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/45 ,  H01L24/48 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05647 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45601 ,  H01L2224/45617 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/4852 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85379 ,  H01L2224/85395 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/10253 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20751 ,  H01L2924/20752

摘要： The bonding wire being a Pd-coated copper bonding wire includes: a copper core material; and a Pd layer and containing a sulfur group element, in which with respect to the total of copper, Pd, and the sulfur group element, a concentration of Pd is 1.0 mass % to 4.0 mass % and a total concentration of the sulfur group element is 50 mass ppm or less, and a concentration of S is 5 mass ppm to 2 mass ppm, a concentration of Se is 5 mass ppm to 20 mass ppm, or a concentration of Te is 15 mass ppm to 50 mass ppm or less. A wire bonding structure includes a Pd-concentrated region with the concentration of Pd being 2.0 mass % or more relative to the total of Al, copper, and Pd near a bonding surface of an Al-containing electrode of a semiconductor chip and a ball bonding portion.