公开(公告)号：US20240258765A1

公开(公告)日：2024-08-01

申请号：US18040407

申请日：2021-09-28

申请人： Robert Bosch GmbH

发明人： Stefan Pinter

IPC分类号： H01S5/02257 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/40

CPC分类号： H01S5/02257 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/4031

摘要： A laser diode device including at least one laser diode. The laser diode is an edge emitter. The laser diode device includes a housing having a transparent optical window, the transparent optical window being embodied as a first side wall of the housing. The housing is designed to shield the laser diode from an external environment of the laser diode device, in particular hermetically. The transparent optical window is designed to transmit at least one laser beam generated by the laser diode into the external environment. The laser diode is at least indirectly fastened to a base of the housing. The side walls of the housing and a housing cover situated opposite the housing base are produced from a multiplicity of wafers, in particular at least three.

公开(公告)号：US12034271B2

公开(公告)日：2024-07-09

申请号：US17262238

申请日：2019-07-23

申请人： Osram OLED GmbH

发明人： Florian Lex ,  Thomas Kippes ,  Michael Mueller ,  Fabian Knorr ,  Zeljko Pajkic

IPC分类号： H01S5/00 ,  H01S5/02257 ,  H01S5/026 ,  H01S5/042 ,  H01S5/42 ,  H01L31/0232 ,  H01L31/173

CPC分类号： H01S5/026 ,  H01S5/0028 ,  H01S5/02257 ,  H01S5/0264 ,  H01S5/04256 ,  H01S5/423 ,  H01L31/0232 ,  H01L31/173 ,  H01S5/0071

摘要： An optoelectronic semiconductor device may include a first array of first optoelectronic components and a second array of second optoelectronic components arranged in a substrate. The first optoelectronic components may each include a first resonator mirror and a second resonator mirror where the first resonator mirror has a first main surface and an active area suitable for generating radiation. Each resonator mirror is arranged one above the other along a first direction where radiation emitted by the optoelectronic component is emitted via the first main surface. The first optoelectronic components are suitable for emitting electromagnetic radiation. The second optoelectronic components may each include an active area suitable for generating radiation and are suitable for absorbing electromagnetic radiation.

公开(公告)号：US20240204476A1

公开(公告)日：2024-06-20

申请号：US18555787

申请日：2022-04-12

申请人： ams-OSRAM International GmbH

发明人： Josef Hirn ,  Martin Nömer ,  Hannes Walther ,  Tilman Rügheimer ,  Roland Hüttinger ,  Elmar Baur ,  Ralf Wombacher

IPC分类号： H01S5/02315 ,  H01S5/02257

CPC分类号： H01S5/02315 ,  H01S5/02257

摘要： Disclosed is an optoelectronic semiconductor component including at least one optoelectronic semiconductor chip in an interior of a housing; the housing has a base part and a top part, the base part is a ceramic support, the top part is made of one or more glass materials, a connection layer that is made of a solder glass is arranged between the base part and the top part, and the ceramic support includes a connection portion with a nickel-containing surface which is in direct contact with the solder glass.

公开(公告)号：US12009633B2

公开(公告)日：2024-06-11

申请号：US17285244

申请日：2019-10-17

申请人： OSRAM Opto Semiconductors GmbH

发明人： Joerg Sorg

IPC分类号： H01S5/02216 ,  H01S5/0222 ,  H01S5/02255 ,  H01S5/02257 ,  H05K1/11 ,  H05K1/18

CPC分类号： H01S5/02216 ,  H01S5/0222 ,  H01S5/02255 ,  H01S5/02257 ,  H05K1/115 ,  H05K1/181

摘要： A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

公开(公告)号：US11984697B2

公开(公告)日：2024-05-14

申请号：US18181150

申请日：2023-03-09

申请人： NICHIA CORPORATION

发明人： Tomonori Miyoshi ,  Hiroaki Yuto

IPC分类号： H01S5/00 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/068 ,  H01S5/02216 ,  H01S5/02325 ,  H01S5/024

CPC分类号： H01S5/0087 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/06825 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02325 ,  H01S5/02469

摘要： An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.

公开(公告)号：US20240128713A1

公开(公告)日：2024-04-18

申请号：US18397545

申请日：2023-12-27

申请人： iReach Corporation

发明人： Hsiu-Ju YANG ,  Shou-Lung CHEN ,  Hsin-Chan CHUNG

IPC分类号： H01S5/042 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01S5/00 ,  H01S5/02257

CPC分类号： H01S5/042 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01S5/0014 ,  H01S5/02257 ,  H01L33/58 ,  H01L2933/005

摘要： A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

公开(公告)号：US20240128709A1

公开(公告)日：2024-04-18

申请号：US18391280

申请日：2023-12-20

申请人： HISENSE LASER DISPLAY CO., LTD

发明人： Jianjun LI ,  Xin ZHANG ,  Youliang TIAN ,  Xintuan TIAN

IPC分类号： H01S5/02216 ,  G03B21/20 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/40

CPC分类号： H01S5/02216 ,  G03B21/2033 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/4031 ,  H01S5/02255

摘要： A laser device includes a shell, an upper cover assembly, a plurality of light-emitting assemblies, and a plurality of conductive pins. The shell includes a base plate, a frame body, and a first flange. The first flange is bent relative to the frame body and is fixedly connected to the base plate. The upper cover assembly is fixed to the shell. The plurality of light-emitting assemblies are disposed on the base plate. Any one of the plurality of conductive pins is electrically connected to a light-emitting assembly. The frame body includes a plurality of flanging holes. A depth of any one of the plurality of flanging holes is greater than a thickness of the frame body. A portion of the any one of the plurality of conductive pins is located at an outside of the accommodating space through a corresponding flanging hole.

公开(公告)号：US11894658B2

公开(公告)日：2024-02-06

申请号：US16204156

申请日：2018-11-29

申请人： Vixar Inc.

发明人： Klein L. Johnson ,  David Sandquist ,  Mary Brenner

IPC分类号： H01S5/42 ,  H01S5/0683 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/026 ,  H01S5/028 ,  H01S5/183 ,  H01S5/02212 ,  H01S5/34 ,  H01S5/00 ,  H01S5/02 ,  H01S5/02345

CPC分类号： H01S5/0683 ,  H01S5/0264 ,  H01S5/0287 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/18305 ,  H01S5/423 ,  H01S5/005 ,  H01S5/0217 ,  H01S5/02212 ,  H01S5/02345 ,  H01S5/183 ,  H01S5/18361 ,  H01S5/34

摘要： The present disclosure relates to an approach for monitoring the output power of a VCSEL or VCSEL array in a relatively compact, low profile package. A VCSEL device or VCSEL package of the present disclosure may generally be configured with a photodiode for monitoring output power of one or more VCSELs. In some embodiments, one or more VCSEL devices may be arranged over or on a photodetector, such that the photodetector is configured to detect light emitted through a bottom of the VCSEL. In such embodiments, the VCSEL device may have a patterned bottom metal layer and/or an etched substrate to allow light to pass below or behind the VCSEL to the photodiode. In other embodiments, a photodetector may be arranged on a submount adjacent one or more VCSELs, and may be configured to detect light reflected via a diffuser in order to monitor output power.

公开(公告)号：US11811190B2

公开(公告)日：2023-11-07

申请号：US17939275

申请日：2022-09-07

申请人： NICHIA CORPORATION

发明人： Tatsuya Kanazawa ,  Kazuma Kozuru

IPC分类号： H01S5/00 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/40 ,  H01S5/02255

CPC分类号： H01S5/02234 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02255 ,  H01S5/4031

摘要： A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.

公开(公告)号：US20230327394A1

公开(公告)日：2023-10-12

申请号：US18005876

申请日：2021-07-15

申请人： OSRAM OPTO SEMICONDUCTORS GMBH

发明人： Jörg Erich SORG ,  Roland HUETTINGER ,  Matthias HOFMANN ,  Steffen STRAUSS ,  Herbert BRUNNER ,  Ralph WAGNER

IPC分类号： H01S5/02257 ,  H01S5/02224

CPC分类号： H01S5/02257 ,  H01S5/02224 ,  H01S5/4093

摘要： In one embodiment, the optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip for generating radiation and a housing, in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing includes a housing cover which is secured to a housing main part by a connection means. The housing additionally includes a gas exchange channel which is hermetically sealed by a seal.