知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.011 秒)

    OPTOELECTRONIC SEMICONDUCTOR DEVICE WITH FIRST AND SECOND OPTOELECTRONIC ELEMENTS
    2.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR DEVICE WITH FIRST AND SECOND OPTOELECTRONIC ELEMENTS 有权

    公开(公告)号：US20210193860A1

    公开(公告)日：2021-06-24

    申请号：US17262238

    申请日：2019-07-23

    申请人： Osram OLED GmbH

    发明人： Florian Lex ,  Thomas Kippes ,  Michael Mueller ,  Fabian Knorr ,  Zeljko Pajkic

    IPC分类号： H01L31/173 ,  H01L31/0232 ,  H01S5/42 ,  H01S5/00

    摘要： An optoelectronic semiconductor device may include a first array of first optoelectronic components and a second array of second optoelectronic components arranged in a substrate. The first optoelectronic components may each include a first resonator mirror and a second resonator mirror where the first resonator mirror has a first main surface and an active area suitable for generating radiation. Each resonator mirror is arranged one above the other along a first direction where radiation emitted by the optoelectronic component is emitted via the first main surface. The first optoelectronic components are suitable for emitting electromagnetic radiation. The second optoelectronic components may each include an active area suitable for generating radiation and are suitable for absorbing electromagnetic radiation.

    Semiconductor Component and Method for Producing Semiconductor Components
    4.
    发明申请
    Semiconductor Component and Method for Producing Semiconductor Components 审中-公开

    公开(公告)号：US20200335430A1

    公开(公告)日：2020-10-22

    申请号：US16755826

    申请日：2018-10-11

    申请人： OSRAM OLED GMBH

    发明人： Michael Mueller

    IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56

    摘要： A semiconductor component and a method for producing semiconductor components are disclosed. In an embodiment a semiconductor component includes at least one semiconductor chip, a front side of the semiconductor component and a rear side of the semiconductor component opposite the front side, a lead frame having a first connection part and a second connection part and a molded body mechanically connecting the first connection part and the second connection part to one another, wherein the first connection part and the second connection part do not project or do not project substantially beyond the molded body in a plan view of the front side, and wherein the first connection part and the second connection part are respectively accessible for external electrical contacting of the semiconductor component at the front side and at the rear side.

    Method for Producing an Optoelectronic Component, Optoelectronic Component, and IR Detector
    5.
    发明申请
    Method for Producing an Optoelectronic Component, Optoelectronic Component, and IR Detector 审中-公开

    公开(公告)号：US20200295216A1

    公开(公告)日：2020-09-17

    申请号：US16642333

    申请日：2018-08-28

    申请人： OSRAM OLED GmbH

    发明人： Michael Mueller

    IPC分类号： H01L31/09 ,  H01L31/0203 ,  H01L31/173

    摘要： A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing an optoelectronic semiconductor chip with a radiation passage surface on a connection carrier, applying a deformable spacer to the radiation passage surface of the semiconductor chip, inserting the connection carrier with the semiconductor chip into a cavity of a tool, deforming, by the tool, the deformable spacer and encapsulating the semiconductor chip with a casting compound.