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公开(公告)号:US20240364081A1
公开(公告)日:2024-10-31
申请号:US18770721
申请日:2024-07-12
发明人: Sven Bader , Ulrich Weichmann
CPC分类号: H01S5/18311 , H01S5/0262 , H01S5/0421 , H01S5/18344 , H01S5/18377 , H01S5/2275
摘要: A method of producing a Vertical Cavity Surface Emitting Laser, including providing a layer stack of semiconductor layers including a first mirror, a second mirror, an active region between the first and second mirrors, an Al1-xGaxAs layer with 0≤x≤0.05, and a contact layer immediately adjacent to the Al1-xGaxAs layer. The method further includes etching the layer stack to obtain a first layer sub-stack forming a mesa and a second layer sub-stack adjacent to the mesa in a stacking direction of the layer stack. Layers of the second layer sub-stack extend beyond layers of the first layer sub-stack in a direction perpendicular to the stacking direction. The Al1-xGaxAs layer is used as an etch-stop layer. The method further includes removing an outer part of the Al1-xGaxAs layer to expose, at least partly, the contact layer, and oxidizing the Al1-xGaxAs layer to obtain an oxide aperture layer.
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公开(公告)号:US12126139B2
公开(公告)日:2024-10-22
申请号:US18165825
申请日:2023-02-07
发明人: Johnny Cai Tang , Petar Atanackovic
IPC分类号: H01S5/227 , H01L33/06 , H01L33/08 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/44 , H01S5/065 , H01S5/10 , H01S5/20 , H01S5/323 , H01L33/20 , H01L33/28 , H01S5/183 , H01S5/343
CPC分类号: H01S5/2275 , H01L33/06 , H01L33/08 , H01L33/10 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/44 , H01S5/0655 , H01S5/1064 , H01S5/2004 , H01S5/32341 , H01L33/105 , H01L33/20 , H01L33/28 , H01L2933/0016 , H01L2933/0066 , H01S5/183 , H01S5/34333
摘要: A light emitting device includes a first active layer on a substrate, a current spreading length, and a plurality of mesa regions on the first active layer. At least a first portion of the first active layer can comprise a first electrical polarity. Each mesa region can include, at least a second portion of the first active layer, a light emitting region on the second portion of the first active layer with a dimension parallel to the substrate smaller than twice the current spreading length, and a second active layer on the light emitting region. The light emitting region can be configured to emit light with a target wavelength from 200 nm to 300 nm. At least a portion of the second active layer can comprise a second electrical polarity.
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公开(公告)号:US12126136B2
公开(公告)日:2024-10-22
申请号:US17558614
申请日:2021-12-22
申请人: ABOCOM SYSTEMS, INC.
发明人: Cheng-Yi Ou , Chih-Yuan Lin , Te-Lieh Pan , Cheng-Hsiao Chi
CPC分类号: H01S5/18361 , H01S5/18311 , H01S5/3416 , H01S5/343
摘要: A vertical cavity surface emitting laser (VCSEL) device includes a substrate, a first mirror layer, a tunnel junction layer, a second mirror layer, an active layer, an oxide layer and a third mirror layer sequentially stacked with one another. The first mirror layer and the third mirror layer are N-type distributed Bragg reflectors (N-DBR), and the second mirror layer is P-type distributed Bragg reflector (P-DBR). The tunnel junction layer is provided for the VCSEL device to convert a part of the P-DBR into N-DBR to reduce the series resistance of the VCSEL device, and the tunnel junction layer is not used as current-limiting apertures. This disclosure further discloses a VCSEL device manufacturing method with the in-situ and one-time epitaxy features to avoid the risk of process variation caused by moving the device into and out from an epitaxial cavity.
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公开(公告)号:US12123769B2
公开(公告)日:2024-10-22
申请号:US17412739
申请日:2021-08-26
发明人: Scott Burroughs , Brent Fisher , James Carter
IPC分类号: G01J1/44 , F21V5/04 , G01S7/481 , G01S17/02 , G01S17/89 , G01S17/894 , G02B5/08 , G02B26/10 , H01L25/00 , H01L31/167 , H01L31/18 , H01S3/02 , H01S5/00 , H01S5/02253 , H01S5/02375 , H01S5/026 , H01S5/042 , H01S5/062 , H01S5/12 , H01S5/183 , H01S5/30 , H01S5/40 , H01S5/42 , G02B3/00 , H01S5/02 , H01S5/02255
CPC分类号: G01J1/44 , F21V5/041 , F21V5/045 , G01S7/4815 , G01S17/02 , G01S17/89 , G01S17/894 , G02B5/0883 , G02B26/10 , H01L25/50 , H01L31/167 , H01L31/18 , H01S3/025 , H01S5/0028 , H01S5/0071 , H01S5/02253 , H01S5/02375 , H01S5/026 , H01S5/0262 , H01S5/04254 , H01S5/062 , H01S5/12 , H01S5/183 , H01S5/18394 , H01S5/18397 , H01S5/30 , H01S5/40 , H01S5/4025 , H01S5/4037 , H01S5/4075 , H01S5/423 , G01J2001/448 , G02B3/0006 , H01S5/0216 , H01S5/0217 , H01S5/02255 , H01S5/04257
摘要: A laser diode includes a semiconductor structure of a lower Bragg reflector layer, an active region, and an upper Bragg reflector layer. The upper Bragg reflector layer includes a lasing aperture having an optical axis oriented perpendicular to a surface of the active region. The active region includes a first material, and the lower Bragg reflector layer includes a second material, where respective lattice structures of the first and second materials are independent of one another. Related laser arrays and methods of fabrication are also discussed.
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公开(公告)号:US20240348005A1
公开(公告)日:2024-10-17
申请号:US18134068
申请日:2023-04-13
发明人: Zhuojie Wu , Yusheng Bian , Koushik Ramachandran
IPC分类号: H01S5/024 , G02B6/42 , H01S5/02345 , H01S5/0236 , H01S5/0237 , H01S5/183
CPC分类号: H01S5/02469 , G02B6/4215 , H01S5/02345 , H01S5/0236 , H01S5/0237 , H01S5/18305
摘要: Structures including a photonics chip and a surface-mounted laser chip, and methods of forming same. The structure comprises a photonics chip including a surface, a laser chip including a light output and a body that are spaced from the surface of the photonics chip, a first adhesive between the body of the laser chip and the surface of the photonics chip, and a second adhesive between the body of the laser chip and the surface of the photonics chip. The light output is oriented toward the surface of the photonics chip, the first adhesive has a first thermal conductivity, the second adhesive has a second thermal conductivity that is less than the first thermal conductivity of the first adhesive, and the second adhesive is disposed in a light path between the light output of the laser chip and the surface of the photonics chip.
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公开(公告)号:US12119614B2
公开(公告)日:2024-10-15
申请号:US16978757
申请日:2019-02-28
发明人: Markus Lindemann , Nils Gerhardt , Martin Hofmann
CPC分类号: H01S5/0421 , H01L33/105 , H01S5/04252 , H01S5/04256 , H01S5/0607 , H01S5/18319
摘要: The invention relates to a device (2) for injecting spin-polarized electrons and for reflecting light, comprising at least one lattice structure (3) having a plurality of recesses (4), wherein the lattice structure (3) is designed to reflect the light, and wherein a respective injection contact (5, 6) for injecting spin-polarized electrons is arranged in at least some of the recesses (4).
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公开(公告)号:US20240339814A1
公开(公告)日:2024-10-10
申请号:US18131571
申请日:2023-04-06
申请人: II-VI Delaware, Inc.
IPC分类号: H01S5/183
CPC分类号: H01S5/1833 , H01S5/18311
摘要: A Vertical Cavity Surface-Emitting Laser has a body including a vertical stack of semiconductor layers one on top of the other including a current confinement layer having an area of low resistance to current flow defined by an area of high resistance to current flow, whereupon vertical current flow in the stack of semiconductor layers is directed by the area of high resistance to current flow of the current confinement layer through the area of low resistance to current flow of the current confinement layer. A separate light confinement layer is disposed below or above the current confinement layer. The light confinement layer includes one or more protrusions or recesses disposed below or above the area of low resistance to current flow of the current confinement layer.
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公开(公告)号:US20240339813A1
公开(公告)日:2024-10-10
申请号:US18580503
申请日:2022-03-09
发明人: Mikihiro YOKOZEKI , Hiroshi NAKAJIMA , Daiji KASAHARA , Michinori SHIOMI , Tomomasa WATANABE , Masayuki TANAKA
CPC分类号: H01S5/18327 , H01S5/042 , H01S5/18311 , H01S5/18344 , H01S5/343
摘要: A surface emitting device includes a semiconductor layer including a first crystal material, a reflection layer formed on the semiconductor layer, including a second crystal material of which a lattice constant or a crystal structure is different from the first crystal material, and having a mesa shape, and a light constriction region that is formed in a portion of the reflection layer and controls optical confinement.
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公开(公告)号:US12107388B2
公开(公告)日:2024-10-01
申请号:US17334836
申请日:2021-05-31
发明人: Ulrich Weichmann
CPC分类号: H01S5/0262 , H01S5/18361
摘要: A vertical cavity surface emitting laser (VCSEL) emits laser light. The VCSEL has an optical resonator and a photodiode. The optical resonator has: a first mirror, an active region configured to generate laser light, and a second mirror. The active region is arranged between the first mirror and the second mirror. The photodiode is integrated in the optical resonator. The photodiode has: an absorption region having a plurality of absorbing layers configured to absorb the generated laser light. The absorbing layers are arranged spaced apart from one another by a distance d which satisfies the condition: d=(2k−1)λ/(4 m). Where λ is the wavelength of the laser light in the absorption region, and k and m are natural numbers ≥1.
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公开(公告)号:US12107387B2
公开(公告)日:2024-10-01
申请号:US17266926
申请日:2018-08-22
发明人: Yang Wang
IPC分类号: H01S3/04 , H01S5/02234 , H01S5/0225 , H01S5/023 , H01S5/0233 , H01S5/02335 , H01S5/0234 , H01S5/02345 , H01S5/0235 , H01S5/024 , H01S5/183 , H01S5/42 , H01S5/02253
CPC分类号: H01S5/02469 , H01S5/02234 , H01S5/0225 , H01S5/023 , H01S5/0233 , H01S5/02335 , H01S5/0234 , H01S5/02345 , H01S5/0235 , H01S5/18305 , H01S5/423 , H01S5/02253 , H01S5/183
摘要: A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.
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