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公开(公告)号:US12107385B2
公开(公告)日:2024-10-01
申请号:US17111516
申请日:2020-12-04
发明人: Daisuke Iguchi , Kazuhiro Sakai
CPC分类号: H01S5/0233 , G01B11/24 , H01S5/423 , G06V40/166 , H01S5/18313 , H01S5/18361 , H01S5/3432 , H01S5/34353
摘要: A light emitting device includes a wiring board having a first wiring layer and a second wiring layer adjacent to the first wiring layer via an insulating layer, a laser having a cathode electrode and an anode electrode, mounted on the wiring board, and driven through low-side driving, and a capacitive element mounted on the wiring board and configured to supply a drive current to the laser. The first wiring layer includes a cathode wire connected to the cathode electrode, and an anode wire connected to the anode electrode. The second wiring layer includes a reference potential wire connected to a reference potential. The reference potential wire overlaps the anode wire. The anode wire surrounds the capacitive element.
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公开(公告)号:US20240222929A1
公开(公告)日:2024-07-04
申请号:US18496613
申请日:2023-10-27
发明人: Young-Tak HAN , Seok Jun YUN , Seo Young LEE , Sang Ho PARK , Yongsoon BAEK , Jang Uk SHIN , Dong-Hun LEE
IPC分类号: H01S5/0233 , H01S5/02315 , H01S5/026
CPC分类号: H01S5/0233 , H01S5/02315 , H01S5/0265 , H01S5/12
摘要: Provided is an optical communication device according to an embodiment of the inventive including a carrier substrate, a printed circuit board provided on one side of the carrier substrate in a first direction, electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate, an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board, and capacitors, which are provided on the interposer and each of which is shorter than each of the electro-absorption modulator-integrated laser chips and is thicker than the electro-absorption modulator-integrated laser chip.
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公开(公告)号:US20240213739A1
公开(公告)日:2024-06-27
申请号:US18600738
申请日:2024-03-10
申请人: NICHIA CORPORATION
发明人: Soichiro MIURA , Ryota OKUNO
IPC分类号: H01S5/02345 , H01S5/00 , H01S5/02255 , H01S5/023 , H01S5/02315 , H01S5/0233 , H01S5/042 , H01S5/40
CPC分类号: H01S5/02345 , H01S5/0071 , H01S5/02255 , H01S5/023 , H01S5/02315 , H01S5/0233 , H01S5/0425 , H01S5/4025
摘要: A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part.
The second semiconductor laser element is disposed closer to the second step-part. All of the wires that electrically connect the first semiconductor laser element to the frame part are not bonded to the upper surface of the second step-part. All of the wires that electrically connect the second semiconductor laser element to the frame part are not bonded to the upper surface of the first step-part.-
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公开(公告)号:US11973308B2
公开(公告)日:2024-04-30
申请号:US17103587
申请日:2020-11-24
发明人: James W. Raring , Paul Rudy , Eric Goutain , Troy Trottier , Melvin McLaurin , James Harrison , Sten Heikman , Michael Cantore
IPC分类号: H01S5/00 , F21K9/64 , H01S5/02212 , H01S5/02257 , H01S5/023 , H01S5/02315 , H01S5/02326 , H01S5/0233 , H01S5/32 , H01S5/343 , H01L33/00 , H01S5/02 , H01S5/02345 , H01S5/0235 , H01S5/22 , H01S5/40
CPC分类号: H01S5/0087 , F21K9/64 , H01S5/02257 , H01S5/023 , H01S5/02315 , H01S5/02326 , H01S5/0233 , H01S5/32 , H01S5/3203 , H01S5/34333 , H01L33/0045 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01S5/0202 , H01S5/0216 , H01S5/0217 , H01S5/02212 , H01S5/02345 , H01S5/0235 , H01S5/2201 , H01S5/320225 , H01S5/32025 , H01S5/320275 , H01S5/4056 , H01L2224/48091 , H01L2924/00014
摘要: The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source. The phosphor material is provided with a plurality of scattering centers scribed on an excitation surface or inside bulk of a plate to scatter electromagnetic radiation of a laser beam from the excitation source incident on the excitation surface to enhance generation and quality of an emitted light from the phosphor material for outputting a white light emission either in reflection mode or transmission mode.
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公开(公告)号:US11967803B2
公开(公告)日:2024-04-23
申请号:US17985997
申请日:2022-11-14
申请人: NICHIA CORPORATION
发明人: Kazuma Kozuru , Takuya Hashimoto
IPC分类号: H01S5/40 , G03B21/20 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/0237 , H01S5/02253 , H01S5/02255 , H01S5/02257 , H01S5/02325
CPC分类号: H01S5/4087 , G03B21/2013 , G03B21/2033 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/0237 , H01S5/4093 , H01S5/02253 , H01S5/02255 , H01S5/02257 , H01S5/02325
摘要: A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.
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公开(公告)号:US11940533B2
公开(公告)日:2024-03-26
申请号:US16556621
申请日:2019-08-30
申请人: Rohm Co., Ltd.
发明人: Yoshitsugu Uedaira
IPC分类号: G01S17/04 , G01S7/481 , G01S7/4865 , G01S7/497 , G01S17/06 , H01S5/023 , H01S5/0233 , H01S5/0683 , H01S5/183 , H01S5/02257 , H01S5/0235
CPC分类号: G01S17/04 , G01S7/4813 , G01S7/4816 , G01S7/4865 , G01S7/497 , G01S17/06 , H01S5/023 , H01S5/0233 , H01S5/0683 , H01S5/02257 , H01S5/0235 , H01S5/183
摘要: The present disclosure relates to a proximity sensor. The proximity sensor includes: a light emitter (for example, a vertical cavity surface emitting LASER (VCSEL)) configured to irradiate light to a target to be inspected; a first light receiver having a first crosstalk characteristic, configured to detect an external reflected light from a target to be inspected within a first detection region (for example, 0˜5 cm approximately); and a second light receiver having a second crosstalk characteristic different from the first crosstalk characteristic, configured to detect an external reflected light from a target to be inspected within a second detection region (for example, 3˜60 cm approximately) relatively further than the first detection region.
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公开(公告)号:US11831127B2
公开(公告)日:2023-11-28
申请号:US17817017
申请日:2022-08-03
申请人: Silanna Asia Pte Ltd
IPC分类号: H01S5/026 , H01S5/042 , H01S5/0233 , H03K17/687 , H01S5/42 , H01S5/40
CPC分类号: H01S5/0428 , H01S5/0233 , H01S5/0261 , H03K17/6871 , H01S5/4031 , H01S5/423
摘要: A laser diode driver includes a clock terminal to receive a clock signal, configuration terminals to receive configuration data, drive terminals, and charging terminals. A first charging terminal is operable to charge a source capacitor of a resonant circuit that includes the source capacitor, an inductor, and a bypass capacitor. Each drive terminal is operable to be directly electrically connected to an anode or cathode of a laser diode or to ground. A mode, output selection, and grouping of drive signals that are delivered to the laser diodes are configured based on the configuration data. The laser diode driver is operable to control a current flow through the resonant circuit to produce high-current pulses through the laser diodes, the high-current pulses corresponding to a peak current of a resonant waveform developed at respective anodes of the laser diodes, a timing of the high-current pulses being synchronized using the clock signal.
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公开(公告)号:US11749961B2
公开(公告)日:2023-09-05
申请号:US17697897
申请日:2022-03-17
申请人: NICHIA CORPORATION
发明人: Masatoshi Nakagaki , Soichiro Miura
IPC分类号: H01S5/02355 , H01S5/0239 , H01S5/40 , H01S5/0233 , H01S5/022 , H01S5/02345
CPC分类号: H01S5/0239 , H01S5/022 , H01S5/0233 , H01S5/02355 , H01S5/40 , H01S5/4031 , H01S5/02345
摘要: A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.
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公开(公告)号:US20230163560A1
公开(公告)日:2023-05-25
申请号:US17916897
申请日:2021-05-19
发明人: Masato OISHI , Shinichi AGATUMA
IPC分类号: H01S5/0233 , H01S5/42 , H01S5/02315
CPC分类号: H01S5/0233 , H01S5/423 , H01S5/02315 , H01L27/156
摘要: A light-emitting element array according to the present technology includes: a light-emitting element group; a first wire; and a second wire. The light-emitting element group includes a plurality of first light-emitting elements and a plurality of second light-emitting elements that are arrayed in a planar manner to form a light-emitting element surface. The first wire extends in a direction parallel to the light-emitting element surface, has a region overlapping with the plurality of first light-emitting elements and a region overlapping with the plurality of second light-emitting elements as viewed from a direction perpendicular to the light-emitting element surface, is electrically connected to the plurality of first light-emitting elements, and is not electrically connected to the plurality of second light-emitting elements. The second wire extends in a direction parallel to the light-emitting element surface, has a region overlapping with the plurality of first light-emitting elements and a region overlapping with the plurality of second light-emitting elements as viewed from a direction perpendicular to the light-emitting element surface, is electrically connected to the plurality of second light-emitting elements, and is not electrically connected to the plurality of first light-emitting elements.
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公开(公告)号:US20220278502A1
公开(公告)日:2022-09-01
申请号:US17747061
申请日:2022-05-18
发明人: Yubo LIN , Canhong DU
IPC分类号: H01S5/0233 , H01S5/042
摘要: A laser emitting apparatus includes: a drive assembly, a laser emitter, an energy storage module, and a circuit board. The laser emitter is a laser emitter die. An input end of the laser emitter is electrically connected to the energy storage module, and an output end is electrically connected to the drive assembly. The energy storage module is used to generate electrical signals required for driving the laser emitter. The drive assembly is used to output the driving signal to control the energy storage module and the external power supply to output the electrical signal to the laser emitter, so as to enable the laser emitter to emit laser. The drive assembly, the laser emitter, and the energy storage module are fixed on the circuit board, and a ground layer is arranged in the circuit board.
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