公开(公告)号：US20240055828A1

公开(公告)日：2024-02-15

申请号：US18495403

申请日：2023-10-26

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/02326

CPC分类号： H01S5/02326

摘要： A light emitting device includes: a laser element; a case enclosing the laser element, the case including a light-transmissive region configured to allow light emitted from the laser element to transmit through the light-transmissive region; a first lens configured to collimate or converge light emitted from the laser element; and a second lens that is disposed in the case and spaced apart from the first lens, the second lens located in an optical path between the laser element and the first lens. The second lens is spaced apart from the light-transmissive region such that an open space is located in the case between the light-transmissive region and the second lens.

公开(公告)号：US20230147991A1

公开(公告)日：2023-05-11

申请号：US18149241

申请日：2023-01-03

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/02326

CPC分类号： H01S5/02326

摘要： A light emitting device includes: a plurality of laser elements including a first laser element and a second laser element; a case enclosing the laser elements and including a light-transmissive region; and a plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first laser element and a second main lens configured to collimate or converge light emitted from the second laser element. At least a first portion of the light-transmissive region is disposed on a first imaginary line passing through a light emitting end surface of the first laser element and the first main lens, and at least a second portion of the light-transmissive region is disposed on a second imaginary line passing through a light emitting end surface of the second laser element and the second main lens.

公开(公告)号：US20220344894A1

公开(公告)日：2022-10-27

申请号：US17730060

申请日：2022-04-26

申请人： NICHIA CORPORATION

发明人： Ryota OKUNO

IPC分类号： H01S5/0237 ,  H01S5/02218

摘要： A method for manufacturing a light emitting device includes: disposing a light emitting element on a base member; providing a bonding agent to the base member or a lid member; and bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the lid member against the base member, increasing a distance between the base member and the lid member in a state in which the lid member is pressed against the base member, while maintaining a state in which the bonding agent contacts the base member and the lid member, and solidifying the bonding agent in a state in which the distance between the base member and the lid member is increased to bond the base member and the lid member.

公开(公告)号：US20220190224A1

公开(公告)日：2022-06-16

申请号：US17579449

申请日：2022-01-19

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU ,  Ryota OKUNO

IPC分类号： H01L33/62 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/10 ,  H01S5/00 ,  H01S5/022 ,  H01S5/02253

摘要： A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

公开(公告)号：US20230006416A1

公开(公告)日：2023-01-05

申请号：US17942922

申请日：2022-09-12

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/02345 ,  H01S5/40 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/042 ,  H01S5/00

摘要： A light emitting device includes a plurality of semiconductor laser elements, a frame part, a light-reflective member, a plurality of wires, and first and second protective elements. The frame part has a pair of first inner lateral surfaces and a second inner surface. The light-reflective member is configured to reflect laser light traveling from at least one of the plurality of semiconductor laser elements toward one of the first inner lateral surfaces of the frame part. The wires electrically connect the semiconductor laser elements respectively to an upper surface of the frame part. The first and second protective elements are disposed on the upper surface of the frame part in an area of the upper surface along the second inner surface. At least one of the wires is bonded on an area of the upper surface between the first and second protective elements.

公开(公告)号：US20210135426A1

公开(公告)日：2021-05-06

申请号：US17069299

申请日：2020-10-13

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/022

摘要： A light emitting device includes: a plurality of light emitting elements including a first light emitting element and a second light emitting element; a case enclosing the light emitting elements and comprising a light-transmissive region; a plurality of main lenses, each covering a portion of the light-transmissive region, the plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first light emitting element and a second main lens configured to collimate or converge light emitted from the second light emitting element; and a plurality of sub-lenses disposed in the case, the plurality of sub-lenses including a first sub-lens located in an optical path between the first light emitting element and the first main lens, and a second sub-lens located in an optical path between the second light emitting element and the second main lens.

公开(公告)号：US20190386192A1

公开(公告)日：2019-12-19

申请号：US16442114

申请日：2019-06-14

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU ,  Ryota OKUNO

IPC分类号： H01L33/62 ,  H01L33/00 ,  H01L33/10 ,  H01L33/60 ,  H01L33/50

摘要： A method of manufacturing a semiconductor device includes: a solder ball forming step comprising forming a plurality of solder balls at intervals on (i) a surface of a package surrounding a recess, or (ii) a surface of the light-transmissive member facing the surface of the package surrounding the recess (i) the surface of a light-transmissive member, or (ii) the surface of the package, into contact with an upper surface of the solder balls, which are softened, such that an air passage communicating with the recess is formed between the solder balls; and a bonding step comprising reducing a pressure in the recess via the air passage, and thereafter, in a state in which a gas for sealing is injected, heating and pressing the light-transmissive member and the package, to melt the solder balls and bond the light-transmissive member and the package.

公开(公告)号：US20240213739A1

公开(公告)日：2024-06-27

申请号：US18600738

申请日：2024-03-10

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/02345 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/042 ,  H01S5/40

CPC分类号： H01S5/02345 ,  H01S5/0071 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/0425 ,  H01S5/4025

摘要： A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part.
The second semiconductor laser element is disposed closer to the second step-part. All of the wires that electrically connect the first semiconductor laser element to the frame part are not bonded to the upper surface of the second step-part. All of the wires that electrically connect the second semiconductor laser element to the frame part are not bonded to the upper surface of the first step-part.

公开(公告)号：US20210005800A1

公开(公告)日：2021-01-07

申请号：US17025545

申请日：2020-09-18

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU ,  Ryota OKUNO

IPC分类号： H01L33/62 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/10 ,  H01S5/022 ,  H01S5/00

摘要： A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

公开(公告)号：US20200235548A1

公开(公告)日：2020-07-23

申请号：US16748246

申请日：2020-01-21

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Ryota OKUNO

IPC分类号： H01S5/022 ,  H01S5/40

摘要： A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.