公开(公告)号：US12057677B2

公开(公告)日：2024-08-06

申请号：US17138907

申请日：2020-12-31

申请人： FUJIFILM Business Innovation Corp.

发明人： Daisuke Iguchi

IPC分类号： H01S5/042 ,  G06V20/64 ,  G06V40/16 ,  H01L31/12 ,  H01S5/02345 ,  H01S5/024 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42

CPC分类号： H01S5/0428 ,  G06V20/64 ,  G06V40/166 ,  H01L31/12 ,  H01S5/02345 ,  H01S5/02469 ,  H01S5/18311 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423

摘要： A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element provided on a front surface side of the base member; a first rear surface wire that is provided on a rear surface side of the base member and is connected to one of a cathode electrode and an anode electrode of the light-emitting element; a second rear surface wire that is provided on the rear surface side of the base member and is connected to the other one of the cathode electrode and the anode electrode; and a reference potential wire that is provided on the rear surface side of the base member and is connected to an external reference potential.

公开(公告)号：US12044956B2

公开(公告)日：2024-07-23

申请号：US17268288

申请日：2019-07-26

申请人： Sony Corporation

发明人： Hisayoshi Motobayashi ,  Hidekazu Kawanishi ,  Yoshiro Takiguchi ,  Masahiro Murayama ,  Hiroyuki Miyahara ,  Hitoshi Domon

IPC分类号： G03B21/20 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/323 ,  H01S5/40

CPC分类号： G03B21/2033 ,  G03B21/208 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

摘要： A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.

公开(公告)号：US20240170913A1

公开(公告)日：2024-05-23

申请号：US17990221

申请日：2022-11-18

申请人： HIGH POWER OPTO. INC.

发明人： Chih-Sung CHANG ,  Wei-Yu YEN ,  Wayne JAN ,  Tau-Jin WU

IPC分类号： H01S5/024 ,  H01S5/0236 ,  H01S5/028 ,  H01S5/183

CPC分类号： H01S5/02469 ,  H01S5/0236 ,  H01S5/02476 ,  H01S5/028 ,  H01S5/18308 ,  H01S5/18375

摘要： A surface light emitting element with high heat dissipation and uniform light emission includes a metal reflective layer, a first metal conductive layer, an omnidirectional reflecting current isolation layer, a first-type semiconductor current spreading layer, a light emitting diode layer, a second-type semiconductor current spreading layer and a second metal conductive layer. The metal reflective layer includes at least one surrounding wall structure. The omnidirectional reflecting current isolation layer is arranged on the metal reflective layer and entirely covers the two sides of the at least one surrounding wall structure to form at least one cylindrical channel. The light emitting diode layer is located in the at least one cylindrical channel.

公开(公告)号：US20240146033A1

公开(公告)日：2024-05-02

申请号：US18279953

申请日：2022-02-10

申请人： HAMAMATSU PHOTONICS K.K.

发明人： Yuma HATANO ,  Takashi SEKINE ,  Yuki MURAMATSU ,  Yoshinori TAMAOKI

IPC分类号： H01S5/40 ,  H01S5/02255 ,  H01S5/024 ,  H01S5/042

CPC分类号： H01S5/4012 ,  H01S5/02255 ,  H01S5/02469 ,  H01S5/04256

摘要： A laser device includes a support, a first heat sink, a plurality of laser light sources attached to the support, and a plurality of electrodes bridged between the plurality of laser light sources and the first heat sink. Each of the plurality of laser light sources is movable with respect to the support. Each of the plurality of electrodes is electrically connected to one of the plurality of laser light sources at a first connection portion, and is thermally connected to the first heat sink at a second connection portion. In each of the plurality of electrodes, an extension part between the first connection portion and the second connection portion has flexibility, and a length of the extension part is larger than a linear distance between the first connection portion and the second connection portion.

公开(公告)号：US11972992B2

公开(公告)日：2024-04-30

申请号：US17281608

申请日：2019-07-17

申请人： KYOCERA Corporation

发明人： Takafumi Yamaguchi ,  Toshifumi Higashi ,  Youji Furukubo

IPC分类号： H01S5/023 ,  H01L23/13 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/024

CPC分类号： H01L23/13 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/023 ,  H01S5/02469

摘要： A substrate for mounting an electronic component according to an aspect of an embodiment includes a base that is a plate-shaped body, where a first surface of the base is sloped relative to a second surface that is opposed to the first surface, and when the base is bisected into a lower part and a higher part in a slope direction thereof, a thermal conductivity of the lower part is higher than a thermal conductivity of the higher part.

公开(公告)号：US20240106199A1

公开(公告)日：2024-03-28

申请号：US18465452

申请日：2023-09-12

申请人： Taiwan-Asia Semiconductor Corporation

发明人： Chuan-Wei CHEN

IPC分类号： H01S5/183

CPC分类号： H01S5/18375 ,  H01S5/02469

摘要： The surface-emitting laser with a multilayer thermally conductive mirror includes a light-emitting layer, an oxide layer, first and second mirror layers, and first and second contact layers. The light-emitting layer generates light with a wavelength of A. The oxide layer has an oxide aperture to limit the current flowing into the light-emitting layer. The first mirror layer includes a first high thermally conductive layer and a first low thermally conductive layer. The second mirror layer includes a second high thermally conductive layer and a second low thermally conductive layer. The first contact layer is disposed of on one side of the first mirror layer by the first low thermally conductive layer. The second contact layer is disposed on one side of the second mirror layer by the second high thermally conductive layer. The overall light emission and heat dissipation efficiency can be improved.

公开(公告)号：US11867813B2

公开(公告)日：2024-01-09

申请号：US17690200

申请日：2022-03-09

申请人： KYOCERA SLD Laser, Inc.

发明人： James W. Raring ,  Melvin McLaurin ,  Paul Rudy ,  Vlad Novotny

IPC分类号： G01S17/86 ,  G01S17/10 ,  G01S17/89 ,  G01S7/481 ,  F21K9/64 ,  H01S5/00 ,  H01S5/024 ,  F21V29/70 ,  G01S7/487 ,  H01S5/02212 ,  H01S5/343 ,  H01S5/40 ,  G01S17/931 ,  H01S5/02251 ,  H01S5/02325 ,  H01S5/02375 ,  H01S5/028 ,  H01S5/22 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/02345

CPC分类号： G01S17/10 ,  F21K9/64 ,  F21V29/70 ,  G01S7/487 ,  G01S7/4817 ,  G01S17/86 ,  G01S17/89 ,  G01S17/931 ,  H01S5/0085 ,  H01S5/02212 ,  H01S5/02251 ,  H01S5/02325 ,  H01S5/02375 ,  H01S5/02469 ,  H01S5/34333 ,  H01S5/4012 ,  H01S5/0215 ,  H01S5/0217 ,  H01S5/0287 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/22 ,  H01S5/4031

摘要： A distance detecting system for use in mobile machines comprises a gallium and nitrogen containing laser diode disposed within a light of a mobile machine. The gallium and nitrogen containing laser diode is configured to emit a first light with a first peak wavelength. A wavelength conversion member is configured to produce a white light. A first sensing light signal is based on the first peak wavelength. One or more optical elements are configured to direct at least partially the white light to illuminate one or more target objects or areas and to transmit respectively the first sensing light signal for sensing at least one remote point. A detector is configured to detect reflected signals of the first sensing light signal to determine coordinates of the at least one remote point.

公开(公告)号：US11848534B2

公开(公告)日：2023-12-19

申请号：US15529371

申请日：2015-11-24

申请人： Evolve Additive Solutions, Inc.

发明人： J. Samuel Batchelder ,  Moshe Aknin ,  Jonathan B. Hedlund

IPC分类号： H01S5/024 ,  B33Y30/00 ,  B33Y10/00 ,  B29C64/386 ,  B29C64/268 ,  B29C64/393 ,  H01S5/00 ,  H01S5/40 ,  H01S5/02 ,  B29C64/135 ,  H01S5/02325 ,  B33Y50/02 ,  H01S5/042 ,  H01S5/02212 ,  B29K105/24

CPC分类号： H01S5/02469 ,  B29C64/135 ,  B29C64/268 ,  B29C64/386 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  H01S5/005 ,  H01S5/02 ,  H01S5/02325 ,  H01S5/02423 ,  H01S5/042 ,  H01S5/405 ,  H01S5/4025 ,  B29K2105/24 ,  H01L2224/48091 ,  H01S5/02212 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A laser assembly for use with an additive manufacturing system, which includes a base block configured to be moved along a scan direction axis in the additive manufacturing system, a plurality of laser emitters preferably arranged in an array of at least two rows of two or more laser emitters. At least a portion of a heat sink assembly is configured to draw heat away from the base block and/or the laser emitters. The assembly includes a controller assembly a controller assembly configured to control a movement of the base block along the first axis and to independently control at least timing and duration of energy emitted from each laser emitter of the plurality of laser emitters as the base block moves along the first axis.

公开(公告)号：US11811192B2

公开(公告)日：2023-11-07

申请号：US17254612

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024

CPC分类号： H01S5/024 ,  H01S5/02415 ,  H01S5/02469

摘要： A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.

公开(公告)号：US11805599B2

公开(公告)日：2023-10-31

申请号：US17638075

申请日：2020-06-29

申请人： KYOCERA Corporation

发明人： Yoshio Kuramoto

IPC分类号： H05K1/03 ,  H01S5/02315 ,  H01S5/02 ,  H01S5/02208 ,  H01L33/48 ,  H01S5/024

CPC分类号： H05K1/0306 ,  H01S5/0206 ,  H01S5/02208 ,  H01S5/02315 ,  H01L33/486 ,  H01S5/02469

摘要： An electronic device (1, and 1A to 1E) according to the present disclosure include a substrate (10, and 10F) made of a ceramic and a housing part (21) including a recessed portion (210) accommodating the substrate. The recessed portion includes a plurality of side wall portions (211) arranged around the substrate along a circumferential direction and respectively facing a plurality of sides (111) of the substrate in a plan view when viewing the substrate from a direction perpendicular to a circuit forming surface (110) of the substrate, and a plurality of gaps (212) each located between two of the plurality of side wall portions adjacent to each other in the circumferential direction. The substrate includes a plurality of corner portions (112) curved toward an inner side of the circuit forming surface in a plan view.