公开(公告)号：US11811192B2

公开(公告)日：2023-11-07

申请号：US17254612

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024

CPC分类号： H01S5/024 ,  H01S5/02415 ,  H01S5/02469

摘要： A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.

公开(公告)号：US20210119413A1

公开(公告)日：2021-04-22

申请号：US17254625

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024 ,  H01S5/0237

摘要： A diode laser arrangement includes at least one emitter, first and second cooling devices and a first connecting layer. The emitter is configured to emit a laser beam and is disposed between the first and second cooling devices. The first and second cooling devices are each configured for cooling the emitter. The emitter is connected to the first cooling device by the first connecting layer, and the first connecting layer has a connecting material or is composed of a connecting material selected from a group including gold, a gold alloy, silver, a silver alloy, a silver sintered material, copper, a copper alloy, nickel, a nickel alloy, palladium, a palladium alloy, platinum, a platinum alloy, rhodium, a rhodium alloy, iridium, an iridium alloy, germanium, a germanium alloy, tin, a tin alloy, aluminum, an aluminum alloy, indium, an indium alloy, lead and a lead alloy.

公开(公告)号：US11973313B2

公开(公告)日：2024-04-30

申请号：US17254625

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024 ,  H01S5/0237

CPC分类号： H01S5/02423 ,  H01S5/0237

摘要： A diode laser arrangement includes at least one emitter, first and second cooling devices and a first connecting layer. The emitter is configured to emit a laser beam and is disposed between the first and second cooling devices. The first and second cooling devices are each configured for cooling the emitter. The emitter is connected to the first cooling device by the first connecting layer, and the first connecting layer has a connecting material or is composed of a connecting material selected from a group including gold, a gold alloy, silver, a silver alloy, a silver sintered material, copper, a copper alloy, nickel, a nickel alloy, palladium, a palladium alloy, platinum, a platinum alloy, rhodium, a rhodium alloy, iridium, an iridium alloy, germanium, a germanium alloy, tin, a tin alloy, aluminum, an aluminum alloy, indium, an indium alloy, lead and a lead alloy.

公开(公告)号：US20210257807A1

公开(公告)日：2021-08-19

申请号：US17254612

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024

摘要： A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.

公开(公告)号：US11824324B2

公开(公告)日：2023-11-21

申请号：US17254619

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024

CPC分类号： H01S5/02423 ,  H01S5/02476

摘要： A diode laser arrangement has a diode laser device and at least one cooling device. The at least one cooling device is arranged on the diode laser device. The at least one cooling device is configured to cool the diode laser device. The at least one cooling device has a contact body and at least one heat conducting insert. The contact body contains a first material or consisting of a first material, and the at least one heat conducting insert has a second material, which is different from the first material, or consisting of a second material, which is different from the first material, and the contact body is arranged on the diode laser device. The at least one heat conducting insert is embedded in the contact body.

公开(公告)号：US20210119412A1

公开(公告)日：2021-04-22

申请号：US17254619

申请日：2019-06-18

申请人： TRUMPF Photonics, Inc.

发明人： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC分类号： H01S5/024

摘要： A diode laser arrangement has a diode laser device and at least one cooling device. The at least one cooling device is arranged on the diode laser device. The at least one cooling device is configured to cool the diode laser device. The at least one cooling device has a contact body and at least one heat conducting insert. The contact body contains a first material or consisting of a first material, and the at least one heat conducting insert has a second material, which is different from the first material, or consisting of a second material, which is different from the first material, and the contact body is arranged on the diode laser device. The at least one heat conducting insert is embedded in the contact body.