公开(公告)号：US12211853B2

公开(公告)日：2025-01-28

申请号：US18326841

申请日：2023-05-31

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. Zhang

IPC: H01L27/12 ,  H01L21/266 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/528 ,  H01L27/092 ,  H01L29/06 ,  H01L29/161 ,  H01L29/66 ,  H01L29/78 ,  H10B10/00 ,  H10B20/00

Abstract: Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

公开(公告)号：US20240345644A1

公开(公告)日：2024-10-17

申请号：US18638354

申请日：2024-04-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics, Inc.

Inventor： Olivier Lemarchand ,  Pierre-Loic Felter ,  Darin K. Winterton ,  Kalyan-Kumar Vadlamudi-Reddy

IPC: G06F1/3231 ,  G01S7/41 ,  G01S13/56

CPC classification number: G06F1/3231 ,  G01S7/415 ,  G01S13/56

Abstract: In accordance with embodiments, methods and systems for utilizing multiple threshold checkers are provided. A range sensor collects measurement data. The range sensor examines the measurement data based on multiple threshold checkers to determine satisfaction of a trigger condition. In response to the satisfaction of the trigger condition, the range sensor provides the measurement data to a host computing device of the range sensor.

公开(公告)号：US20240244406A1

公开(公告)日：2024-07-18

申请号：US18617533

申请日：2024-03-26

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS, INC.

Inventor： Karimuddin SAYED ,  Chandandeep Singh PABLA ,  Lorenzo BRACCO ,  Federico RIZZARDINI

IPC: H04W4/38 ,  G01D5/244 ,  G01D9/00 ,  H04W4/70

CPC classification number: H04W4/38 ,  G01D5/24404 ,  G01D9/005 ,  H04W4/70

Abstract: In an embodiment, a device comprises a memory, which, in operation, stores data samples associated with a plurality of data sensors, and circuitry, coupled to the memory, wherein the circuitry, in operation, generates synchronized output data sets associated with the plurality of data sensors. Generating a synchronized output data set includes: determining a reference sample associated with a sensor of the plurality of sensors; verifying a timing validity of a data sample associated with another sensor of the plurality of sensors; identifying a closest-in-time data sample associated with the another sensor of the plurality of sensors with respect to the reference sample; and generating the synchronized output data set based on interpolation.

公开(公告)号：US11921655B2

公开(公告)日：2024-03-05

申请号：US17307893

申请日：2021-05-04

Applicant: STMICROELECTRONICS, INC.

Inventor： Massimo Panzica ,  Maurizio Gentili

IPC: G06F13/28 ,  G06F13/24 ,  H04L9/32

CPC classification number: G06F13/28 ,  G06F13/24 ,  H04L9/3247 ,  G06F2213/24 ,  G06F2213/28

Abstract: A microcontroller includes a memory, direct memory access (DMA) controllers and a microprocessor. The microprocessor maintains one or more memory protection (MP) configurations to control access to protected memory areas of the microcontroller. In response to a secure service call of an unsecure user-application, the microprocessor executes a state machine which disables interrupt requests, determining whether DMA controller configurations and MP configurations satisfy secure-service criteria. When the secure-service criteria are satisfied, at least one secure operation associated with the secure service call is performed, and memory areas accessed during the execution of the at least one secure operation are cleaned. The interrupt requests are re-enabled and a response to the secure service call is generated.

公开(公告)号：US11848256B2

公开(公告)日：2023-12-19

申请号：US17510079

申请日：2021-10-25

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4828 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247

Abstract: Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.

公开(公告)号：US20230400904A1

公开(公告)日：2023-12-14

申请号：US17806813

申请日：2022-06-14

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS (BEIJING) R&D CO. LTD ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Arnaud Deleule ,  Kalyan-Kumar Vadlamudi-Reddy ,  Darin K Winterton ,  Jihong Chen ,  Olivier Lemarchand

IPC: G06F1/3231 ,  G06F1/3234 ,  G01S13/08

CPC classification number: G06F1/3231 ,  G06F1/3265 ,  G01S13/08

Abstract: A method for operating an electronic device includes while a display is in low power mode, detecting based on data collected by a time of flight (ToF) sensor, a movable object within a field of view of the electronic device; in response to the detecting initiating a period of detection having a plurality of frames, the period of detection being a time period over which a distance value indicative of a distance between the movable object and the display is detected; for each of the plurality of frames, changing the distance value to reflect whether the movable object is moving near or further from the electronic device; detecting that the distance value after the period of detection is less than a threshold distance value indicative of the movable object approaching the display; if the distance value is less than the threshold distance value, waking up the display.

公开(公告)号：US11808063B2

公开(公告)日：2023-11-07

申请号：US18178201

申请日：2023-03-03

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Williamson Sy ,  Emiliano Mario Piccinelli ,  Keith Walters

IPC: E05B81/90 ,  E05B77/54 ,  E05B81/46 ,  E05B81/56 ,  E05B81/80 ,  B60R25/24 ,  E05B77/02

CPC classification number: E05B81/90 ,  E05B77/54 ,  E05B81/46 ,  E05B81/56 ,  E05B81/80 ,  B60R25/24 ,  E05B77/02 ,  E05Y2900/531

Abstract: A method and device for unlatching a door from a frame, using a keyless door latch system, is provided. In one embodiment, a secondary unlocking component receives a signal and derives power from the signal to provide a power source for the keyless door latch system. A microcontroller generates a control signal and an actuator, in response to receiving the control signal, actuates the secondary unlocking component, which allows an energy source, from an exterior of the door, to be transferred to the keyless door latch system for the unlatching of the door.

公开(公告)号：US20230273024A1

公开(公告)日：2023-08-31

申请号：US18136088

申请日：2023-04-18

Applicant: STMicroelectronics, Inc.

Inventor： Deyou FANG ,  Chao-Ming TSAI ,  Milad ALWARDI ,  Yamu HU ,  David MCCLURE

IPC: G01C19/5726 ,  G01C25/00 ,  G01C19/5733

CPC classification number: G01C19/5726 ,  G01C19/5733 ,  G01C25/005

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

公开(公告)号：US11664415B2

公开(公告)日：2023-05-30

申请号：US17373586

申请日：2021-07-12

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. Zhang

IPC: H01L21/02 ,  H01L21/28 ,  H01L49/02 ,  H01L27/108 ,  H01L27/11507

CPC classification number: H01L28/56 ,  H01L21/02197 ,  H01L27/108 ,  H01L27/10805 ,  H01L27/10844 ,  H01L27/11507 ,  H01L28/55 ,  H01L28/60 ,  H01L28/65 ,  H01L29/40111

Abstract: An interconnect structure for use in coupling transistors in an integrated circuit is disclosed, including various configurations in which ferroelectric capacitors exhibiting negative capacitance are coupled in series with dielectric capacitors. In one embodiment, the negative capacitor includes a dielectric/ferroelectric bi-layer. When a negative capacitor is electrically coupled in series with a conventional dielectric capacitor, the series combination behaves like a stable ferroelectric capacitor for which the overall capacitance can be measured experimentally, and tuned to a desired value. The composite capacitance of a dielectric capacitor and a ferroelectric capacitor having negative capacitance coupled in series is, in theory, infinite, and in practice, very large. A series combination of positive and negative capacitors within a microelectronic interconnect structure can be used to make high capacity DRAM memory cells.

公开(公告)号：US11664239B2

公开(公告)日：2023-05-30

申请号：US17317818

申请日：2021-05-11

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Talledo

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/562 ,  H01L24/29

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.