公开(公告)号：US20240038698A1

公开(公告)日：2024-02-01

申请号：US18206579

申请日：2023-06-06

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Erh-Ju LIN

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L24/48 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/48458 ,  H01L2224/48453 ,  H01L2924/3651 ,  H01L2224/05647 ,  H01L2224/05547 ,  H01L2224/05557

摘要： A package structure is provided. The package structure includes a substrate, a conductive pad, and a conductive wire. The conductive pad is disposed over the substrate. The conductive wire includes an end portion connected to the conductive pad, wherein a grain arrangement of the end portion is distinct from a grain arrangement of the conductive pad.