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公开(公告)号：US12057427B2
公开(公告)日：2024-08-06
申请号：US17913441
申请日：2021-02-22
申请人： SHINKAWA LTD.
发明人： Osamu Kakutani , Shigeru Hayata
IPC分类号： B23K20/00 , B23K20/10 , H01L23/00 , B23K101/40
CPC分类号： H01L24/78 , B23K20/004 , B23K20/10 , B23K2101/40 , H01L2224/78353 , H01L2224/78822 , H01L2224/78824 , H01L2924/40
摘要： A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.
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公开(公告)号：US11908827B2
公开(公告)日：2024-02-20
申请号：US17435041
申请日：2020-03-04
申请人： SHINKAWA LTD.
发明人： Naoki Sekine , Yasuo Nagashima
IPC分类号： B23K20/00 , H01L23/00 , B23K101/40
CPC分类号： H01L24/78 , B23K20/005 , B23K2101/40 , H01L2224/7855 , H01L2224/78611 , H01L2224/78824 , H01L2224/78901
摘要： A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.
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公开(公告)号：US20240250063A1
公开(公告)日：2024-07-25
申请号：US18412719
申请日：2024-01-15
发明人： Hui Xu , Gary S. Gillotti
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/43 , H01L24/78 , H01L2224/432 , H01L2224/437 , H01L2224/78824 , H01L2224/859
摘要： A method of operating a wire bonding machine is provided. The method includes the steps of: (a) attempting to bond a free air ball to a first bonding location using a wire bonding tool; (b) detecting that the free air ball was not properly bonded to the first bonding location in step (a); (c) bonding the free air ball to a second bonding location; (d) raising the wire bonding tool, with a wire engaged with the wire bonding tool continuous with the bonded free air ball, to a position above the bonded free air ball; (e) weakening a neck portion of a wire above the free air ball after step (d); and (f) separating the bonded free air ball from the wire after step (e) such that a wire tail extends below a tip of a wire bonding tool.
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公开(公告)号：US20170309503A1
公开(公告)日：2017-10-26
申请号：US15624717
申请日：2017-06-16
申请人： SHINKAWA LTD.
发明人： Kohei SEYAMA
CPC分类号： H01L21/67144 , H01L21/67259 , H01L24/78 , H01L2224/78824 , H01L2224/78901 , H01L2224/78981 , H02K11/21 , H02K41/02 , H02K41/031 , H02K2201/18 , H05K13/0406
摘要： The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a Y-direction load receiver installed on the secondary pedestal in a manner movable in the X direction and immovable in the Y direction, in which an X-direction stator is attached to the secondary pedestal, and in which one end of a Y-direction stator attached to the gantry frame and the Y-direction load receiver are connected using a connection member, thereby suppressing vibration of the primary pedestal caused when the plurality of mounting heads are moved in the X and Y directions.
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公开(公告)号：US12107070B2
公开(公告)日：2024-10-01
申请号：US17435696
申请日：2020-07-15
申请人： SHINKAWA LTD.
发明人： Hiroaki Yoshino , Shinsuke Tei
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/78 , H01L24/48 , H01L2224/48465 , H01L2224/78611 , H01L2224/78824 , H01L2224/85201 , H01L2224/85986
摘要： Provided is a method for manufacturing a semiconductor device which connects a first bond point and a second bond point by a wire. The method includes: a ball bonding step in which a crimping ball and a ball neck are formed at the first bond point by ball bonding; a thin-walled portion forming step in which a thin-walled portion having a reduced cross-sectional area is formed between the ball neck and the crimping ball; a wire tail separating step in which after a capillary is raised to unroll a wire tail, the capillary is moved in a direction to the second bond point, and the wire tail and the crimping ball are separated in the thin-walled portion; and a wire tail joining step in which the capillary is lowered and a side surface of the separated wire tail is joined onto the crimping ball.
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公开(公告)号：US09865562B2
公开(公告)日：2018-01-09
申请号：US15104410
申请日：2015-02-19
申请人： KAIJO CORPORATION
发明人： Akio Sugito
CPC分类号： H01L24/78 , B23K20/005 , B23K20/02 , B23K20/106 , H01L2224/45015 , H01L2224/45099 , H01L2224/78301 , H01L2224/78349 , H01L2224/78824 , H01L2224/78901 , H01L2924/00014 , H01L2924/207 , H01L2224/05599
摘要： To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.
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公开(公告)号：US20170005065A1
公开(公告)日：2017-01-05
申请号：US15104410
申请日：2015-02-19
申请人： KAIJO CORPORATION
发明人： Akio SUGITO
CPC分类号： H01L24/78 , B23K20/005 , B23K20/02 , B23K20/106 , H01L2224/45015 , H01L2224/45099 , H01L2224/78301 , H01L2224/78349 , H01L2224/78824 , H01L2224/78901 , H01L2924/00014 , H01L2924/207 , H01L2224/05599
摘要： [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.[Solution] The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.
摘要翻译： [解决方案]接合装置设置有振动驱动部分（7），振动驱动部分（7）包括分别沿着接合臂（3）的轴向方向膨胀和收缩的多个压电元件（10） 其一端固定在所述接合臂（3）的前端，多个毛细管保持部（15）分别与毛细管（20）的基端侧的周面接触，固定 对应于压电元件（10）的另一端，以及将毛细管（20）压在毛细管保持部（15）上的毛细管（20）的夹持部（21）的至少一端 固定到所述接合臂（3），所述另一端侧在与所述毛细管保持部（15）相对的一侧的基端侧与所述毛细管（20）的周面接触。 这里，对相应的压电元件的驱动电压波形进行振幅，相位，频率或波形的功能操作。
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公开(公告)号：US11961819B2
公开(公告)日：2024-04-16
申请号：US17435041
申请日：2020-03-04
申请人： SHINKAWA LTD.
发明人： Naoki Sekine , Yasuo Nagashima
IPC分类号： B23K20/00 , H01L23/00 , B23K101/40
CPC分类号： H01L24/78 , B23K20/005 , B23K2101/40 , H01L2224/7855 , H01L2224/78611 , H01L2224/78824 , H01L2224/78901
摘要： A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.
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公开(公告)号：US20230178510A1
公开(公告)日：2023-06-08
申请号：US18008179
申请日：2021-06-01
申请人： SHINKAWA LTD.
发明人： Shigeru HAYATA
CPC分类号： H01L24/78 , B23K1/0016 , H01L2224/78753 , H01L2224/78901 , H01L2224/78804 , H01L2224/78001 , H01L2224/78353 , H01L2224/78824 , G02B27/144
摘要： A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.
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公开(公告)号：US20180218995A1
公开(公告)日：2018-08-02
申请号：US15877846
申请日：2018-01-23
申请人： NICHIA CORPORATION
发明人： Yuji KOJIMA
CPC分类号： H01L24/78 , H01L24/48 , H01L24/49 , H01L24/85 , H01L33/52 , H01L33/62 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49052 , H01L2224/78824 , H01L2924/3512 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method for manufacturing a light-emitting device includes: a first connecting step of forming a ball portion of the wire joined to a first connecting point on a light emitting element; a first transferring step of transferring the capillary to a first point located in a +Z direction above the first connecting point; a second transferring step of transferring the capillary from the first point to a second point located in a −X direction opposite from a second connecting point on the substrate; a third transferring step of transferring the capillary from the second point to a third point located in a +X direction beyond the second connecting point and in the +Z direction above the second connecting point; a second connecting step of transferring the capillary and joining the wire to the second connecting point; and forming an encapsulating member to encapsulate the wire.
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