公开(公告)号：US20240162073A1

公开(公告)日：2024-05-16

申请号：US18015714

申请日：2021-11-16

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA

IPC分类号： H01L21/68 ,  H01L21/67

CPC分类号： H01L21/681 ,  H01L21/67144 ,  H01L21/67248

摘要： A mounting apparatus obtains calibration values for calibrating a difference between coordinate values based on top-view and bottom-view images, for each assumed placement height of a planned placement area of a mounting body. A calibration controller calculates calibration values based on the top-view and bottom-view images from a bottom-view imaging unit and top-view imaging units employing a Scheimpflug optical system by imaging a calibration index matching the placement height. A mounting controller adjusts a position of a mounting tool so that a planned contact surface of the mounting body is at the placement height to recognize a reference position based on the bottom-view image, and adjusts positions of the top-view imaging units so that the focal plane falls on the same plane as the placement height to recognize a target position based on the top-view images of the planned placement area and the calibration values corresponding to the placement height.

公开(公告)号：US20230274951A1

公开(公告)日：2023-08-31

申请号：US18015073

申请日：2020-08-05

申请人： SHINKAWA LTD.

发明人： Yuichiro NOGUCHI ,  Alexander DZHANGIROV ,  Kohei SEYAMA

IPC分类号： H01L21/603 ,  H01L21/52 ,  H01L23/00

CPC分类号： H01L21/603 ,  H01L21/52 ,  H01L24/08 ,  H01L24/24 ,  H01L24/73 ,  H01L2021/6015

摘要： In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), and for heating and then cooling the thermocompression tool (16) to mount the semiconductor chip (100) on the substrate (104); and a separator for heating the thermocompression tool (16) after the semiconductor chip (100) has been mounted, and for raising a mounting head (17) to be separated from the cover film (110).

公开(公告)号：US20230154775A1

公开(公告)日：2023-05-18

申请号：US17915094

申请日：2020-12-14

申请人： SHINKAWA LTD.

发明人： Yuji EGUCHI ,  Kohei SEYAMA

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67259 ,  H01L21/67132 ,  H01L21/68764

摘要： A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.

公开(公告)号：US20170309503A1

公开(公告)日：2017-10-26

申请号：US15624717

申请日：2017-06-16

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA

IPC分类号： H01L21/67 ,  H02K41/02 ,  H01L23/00

CPC分类号： H01L21/67144 ,  H01L21/67259 ,  H01L24/78 ,  H01L2224/78824 ,  H01L2224/78901 ,  H01L2224/78981 ,  H02K11/21 ,  H02K41/02 ,  H02K41/031 ,  H02K2201/18 ,  H05K13/0406

摘要： The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a Y-direction load receiver installed on the secondary pedestal in a manner movable in the X direction and immovable in the Y direction, in which an X-direction stator is attached to the secondary pedestal, and in which one end of a Y-direction stator attached to the gantry frame and the Y-direction load receiver are connected using a connection member, thereby suppressing vibration of the primary pedestal caused when the plurality of mounting heads are moved in the X and Y directions.

公开(公告)号：US20150183040A1

公开(公告)日：2015-07-02

申请号：US14597635

申请日：2015-01-15

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA ,  Yasuhiro CHIDA ,  Osamu KAKUTANI

IPC分类号： B23K3/08 ,  H05B3/14 ,  B23K3/047 ,  H05B3/26

CPC分类号： B23K3/085 ,  B23K1/0016 ,  B23K3/047 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/75502 ,  H05B3/141 ,  H05B3/26

摘要： Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.

摘要翻译： 本发明提供一种接合装置（30）的板状加热器，其特征在于，包括：接合工具（40）附接到所述下表面（31b）的下表面 和安装有绝热体（20）的上表面（31a）。 上表面31a设置有大量的毛细管狭缝35，大量的毛细管狭缝35和与上表面31a连接的绝热体20的匹配面21 ）形成大量从空腔（36）延伸到侧表面（33）的毛细管冷却剂流动路径（37）。 这允许有效地冷却用于粘合装置的加热器。

公开(公告)号：US20240304592A1

公开(公告)日：2024-09-12

申请号：US18039275

申请日：2021-01-18

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA

IPC分类号： H01L23/00

CPC分类号： H01L24/78 ,  H01L24/85 ,  H01L2224/78753 ,  H01L2224/78901 ,  H01L2224/859

摘要： A bonding apparatus includes a bonding tool, first and second imaging units, a calculation part, and a drive control part. The first and second imaging units each include an optical system and an imaging element arranged to satisfy a Scheimpflug condition such that a plane parallel to a stage surface becomes a focal plane. The calculation part calculates three-dimensional coordinates of a target point to which a bonding wire is to be supplied next among bonding points, based on a first picture which is a picture of the target point captured in a first image outputted by the first imaging unit, and a second picture which is a picture of the target point captured in a second image outputted by the second imaging unit. The drive control part causes the bonding tool to approach the target point based on the three-dimensional coordinates of the target point.

公开(公告)号：US20220320034A1

公开(公告)日：2022-10-06

申请号：US17604747

申请日：2020-07-15

申请人： SHINKAWA LTD.

发明人： Hijiri HAYASHI ,  Tetsuya UTANO ,  Kohei SEYAMA

IPC分类号： H01L23/00

摘要： This mounting apparatus is provided with: a plurality of bonding stations each comprising a bonding apparatus for bonding a semiconductor chip onto a substrate wafer, and a chip supply apparatus for supplying the semiconductor chip to the bonding apparatus; and a single wafer transfer apparatus which transfers the substrate wafer in order to supply the substrate wafer to each of the plurality of bonding stations and to collect the substrate wafer from each of the plurality of bonding stations.

公开(公告)号：US20220216078A1

公开(公告)日：2022-07-07

申请号：US17603938

申请日：2020-04-13

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA ,  Tetsuya UTANO

IPC分类号： H01L21/67 ,  B25J13/08 ,  B25J15/06 ,  B25J9/12

摘要： A mounting device 1 is equipped with: two direct-acting voice coil motors 38 in which a movable element 38c reciprocatingly moves along an axis A relative to a fixed element 38b; and a collet 34A mounted on an end part side of the movable elements 38c, the collet 34A holding a semiconductor chip 101 by suction. The plurality of voice coil motors 38 are disposed so as to be set away from each other along a direction intersecting the axes A, and in a manner that the axes A are parallel to each other. The collet 34A is mounted so as to straddle chucks 39 provided at the end parts of the two movable elements 38c.

公开(公告)号：US20210225799A1

公开(公告)日：2021-07-22

申请号：US16087087

申请日：2017-03-24

申请人： SHINKAWA LTD.

发明人： Kohei SEYAMA ,  Yuji EGUCHI ,  Shoji WADA

IPC分类号： H01L23/00 ,  H01L21/52 ,  H01L25/065 ,  H01L25/10

摘要： The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.

公开(公告)号：US20200051947A1

公开(公告)日：2020-02-13

申请号：US16464276

申请日：2017-11-17

申请人： SHINKAWA LTD.

发明人： Manato NISHIDE ,  Kohei SEYAMA ,  Hijiri HAYASHI

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K3/08

摘要： A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.