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    ULTRASONIC SHOWER CLEANING DEVICE
    1.
    发明公开
    ULTRASONIC SHOWER CLEANING DEVICE 审中-公开

    公开(公告)号：US20240278292A1

    公开(公告)日：2024-08-22

    申请号：US18024636

    申请日：2020-09-28

    申请人： KAIJO CORPORATION

    发明人： Kosuke HIRANO ,  Yasuhiro IMAZEKI

    IPC分类号： B08B3/12

    CPC分类号： B08B3/12

    摘要： Provided is an ultrasonic shower cleaning device configured to apply an ultrasonic vibration to a cleaning liquid to perform cleaning. The ultrasonic shower cleaning device efficiently applies the ultrasonic vibration to the cleaning liquid flowing through a flow passage so as to allow the cleaning liquid to be ejected in a spot-like or linear fashion to an object to be cleaned without scattering the cleaning liquid. An ultrasonic shower cleaning device (1) includes: a vibrating body (20), which defines a part of the flow passage (48), and is configured to apply an ultrasonic vibration to the cleaning liquid; and a discharge port (47) configured to allow discharge of the cleaning liquid flowing from the flow passage. The vibrating body is provided so as to be continuous from an inside of the flow passage and project to an outside of the discharge port.

    Bonding process with rotating bonding stage
    2.
    发明授权
    Bonding process with rotating bonding stage 有权

    公开(公告)号：US11273515B2

    公开(公告)日：2022-03-15

    申请号：US16847005

    申请日：2020-04-13

    申请人： KAIJO CORPORATION

    发明人： Yuji Komagino ,  Hodaka Yamaguchi ,  Hideki Yoshino

    IPC分类号： B23K20/10 ,  B23K20/26 ,  H01L23/00 ,  B23K101/40

    摘要： Bonding processing for a plurality of bonding points of different distances with respect to a reference position (origin) of an object to be bonded without changing a moving distance of bonding means is provided. The bonding means, a bonding stage having a work-holder and a rotary mechanism unit for rotating the work-holder, and a control unit for controlling rotation of the work-holder are provided. The bonding means is movable relative to a placement surface of the work-holder in a reference orientation and has a reference position on its moving direction. The plurality of bonding points include bonding points of different separation distances from the reference position along the moving direction while the object to be bonded is being held to the work-holder in the reference orientation. The control unit corrects differences in the separation distances of the plurality of bonding points by controlling rotation of the work-holder.

    ULTRASONIC TRANSDUCER AND ULTRASONIC CLEANING DEVICE USING ULTRASONIC TRANSDUCER
    3.
    发明申请
    ULTRASONIC TRANSDUCER AND ULTRASONIC CLEANING DEVICE USING ULTRASONIC TRANSDUCER 审中-公开

    公开(公告)号：US20200061677A1

    公开(公告)日：2020-02-27

    申请号：US16607885

    申请日：2017-12-21

    申请人： KAIJO CORPORATION

    发明人： Akihisa NAKANO

    IPC分类号： B08B3/12 ,  B06B1/06 ,  B06B3/00

    摘要： An ultrasonic transducer includes: a piezoelectric element having a plate-like shape and an area expansion vibration mode; and a vibration surface separated from main surfaces thereof and arranged in parallel to the main surfaces so as to be brought into contact with a liquid; a piezoelectric element receiving portion held in contact with a side surface of the piezoelectric element and configured to fix the piezoelectric element; and a vibration transmitting portion; and the vibration member having a space for surrounding the main surface formed by the vibration surface, the piezoelectric element receiving portion, and the vibration transmitting portion, wherein a vibration generated by the piezoelectric element is transmitted to the vibration surface through the piezoelectric element receiving portion and the vibration transmitting portion, and the vibration surface is vibrated in a direction orthogonal to a vibration direction in the area expansion vibration mode.

    WIRE BONDING APPARATUS AND WIRE BONDING METHOD
    7.
    发明申请
    WIRE BONDING APPARATUS AND WIRE BONDING METHOD 审中-公开
    电线连接装置和电线接合方法

    公开(公告)号：US20140054277A1

    公开(公告)日：2014-02-27

    申请号：US14110693

    申请日：2012-10-03

    申请人： KAIJO CORPORATION

    发明人： Akio Sugito

    IPC分类号： B23K9/00

    CPC分类号： B23K9/0008 ,  B23K20/007 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/78252 ,  H01L2224/78253 ,  H01L2224/78301 ,  H01L2224/789 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/48

    摘要： Improvement of productivity and product quality is achieved by improving bonding properties and reducing adverse effects caused by heating by supplying heated gaseous matter or gas to a limited area and during a limited period required for bonding. A nozzle-shaped casing including a heater formed of a metal having a large coefficient of resistance temperature which can be heated instantaneously in the interior thereof, an outlet port for blowing out hot gaseous matter from a distal end thereof to a bonding member including the bonding point, and an inlet port for allowing entry of compressed gaseous matter into the other end; heat control means configured to heat the heater; and compressed gaseous matter supply control means configured to perform supply and block of the compressed gaseous matter into the casing are provided, and the heat control means and the compressed gaseous matter supply control means control to provide a period in which the hot gaseous matter is not supplied from the casing to the bonding member in at least any one of periods when a bonding tool is not landed on the bonding point during the bonding operation by varying the temperature of the hot gaseous matter and blowing timing of the hot gaseous matter for each of the bonding points.

    摘要翻译： 通过提供粘合性能和减少加热引起的不利影响，可以提高生产率和产品质量，方法是在有限的区域内和在粘结所需的有限的时间内将加热的气态物质或气体供应。 一种喷嘴形壳体，包括由金属构成的加热器，所述加热器可以在其内部瞬间加热，具有大的电阻温度系数，用于将热气态物质从其远端吹出到包括所述接合 点和用于允许压缩气体物质进入另一端的入口; 配置为加热加热器的热控制装置; 并且提供被配置为将压缩气体供应和阻塞到壳体中的压缩气体供给控制装置，并且控制热量装置和压缩气体供应控制装置以提供热气态物质不是的时间段 在接合操作期间通过改变热气体的温度和热气体的吹送正时的粘合工具在焊接工具未着陆在粘合工具的时间段中的至少任何一个期间，从壳体供给到接合部件 粘接点。

    OUTPUT ADJUSTMENT CIRCUIT, ULTRASONIC TRANSDUCER DEVICE COMPONENT, AND ULTRASONIC TRANSDUCER DEVICE
    8.
    发明申请
    OUTPUT ADJUSTMENT CIRCUIT, ULTRASONIC TRANSDUCER DEVICE COMPONENT, AND ULTRASONIC TRANSDUCER DEVICE 有权
    输出调整电路，超声波传感器器件组件和超声波传感器器件

    公开(公告)号：US20140007691A1

    公开(公告)日：2014-01-09

    申请号：US14024886

    申请日：2013-09-12

    申请人： Kaijo Corporation

    发明人： Hiroshi HASEGAWA ,  Takahiko ISHIZUKA ,  Satoshi DOMON

    IPC分类号： G01N29/22

    CPC分类号： G01N29/22 ,  B06B1/0261 ,  B08B3/12

    摘要： An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.

    摘要翻译： 超声波换能器装置部件将换能器与具有相同频率或不同频率的换能器进行变换，而不需要在发电机主体内进行调整，或者改变发电机主体。 超声波换能器装置部件包括用于将超声波换能器应用于清洁物体的清洁流体的连接单元，以及用于与产生超声波振动信号的发生器主体连接的连接单元; 以及连接到连接单元的换能器。 连接单元包括用于调节超声波振动信号的输出的输出变压器; 电连接到输出变压器的线圈电容器; 以及与线圈电容器电连接的电流检测器。

    Wire bonding method and wire bonding apparatus
    9.
    发明授权
    Wire bonding method and wire bonding apparatus 有权

    公开(公告)号：US11901329B2

    公开(公告)日：2024-02-13

    申请号：US17277911

    申请日：2019-06-17

    申请人： KAIJO CORPORATION

    发明人： Mami Kushima ,  Tamanari Yasuda

    IPC分类号： B23K20/00 ,  H01L23/00

    CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/78802 ,  H01L2224/78822

    摘要： A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.