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公开(公告)号:US11791304B2
公开(公告)日:2023-10-17
申请号:US17278537
申请日:2019-11-07
申请人: KAIJO CORPORATION
发明人: Akio Sugito , Susumu Majima , Mami Kushima
IPC分类号: H01L23/00
CPC分类号: H01L24/78 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/4569 , H01L2224/45565 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/49175 , H01L2224/7855 , H01L2224/78301 , H01L2224/78316 , H01L2224/78353 , H01L2224/78901 , H01L2224/85045 , H01L2224/85205 , H01L2224/85238
摘要: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.