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    Ultrasound transducer array architecture and method of manufacture
    5.
    发明授权
    Ultrasound transducer array architecture and method of manufacture 有权

    公开(公告)号：US12109591B2

    公开(公告)日：2024-10-08

    申请号：US16565219

    申请日：2019-09-09

    申请人： GE Precision Healthcare LLC

    发明人： Kevin Mathew Durocher ,  Warren Lee ,  James Wilson Rose

    IPC分类号： B06B1/06 ,  A61B8/00

    CPC分类号： B06B1/0685 ,  A61B8/4494 ,  B06B1/0607 ,  A61B8/4411 ,  A61B8/445 ,  B06B2201/76

    摘要： An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.

    ULTRASOUND PATCH WITH INTEGRATED FLEXIBLE TRANSDUCER ASSEMBLY
    8.
    发明公开
    ULTRASOUND PATCH WITH INTEGRATED FLEXIBLE TRANSDUCER ASSEMBLY 审中-公开

    公开(公告)号：US20240307029A1

    公开(公告)日：2024-09-19

    申请号：US18604386

    申请日：2024-03-13

    申请人： 1929803 ONTARIO CORP. (D/B/A Flosonics Medical)

    发明人： Joseph Eibl ,  Kyle Fredericks ,  Chelsea Munding ,  Andrew Eibl ,  Jon-Emile S. Kenny

    IPC分类号： A61B8/00 ,  A61B8/08 ,  B06B1/06

    CPC分类号： A61B8/4236 ,  A61B8/4281 ,  A61B8/4483 ,  B06B1/0622 ,  A61B8/488

    摘要： A self-contained ultrasound patch assembly for detecting fluid flow in a vessel includes piezo elements that can transmit ultrasonic energy and detect echo signals. A flex module has two support portions connected to respective ones of the elements with a hinged portion coupled to the support portions, allowing them to be positioned angularly relative to each other. Electronics that direct the elements to transmit ultrasonic energy and process detected echo signals are in communication with the elements through the flex module. A transducer frame includes an alignment portion engaging a flex module alignment portion to retain the flex module in an aligned position. The frame supports the elements at a fixed angular position with respect to each other. A housing encloses the electronics and frame, and fixedly retains the frame to position the elements to transmit toward a bottom surface and away from a top surface of the housing.

    Multi-Layer Flexible Array Interconnect for an Ultrasound Transducer, and Methods of Manufacture
    9.
    发明公开
    Multi-Layer Flexible Array Interconnect for an Ultrasound Transducer, and Methods of Manufacture 审中-公开

    公开(公告)号：US20240306512A1

    公开(公告)日：2024-09-12

    申请号：US18591845

    申请日：2024-02-29

    申请人： FUJIFILM SonoSite, Inc.

    发明人： Andrew Lundberg ,  Jimin Zhang ,  William Blakemore ,  Ken Best

    IPC分类号： H10N30/87 ,  A61B8/00 ,  B06B1/06 ,  H10N30/06 ,  H10N30/088

    CPC分类号： H10N30/875 ,  A61B8/4494 ,  B06B1/067 ,  H10N30/06 ,  H10N30/088 ,  B06B2201/76

    摘要： Systems and methods for a multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture are disclosed. The systems and methods described herein provide consistent and controllable alignment between the odd and even flex layers. Further, ground layers are added between the signal layers to improve crosstalk performance while simplifying the construction. In some implementations, vias are introduced at the interface of an electromechanical-array element (e.g., lead zirconate titanate (PZT) element) to increase the surface area of conductive material and thereby increase the quality of the electrical and physical connections. In addition, a machining alignment and verification aid is provided through strategic use of unused and discarded board area to enable (i) alignment check of the flex circuit with the machining equipment and (ii) adjustment of the flex circuit position relative to the machining equipment to avoid the flex circuit being machined to an unusable state.

    BROADBAND ULTRASONIC TRANSDUCER
    10.
    发明公开
    BROADBAND ULTRASONIC TRANSDUCER 审中-公开

    公开(公告)号：US20240299980A1

    公开(公告)日：2024-09-12

    申请号：US18591858

    申请日：2024-02-29

    申请人： Infineon Technologies AG

    发明人： Erhard LANDGRAF ,  Sebastian PREGL ,  Fabian MERBELER

    IPC分类号： B06B1/06 ,  B06B1/02

    CPC分类号： B06B1/06 ,  B06B1/0292

    摘要： An ultrasonic transducer includes an arrangement of ultrasonic transducer elements, wherein the ultrasonic transducer elements include a first ultrasonic transducer element and a second ultrasonic transducer element. The first ultrasonic transducer element has a first membrane having a first membrane reinforcement and a first membrane electrode, and a first counter-electrode. The second ultrasonic transducer element has a second membrane having a second membrane reinforcement and a second membrane electrode, and a second counter-electrode. Additionally, a resonant frequency of the first membrane differs from a resonant frequency of the second membrane.