公开(公告)号：US20240306512A1

公开(公告)日：2024-09-12

申请号：US18591845

申请日：2024-02-29

申请人： FUJIFILM SonoSite, Inc.

发明人： Andrew Lundberg ,  Jimin Zhang ,  William Blakemore ,  Ken Best

IPC分类号： H10N30/87 ,  A61B8/00 ,  B06B1/06 ,  H10N30/06 ,  H10N30/088

CPC分类号： H10N30/875 ,  A61B8/4494 ,  B06B1/067 ,  H10N30/06 ,  H10N30/088 ,  B06B2201/76

摘要： Systems and methods for a multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture are disclosed. The systems and methods described herein provide consistent and controllable alignment between the odd and even flex layers. Further, ground layers are added between the signal layers to improve crosstalk performance while simplifying the construction. In some implementations, vias are introduced at the interface of an electromechanical-array element (e.g., lead zirconate titanate (PZT) element) to increase the surface area of conductive material and thereby increase the quality of the electrical and physical connections. In addition, a machining alignment and verification aid is provided through strategic use of unused and discarded board area to enable (i) alignment check of the flex circuit with the machining equipment and (ii) adjustment of the flex circuit position relative to the machining equipment to avoid the flex circuit being machined to an unusable state.