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公开(公告)号：US20240058841A1
公开(公告)日：2024-02-22
申请号：US18366278
申请日：2023-08-07
Applicant: Infineon Technologies AG
Inventor： Horst THEUSS , Klaus ELIAN
IPC: B06B1/02
CPC classification number: B06B1/0292
Abstract: Device with ultrasonic transducer and method for manufacturing same. A device is provided, having an ultrasonic transducer, which includes a membrane and a cover element. A coupling medium entirely fills an interspace between the membrane and the cover element, and extends from the interspace into a reservoir space which communicates with the interspace.
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公开(公告)号：US20230152448A1
公开(公告)日：2023-05-18
申请号：US18053583
申请日：2022-11-08
Applicant: Infineon Technologies AG
Inventor： Klaus ELIAN , Christoph STEINER , Horst THEUSS , Matthias EBERL , Fabian MERBELER
Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.
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公开(公告)号：US20250011164A1
公开(公告)日：2025-01-09
申请号：US18755216
申请日：2024-06-26
Applicant: Infineon Technologies AG
Inventor： Klaus ELIAN , Jochen DANGELMAIER , Rainer Markus SCHALLER
Abstract: A sensor device includes a semiconductor chip and a package enclosing the semiconductor chip. The semiconductor chip includes integrated sensor circuitry configured to sense a characteristic of a gas in vicinity of the semiconductor chip. The package includes electrical contacts to the integrated sensor circuitry, at least one gas port enabling access of the gas into the package and to the semiconductor chip, a heating element configured to heat an interior portion of the package.
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4.发明公开公开(公告)号：US20240094850A1
公开(公告)日：2024-03-21
申请号：US18159817
申请日：2023-01-26
Applicant: Infineon Technologies AG
Inventor： Emanuel STOICESCU , Matthias EBERL , Costin BATRINU , Klaus ELIAN
CPC classification number: G06F3/04186 , G06F3/043 , G06F3/044 , G06F2203/04105
Abstract: A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.
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公开(公告)号：US20230315235A1
公开(公告)日：2023-10-05
申请号：US18188611
申请日：2023-03-23
Applicant: Infineon Technologies AG
Inventor： Klaus ELIAN , Matthias EBERL , Horst THEUSS , Rainer Markus SCHALLER , Fabian MERBELER
IPC: G06F3/043
CPC classification number: G06F3/043 , G06F2203/04103
Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.
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Patent Agency Ranking
公开(公告)号：US20150194249A1
公开(公告)日：2015-07-09
申请号：US14590017
申请日：2015-01-06
Applicant: Infineon Technologies AG
Inventor： Klaus ELIAN
IPC: H01F7/02 , H01R13/405 , H01R13/631 , H01F1/04 , H01R13/62
CPC classification number: H01R13/405 , H01F1/083 , H01F1/113 , H01F41/0266 , H01L2224/48091 , H01L2224/48247 , H01R13/6205 , H01R13/6683 , H01L2924/00014
Abstract: A magnet package is created, which includes a package body, wherein the package body is formed of a permanent magnetic material, and at least one electric contact, which is covered by the package body.
Abstract translation: 产生磁体封装，其包括封装主体，其中封装体由永久磁性材料形成，以及至少一个由封装体覆盖的电触点。
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公开(公告)号：US20240192809A1
公开(公告)日：2024-06-13
申请号：US18469010
申请日：2023-09-18
Applicant: Infineon Technologies AG
Inventor： Emanuel STOICESCU , Matthias EBERL , Mohanraj SOUNDARA PANDIAN , Klaus ELIAN , Costin BATRINU
CPC classification number: G06F3/043 , G06F3/0416
Abstract: An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.
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公开(公告)号：US20230010130A1
公开(公告)日：2023-01-12
申请号：US17850026
申请日：2022-06-27
Applicant: Infineon Technologies AG
Inventor： Rainer Markus SCHALLER , Jochen DANGELMAIER , Klaus ELIAN , Horst THEUSS
IPC: G06F3/043
Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
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公开(公告)号：US20220373784A1
公开(公告)日：2022-11-24
申请号：US17659749
申请日：2022-04-19
Applicant: Infineon Technologies AG
Inventor： Horst THEUSS , Klaus ELIAN , Cyrus GHAHREMANI
Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.
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公开(公告)号：US20220247089A1
公开(公告)日：2022-08-04
申请号：US17648730
申请日：2022-01-24
Applicant: Infineon Technologies AG
Inventor： Walter HARTNER , Tuncay ERDOEL , Klaus ELIAN , Christian GEISSLER , Bernhard RIEDER , Rainer Markus SCHALLER , Horst THEUSS , Maciej WOJNOWSKI
Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.
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