公开(公告)号：US20230315235A1

公开(公告)日：2023-10-05

申请号：US18188611

申请日：2023-03-23

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Matthias EBERL ,  Horst THEUSS ,  Rainer Markus SCHALLER ,  Fabian MERBELER

IPC: G06F3/043

CPC classification number: G06F3/043 ,  G06F2203/04103

Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

公开(公告)号：US20230152448A1

公开(公告)日：2023-05-18

申请号：US18053583

申请日：2022-11-08

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Christoph STEINER ,  Horst THEUSS ,  Matthias EBERL ,  Fabian MERBELER

IPC: G01S15/08 ,  G06F3/043

CPC classification number: G01S15/08 ,  G06F3/043

Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.

公开(公告)号：US20240299980A1

公开(公告)日：2024-09-12

申请号：US18591858

申请日：2024-02-29

Applicant: Infineon Technologies AG

Inventor： Erhard LANDGRAF ,  Sebastian PREGL ,  Fabian MERBELER

IPC: B06B1/06 ,  B06B1/02

CPC classification number: B06B1/06 ,  B06B1/0292

Abstract: An ultrasonic transducer includes an arrangement of ultrasonic transducer elements, wherein the ultrasonic transducer elements include a first ultrasonic transducer element and a second ultrasonic transducer element. The first ultrasonic transducer element has a first membrane having a first membrane reinforcement and a first membrane electrode, and a first counter-electrode. The second ultrasonic transducer element has a second membrane having a second membrane reinforcement and a second membrane electrode, and a second counter-electrode. Additionally, a resonant frequency of the first membrane differs from a resonant frequency of the second membrane.

公开(公告)号：US20230023572A1

公开(公告)日：2023-01-26

申请号：US17865504

申请日：2022-07-15

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Matthias EBERL ,  Fabian MERBELER

IPC: B06B1/02 ,  H01L41/09 ,  B06B1/06 ,  G01H11/06

Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.