-
公开(公告)号:US20190113412A1
公开(公告)日:2019-04-18
申请号:US16159918
申请日:2018-10-15
Applicant: Infineon Technologies AG
Inventor: Emanuel STOICESCU , Matthias BOEHM , Stefan JAHN , Erhard LANDGRAF , Michael WEBER , Janis WEIDENAUER
Abstract: A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.
-
公开(公告)号:US20240264703A1
公开(公告)日:2024-08-08
申请号:US18164152
申请日:2023-02-03
Applicant: Infineon Technologies AG
Inventor: Emanuel STOICESCU , Erhard LANDGRAF
CPC classification number: G06F3/0433 , B06B3/04 , G06F3/0418 , B06B2201/40
Abstract: An ultrasonic touch sensor includes a touch structure configured to receive a touch; a transmitter arrangement configured to transmit one or more ultrasonic transmit waves toward the touch structure; a receiver arrangement configured to receive ultrasonic reflected waves produced by reflections of the one or more ultrasonic transmit waves and generate a plurality of measurement signals representative of the ultrasonic reflected waves; and a measurement circuit configured to measure a degree of variation of a plurality of measurement signals, compare the degree of variation with a detection threshold, and determine whether a no-touch event or a touch event has occurred at the touch structure based on whether the degree of variation satisfies the detection threshold.
-
公开(公告)号:US20210310890A1
公开(公告)日:2021-10-07
申请号:US17348940
申请日:2021-06-16
Applicant: Infineon Technologies AG
Inventor: Emanuel STOICESCU , Matthias BOEHM , Stefan JAHN , Erhard LANDGRAF , Michael WEBER , Janis WEIDENAUER
IPC: G01L19/14 , H01L23/053 , G01L19/00 , H01L21/56 , H01L23/24 , H01L23/495 , H01L23/60 , H01L23/00
Abstract: A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.
-
公开(公告)号:US20160099311A1
公开(公告)日:2016-04-07
申请号:US14969023
申请日:2015-12-15
Applicant: Infineon Technologies AG
Inventor: Dmitri Alex TSCHUMAKOW , Erhard LANDGRAF , Claus DAHL , Steffen ROTHENHAEUSSER
IPC: H01L29/06 , H01L29/423 , H01L29/10 , H01L29/49 , H01L21/8234 , H01L27/088
CPC classification number: H01L29/0649 , H01L21/823412 , H01L21/823481 , H01L27/088 , H01L29/0653 , H01L29/1095 , H01L29/42376 , H01L29/4916 , H01L29/4983 , H01L29/78
Abstract: According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed between the first source/drain region and the second source/drain region, the body region including a core region and at least one edge region at least partially surrounding the core region; a dielectric region next to the body region and configured to limit a current flow through the body region in a width direction of the body region, wherein the at least one edge region is arranged between the core region and the dielectric region; and a gate structure configured to control the body region; wherein the gate structure is configured to provide a first threshold voltage for the core region of the body region and a second threshold voltage for the at least one edge region of the body region, wherein the first threshold voltage is less than or equal to the second threshold voltage.
-
公开(公告)号:US20240299980A1
公开(公告)日:2024-09-12
申请号:US18591858
申请日:2024-02-29
Applicant: Infineon Technologies AG
Inventor: Erhard LANDGRAF , Sebastian PREGL , Fabian MERBELER
CPC classification number: B06B1/06 , B06B1/0292
Abstract: An ultrasonic transducer includes an arrangement of ultrasonic transducer elements, wherein the ultrasonic transducer elements include a first ultrasonic transducer element and a second ultrasonic transducer element. The first ultrasonic transducer element has a first membrane having a first membrane reinforcement and a first membrane electrode, and a first counter-electrode. The second ultrasonic transducer element has a second membrane having a second membrane reinforcement and a second membrane electrode, and a second counter-electrode. Additionally, a resonant frequency of the first membrane differs from a resonant frequency of the second membrane.
-
公开(公告)号:US20230102575A1
公开(公告)日:2023-03-30
申请号:US17934057
申请日:2022-09-21
Applicant: Infineon Technologies AG
Inventor: Daniel KÖHLER , Vlad BUICULESCU , Florian BRANDL , Dirk MEINHOLD , Erhard LANDGRAF , Rainer Markus SCHALLER , Markus ECKINGER
Abstract: A sensor for parallel measurement of pressure and acceleration of a vehicle, including a substrate, a sensor element disposed on the substrate, a material being connected with the sensor element and being exposed to the environment of the sensor, wherein the material is configured to act as a seismic mass, and an electronic circuitry connected with the sensor element and including a first filter and a second filter, wherein the first and second filters have different filter characteristics so that an output of the first filter is representative for the pressure and an output of the second is representative for the acceleration.
-
公开(公告)号:US20190250059A1
公开(公告)日:2019-08-15
申请号:US16271090
申请日:2019-02-08
Applicant: Infineon Technologies AG
Inventor: Victor POPESCU-STROE , Emanuel STOICESCU , Matthias BOEHM , Constantin CRISU , Uwe FAKESCH , Stefan JAHN , Erhard LANDGRAF , Janis WEIDENAUER , Bernhard WINKLER
CPC classification number: G01L27/005 , G01L19/04
Abstract: Examples provide for an apparatus, method, and computer program for comparing the output of sensor cells in an arrangement of sensor cells in an area A, including a set of at least two measurement units. A measurement unit includes at least two sensor cells, wherein at least one sensor cell of at least one measurement unit includes a sensitive sensor cell, which is sensitive with respect to a measured quantity. The sensor cells are intermixed with each other. The apparatus further includes means for selecting output signals of sensor cells of the arrangement and means for determining a measured quantity or determining an intact sensor cell by comparing output signals of different measurement units.
-
-
-
-
-
-