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公开(公告)号：US09935254B2
公开(公告)日：2018-04-03
申请号：US14923391
申请日：2015-10-26
CPC分类号： H01L41/083 , B06B1/0622 , H01L41/08 , H04R31/00
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US11094875B2
公开(公告)日：2021-08-17
申请号：US15900064
申请日：2018-02-20
IPC分类号： H01L41/083 , H04R31/00 , H01L41/08 , B06B1/06
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US12029131B2
公开(公告)日：2024-07-02
申请号：US17376937
申请日：2021-07-15
IPC分类号： H10N30/50 , B06B1/06 , H04R31/00 , H10N30/00 , H10N30/072
CPC分类号： H10N30/50 , B06B1/0622 , H04R31/00 , H10N30/00 , H10N30/072
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US20180240960A1
公开(公告)日：2018-08-23
申请号：US15900064
申请日：2018-02-20
IPC分类号： H01L41/083 , H04R31/00 , B06B1/06 , H01L41/08
CPC分类号： H01L41/083 , B06B1/0622 , H01L41/08 , H04R31/00
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US20160118572A1
公开(公告)日：2016-04-28
申请号：US14923391
申请日：2015-10-26
IPC分类号： H01L41/083
CPC分类号： H01L41/083 , B06B1/0622 , H01L41/08 , H04R31/00
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
摘要翻译： 所公开的技术具有用于制造诸如超声换能器的电气部件的方法。 特别地，所公开的技术提供了图案化电极的方法，例如， 在超声换能器与电路的连接中; 在表面上沉积金属的方法; 以及制造用于超声换能器的集成匹配层的方法。 所公开的技术还具有通过本文所述的方法产生的超声换能器。
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公开(公告)号：US20240315137A1
公开(公告)日：2024-09-19
申请号：US18673674
申请日：2024-05-24
IPC分类号： H10N30/50 , B06B1/06 , H04R31/00 , H10N30/00 , H10N30/072
CPC分类号： H10N30/50 , B06B1/0622 , H04R31/00 , H10N30/00 , H10N30/072
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US20220006002A1
公开(公告)日：2022-01-06
申请号：US17376937
申请日：2021-07-15
IPC分类号： H01L41/083 , H04R31/00 , H01L41/08 , B06B1/06
摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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公开(公告)号：US09173047B2
公开(公告)日：2015-10-27
申请号：US13685673
申请日：2012-11-26
CPC分类号： H01L41/083 , B06B1/0622 , H01L41/08 , H04R31/00
摘要： The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein.
摘要翻译： 本发明的特征在于制造诸如超声换能器的电气部件的方法。 特别地，本发明提供了图案化电极的方法，例如在超声换能器与电路的连接中; 在表面上沉积金属的方法; 以及制造用于超声换能器的集成匹配层的方法。 本发明还具有通过本文所述的方法产生的超声换能器。
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