公开(公告)号：US20240359212A1

公开(公告)日：2024-10-31

申请号：US18638045

申请日：2024-04-17

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Daniel OBERMEIER ,  Emanuel STOICESCU

IPC: B06B1/02 ,  B06B1/06

CPC classification number: B06B1/0292 ,  B06B1/0207 ,  B06B1/0622 ,  B06B2201/51 ,  B06B2201/55

Abstract: An ultrasonic device is provided. The ultrasonic device includes at least one micromachined ultrasonic transducer (MUT) and processing circuitry electrically coupled to the at least one MUT. The at least one MUT and the processing circuitry are packed in an embedded wafer level ball grid array (eWLB) package. An acoustic coupling medium for acoustic coupling of the at least one MUT to an external application surface is formed on the at least one MUT.