- 专利标题： ULTRASONIC DEVICE AND METHOD OF FORMING THE SAME, ULTRASONIC ASSEMBLIES AND METHODS OF FORMING THE SAME
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申请号： US18638045申请日： 2024-04-17
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公开(公告)号： US20240359212A1公开(公告)日： 2024-10-31
- 发明人: Klaus ELIAN , Daniel OBERMEIER , Emanuel STOICESCU
- 申请人： Infineon Technologies AG
- 申请人地址： US DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： US DE Neubiberg
- 优先权： DE 2023203937.0 2023.04.27
- 主分类号： B06B1/02
- IPC分类号： B06B1/02 ; B06B1/06
摘要：
An ultrasonic device is provided. The ultrasonic device includes at least one micromachined ultrasonic transducer (MUT) and processing circuitry electrically coupled to the at least one MUT. The at least one MUT and the processing circuitry are packed in an embedded wafer level ball grid array (eWLB) package. An acoustic coupling medium for acoustic coupling of the at least one MUT to an external application surface is formed on the at least one MUT.
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