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公开(公告)号：US20240250063A1
公开(公告)日：2024-07-25
申请号：US18412719
申请日：2024-01-15
发明人： Hui Xu , Gary S. Gillotti
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/43 , H01L24/78 , H01L2224/432 , H01L2224/437 , H01L2224/78824 , H01L2224/859
摘要： A method of operating a wire bonding machine is provided. The method includes the steps of: (a) attempting to bond a free air ball to a first bonding location using a wire bonding tool; (b) detecting that the free air ball was not properly bonded to the first bonding location in step (a); (c) bonding the free air ball to a second bonding location; (d) raising the wire bonding tool, with a wire engaged with the wire bonding tool continuous with the bonded free air ball, to a position above the bonded free air ball; (e) weakening a neck portion of a wire above the free air ball after step (d); and (f) separating the bonded free air ball from the wire after step (e) such that a wire tail extends below a tip of a wire bonding tool.
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公开(公告)号：US11935864B2
公开(公告)日：2024-03-19
申请号：US17971722
申请日：2022-10-24
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
CPC分类号： H01L24/78 , B23K20/004 , H01L24/85 , H01L2224/7892 , H01L2224/78984
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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公开(公告)号：US20230039460A1
公开(公告)日：2023-02-09
申请号：US17971722
申请日：2022-10-24
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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公开(公告)号：US11865633B2
公开(公告)日：2024-01-09
申请号：US18104423
申请日：2023-02-01
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
IPC分类号： B23K20/00 , B23K20/26 , B23K101/40 , H01L23/00
CPC分类号： B23K20/007 , B23K20/004 , B23K20/26 , B23K2101/40 , H01L24/85 , H01L2224/859 , H01L2224/85035
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US20230154888A1
公开(公告)日：2023-05-18
申请号：US17987708
申请日：2022-11-15
发明人： Jon W. Brunner , Wei Qin , Aashish Shah , Hui Xu , Jeong Ho Yang
CPC分类号： H01L24/78 , H01L24/85 , B23K20/10 , H01L24/48 , H01L2224/48221 , H01L2924/386 , H01L2224/78001 , H01L2224/78343 , H01L2224/78901 , H01L2224/7892 , H01L2224/78925 , H01L2224/85986 , H01L2224/859 , H01L2224/85205 , B23K2101/40
摘要： A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
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公开(公告)号：US11597031B2
公开(公告)日：2023-03-07
申请号：US17517827
申请日：2021-11-03
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
IPC分类号： B23K20/00 , B23K20/26 , B23K101/40 , H01L23/00
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US20230166348A1
公开(公告)日：2023-06-01
申请号：US18104423
申请日：2023-02-01
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
CPC分类号： B23K20/007 , B23K20/26 , H01L2224/85035 , H01L2224/859 , B23K2101/40
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US20220134469A1
公开(公告)日：2022-05-05
申请号：US17517827
申请日：2021-11-03
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US20210305199A1
公开(公告)日：2021-09-30
申请号：US17212395
申请日：2021-03-25
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
IPC分类号： H01L23/00
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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公开(公告)号：US12113043B2
公开(公告)日：2024-10-08
申请号：US17987708
申请日：2022-11-15
发明人： Jon W. Brunner , Wei Qin , Aashish Shah , Hui Xu , Jeong Ho Yang
IPC分类号： B23K20/00 , B23K20/10 , H01L23/00 , B23K101/40
CPC分类号： H01L24/78 , B23K20/10 , B23K2101/40 , H01L2224/78001 , H01L2224/78343 , H01L2224/78901 , H01L2924/386
摘要： A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
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