公开(公告)号：US11749633B2

公开(公告)日：2023-09-05

申请号：US17604717

申请日：2020-03-12

申请人： Hitachi Energy Switzerland AG

发明人： Niko Pavlicek ,  Fabian Mohn ,  Markus Thut ,  Swen Koenig

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L25/07

CPC分类号： H01L24/40 ,  H01L23/4985 ,  H01L24/37 ,  H01L24/73 ,  H01L24/84 ,  H01L25/072 ,  H01L2224/37147 ,  H01L2224/4001 ,  H01L2224/4005 ,  H01L2224/40137 ,  H01L2224/48225 ,  H01L2224/48245 ,  H01L2224/73221 ,  H01L2224/84214 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3512 ,  H01L2924/386

摘要： A power semiconductor module includes a substrate with a structured metallization layer and a number of semiconductor chips. Each chip has a first power electrode bonded to the metallization layer. A leadframe is laser-welded to second power electrodes of the semiconductor chips for electrically interconnecting the semiconductor chips. A control conductor is attached to the leadframe opposite to the semiconductor chips and is electrically isolated from the leadframe. The control conductor is electrically connected to control electrodes of the semiconductor chips in the group.

公开(公告)号：US20230260960A1

公开(公告)日：2023-08-17

申请号：US18109344

申请日：2023-02-14

申请人： Kulicke and Soffa Industries, Inc.

发明人： Basil Milton ,  David Jeffery Li ,  Wei Qin

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/49052 ,  H01L2224/48095 ,  H01L2224/48245 ,  H01L2224/4917 ,  H01L2224/49179 ,  H01L2224/49175 ,  H01L2224/859 ,  H01L2224/85986 ,  H01L2924/386

摘要： A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).

公开(公告)号：US09728527B2

公开(公告)日：2017-08-08

申请号：US14925807

申请日：2015-10-28

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/48 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L21/311 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L25/50 ,  H01L21/31111 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/89 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/08146 ,  H01L2224/0823 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4805 ,  H01L2224/48108 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/49426 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2224/45616 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

摘要： An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

公开(公告)号：US09324676B2

公开(公告)日：2016-04-26

申请号：US14558184

申请日：2014-12-02

申请人： Micron Technology, Inc.

发明人： See Hiong Leow ,  Liang Chee Tay

IPC分类号： H01L21/58 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  H01L25/04 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/191 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The method further includes cutting the semiconductor workpiece to singulate the dies, and attaching the stand-off on a first singulated die to a second die.

公开(公告)号：US09263394B2

公开(公告)日：2016-02-16

申请号：US14087252

申请日：2013-11-22

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/31111 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/89 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/08146 ,  H01L2224/0823 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4805 ,  H01L2224/48108 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/49426 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2224/45616 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

摘要： An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

摘要翻译： 公开了一般涉及基板的装置。 在这种装置中，第一接合通孔阵列具有从衬底的表面延伸的第一线。 第二结合通孔阵列具有从衬底的表面延伸的第二线。 通过阵列的第一结合通过阵列至少部分地设置在第二结合内。 第一结合通孔阵列的第一条导线具有第一高度。 第二接合通孔阵列的第二线具有大于用于将至少一个管芯耦合至第一接合的第一高度的第二高度，该阵列至少部分地设置在第二接合通孔阵列内。

公开(公告)号：US20150279810A1

公开(公告)日：2015-10-01

申请号：US14552472

申请日：2014-11-24

申请人： Boh Kid Wong ,  Cheng Choi Yong

发明人： Boh Kid Wong ,  Cheng Choi Yong

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/32245 ,  H01L2224/43985 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8503 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/386 ,  Y02P80/30 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of attaching bond wires to bond pads on an active surface of a semiconductor die, where the bond pads are disposed along four side edges of the die, and have aluminum top layers. The method includes attaching first bond wires to first bond pads on first and second opposing sides of the die using a first group of settings and attaching second bond wires to the bond pads on third and fourth sides of the die that oppose each other and are adjacent the first and second sides, using a second group of settings. The first and second groups of settings include first and second scrub settings that are different from each other. Employing two separate scrub settings allows for reduced splashing of the aluminum cap layer on the die pad from splashing onto passivation edges of the bond pads.

摘要翻译： 一种将接合线附接到半导体管芯的有源表面上的接合焊盘的方法，其中接合焊盘沿着管芯的四个侧边缘设置，并且具有铝顶层。 该方法包括使用第一组设置将第一接合线附接到管芯的第一和第二相对侧上的第一接合焊盘，并将第二接合线附接到相对于彼此并且相邻的管芯的第三和第四侧上的接合焊盘 第一和第二方面，使用第二组设置。 第一组和第二组设置包括彼此不同的第一和第二擦洗设置。 采用两个单独的擦洗设置允许减少喷嘴上的铝盖层飞溅到接合焊盘的钝化边缘上。

公开(公告)号：US09070393B2

公开(公告)日：2015-06-30

申请号：US14196363

申请日：2014-03-04

申请人： PANASONIC CORPORATION

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC分类号： H01L23/04 ,  G11B5/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/18 ,  H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/14

CPC分类号： G11B5/486 ,  H01L21/4846 ,  H01L21/565 ,  H01L22/12 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49866 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82385 ,  H01L2224/82399 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/386 ,  H01L2924/3862 ,  H05K1/111 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2203/1461 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

摘要翻译： 本发明的一个方面是一种三维结构，其中在表面上形成布线，所述三维结构具有绝缘树脂层，所述绝缘树脂层含有由选自典型非金属元素中的至少一种元素形成的填料和 典型的金属元件，其中在绝缘树脂层的表面上形成用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。

公开(公告)号：US09000583B2

公开(公告)日：2015-04-07

申请号：US14040948

申请日：2013-09-30

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

摘要翻译： 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

公开(公告)号：US20140117516A1

公开(公告)日：2014-05-01

申请号：US14040948

申请日：2013-09-30

申请人： TESSERA, INC.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/495

CPC分类号： H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

摘要翻译： 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

公开(公告)号：US08569884B2

公开(公告)日：2013-10-29

申请号：US13209596

申请日：2011-08-15

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/482

CPC分类号： H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.