公开(公告)号：US20240186213A1

公开(公告)日：2024-06-06

申请号：US18076245

申请日：2022-12-06

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jae Jin REE ,  Sang Hyeon LEE ,  Yi Seul HAN ,  Geon Du GIM ,  Hun Jung LIM

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L25/16

CPC分类号： H01L23/3675 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3735 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1611 ,  H01L2924/1616 ,  H01L2924/1619 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/16315

摘要： In one example, an electronic device includes a substrate and a cover structure. The cover structure includes an upper cover wall comprising an upper wall outer surface and an upper wall inner surface opposite to the upper wall outer surface, cover sidewalls extending from the upper wall inner surface and coupled to the substrate. The upper cover wall and the cover sidewalls define a cavity. A channel structure is in the upper cover wall extending inward from the upper wall inner surface. A first electronic component is coupled to the substrate within the cavity and a thermal interface material (TIM) is coupled to the upper wall inner surface and the first electronic component. A portion of the TIM is within the channel structure. Other examples and related methods are also disclosed herein.

公开(公告)号：USRE49987E1

公开(公告)日：2024-05-28

申请号：US17725442

申请日：2022-04-20

申请人： Invensas LLC

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L25/065 ,  B81B7/00 ,  B81C1/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/42 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H01L25/16 ,  H01L49/02

CPC分类号： H01L25/0657 ,  B81B7/0074 ,  B81C1/0023 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/24 ,  H01L24/49 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L24/02 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3841 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/05568 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05111 ,  H01L2924/00014 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05169 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05184 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/0332 ,  H01L2924/00014 ,  H01L2224/03462 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/11464 ,  H01L2924/00014 ,  H01L2224/0333 ,  H01L2924/00012 ,  H01L2224/13616 ,  H01L2924/00014 ,  H01L2224/05616 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/01074 ,  H01L2224/13184 ,  H01L2924/01028 ,  H01L2224/13124 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13139 ,  H01L2924/00014 ,  H01L2224/13116 ,  H01L2924/00014 ,  H01L2224/13113 ,  H01L2924/00014 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2224/73201 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2224/45015 ,  H01L2924/20756 ,  H01L2224/45015 ,  H01L2924/20757 ,  H01L2224/45015 ,  H01L2924/20758 ,  H01L2224/45015 ,  H01L2924/20759 ,  H01L2224/45015 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20756 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20757 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20758 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20759 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2224/45099

摘要： Apparatus(es) and method(s) relate generally to via arrays on a substrate. In one such apparatus, the substrate has a conductive layer. First plated conductors are in a first region extending from a surface of the conductive layer. Second plated conductors are in a second region extending from the surface of the conductive layer. The first plated conductors and the second plated conductors are external to the first substrate. The first region is disposed at least partially within the second region. The first plated conductors are of a first height. The second plated conductors are of a second height greater than the first height. A second substrate is coupled to first ends of the first plated conductors. The second substrate has at least one electronic component coupled thereto. A die is coupled to second ends of the second plated conductors. The die is located over the at least one electronic component.

公开(公告)号：US20240128148A1

公开(公告)日：2024-04-18

申请号：US18151222

申请日：2023-01-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chang-Jung Hsueh ,  Po-Yao Lin ,  Hui-Min Huang ,  Ming-Da Cheng ,  Kathy Yan

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H10B80/00

CPC分类号： H01L23/3675 ,  H01L21/4882 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2924/1011 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1611 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1632

摘要： A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

公开(公告)号：US11948899B2

公开(公告)日：2024-04-02

申请号：US17979793

申请日：2022-11-03

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L23/00

CPC分类号： H01L24/02 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/02373 ,  H01L2924/16251

摘要： A semiconductor substrate structure including a first group of circuit structure and a second group of circuit structure is provided. The first group of circuit structure includes multiple first wiring layers and multiple first conductive connectors, and each of the first conductive connectors includes a conductive cap. The second group of circuit structure includes multiple second wiring layers and multiple second conductive connectors. The first group of circuit structure and the second group of circuit structure are electrically connected through bonding of the first conductive connectors and the second conductive connectors to form a multilayer redistribution structure. A manufacturing method of the semiconductor substrate structure is also provided.

公开(公告)号：US20240079346A1

公开(公告)日：2024-03-07

申请号：US17901784

申请日：2022-09-01

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chi-Yang Yu ,  Jung-Wei Cheng ,  Yu-Min Liang ,  Chien-Hsun Lee

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC分类号： H01L23/562 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/165 ,  H01L23/49816 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/3511 ,  H01L2924/37001

摘要： An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.

公开(公告)号：US11862611B2

公开(公告)日：2024-01-02

申请号：US17545667

申请日：2021-12-08

申请人： Micron Technology, Inc.

发明人： Ed A. Schrock

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/31 ,  H01L23/053 ,  H01L21/56 ,  H01L21/48 ,  H01L23/10 ,  H01L23/24 ,  H01L23/433 ,  H01L23/08 ,  H01L23/373 ,  H01L25/18 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/563 ,  H01L21/565 ,  H01L23/053 ,  H01L23/08 ,  H01L23/10 ,  H01L23/24 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/3736 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/18 ,  H01L2224/1329 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29393 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/173 ,  H01L2924/1715 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/1329 ,  H01L2924/0665 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0715

摘要： Several embodiments of the present technology are described with reference to a semiconductor apparatus. In some embodiments of the present technology, a semiconductor apparatus includes a stack of semiconductor dies attached to a thermal transfer structure. The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls to support the thermal transfer structure.

公开(公告)号：US20230420314A1

公开(公告)日：2023-12-28

申请号：US17849760

申请日：2022-06-27

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chin-Hua Wang ,  Yu-Fan Chen ,  Yu Chen Lee ,  Shin-Puu Jeng

IPC分类号： H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L24/32 ,  H01L25/0655 ,  H01L24/96 ,  H01L24/97 ,  H01L21/563 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/73 ,  H01L2924/1437 ,  H01L2924/35121 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2924/15151 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632

摘要： A bonded assembly includes an interposer including redistribution wiring interconnects and redistribution insulating layers and including recesses in corner regions. The recesses include surfaces that are recessed relative to a horizontal plane including a horizontal surface of the interposer. A least one semiconductor die is attached to the interposer through a respective array of solder material portions. An underfill material portion is located between the interposer and the at least one semiconductor die. The underfill material includes downward-protruding anchor portions that protrude downward from a horizontally-extending portion of the underfill material portion that laterally surrounds each array of solder material portions into the recesses.

公开(公告)号：US11855034B2

公开(公告)日：2023-12-26

申请号：US17334622

申请日：2021-05-28

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chung-Hung Lai ,  Chin-Li Kao ,  Chih-Yi Huang ,  Teck-Chong Lee

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/14 ,  H01L25/065

CPC分类号： H01L24/73 ,  H01L23/14 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16014 ,  H01L2224/16105 ,  H01L2224/16165 ,  H01L2224/16168 ,  H01L2224/73204 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1616 ,  H01L2924/16251 ,  H01L2924/182 ,  H01L2924/3511 ,  H01L2924/3512

摘要： An electronic device package is provided. The electronic device package includes a redistribution layer (RDL), a first electronic component and an interconnector. The RDL includes a topmost circuit layer, and the topmost circuit layer includes a conductive trace. The first electronic component is disposed over the RDL. The interconnector is disposed between the RDL and the first electronic component. A direction is defined by extending from a center of the first electronic component toward an edge of the first electronic component, and the direction penetrates a first sidewall and a second sidewall of the interconnector, the second sidewall is farther from the center of the first electronic component than the first sidewall is, and the conductive trace is outside a projection region of the second sidewall.

公开(公告)号：US20230402438A1

公开(公告)日：2023-12-14

申请号：US17826780

申请日：2022-05-27

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Monsen Liu ,  Shang-Lun Tsai ,  Shuo-Mao Chen ,  Shin-Puu Jeng

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L25/162 ,  H01L21/4853 ,  H01L24/16 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/481 ,  H01L25/165 ,  H01L2924/1427 ,  H01L2924/1434 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/182 ,  H01L2924/183 ,  H01L25/167

摘要： An embodiment semiconductor device includes a first die package component, a second interposer electrically coupled to a first side of the first die package component, a third interposer having a voltage regulator circuit electrically coupled to a second side of the first die package component, and an optical component and a high-bandwidth-memory die, each electrically coupled to the second interposer. The first die package component may further include a double-sided semiconductor die, such that a first side of the double-sided semiconductor die is electrically coupled to the second interposer, and a second side of the double-sided semiconductor die is electrically coupled to the third interposer. The first die package component may further include a molding material and a through-molding-via formed in the molding material, such that the through-molding-via provides an electrical connection between the second interposer and the third interposer that bypasses the double-sided semiconductor die.

公开(公告)号：US20230395461A1

公开(公告)日：2023-12-07

申请号：US17833208

申请日：2022-06-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Wen-Yi Lin ,  Kuang-Chun Lee ,  Chien-Chen Li ,  Chien-Li Kuo ,  Kuo-Chio Liu

IPC分类号： H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/4275 ,  H01L25/0655 ,  H01L21/4882 ,  H01L23/49833 ,  H01L2924/35121 ,  H01L2924/3511 ,  H01L2924/1611 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/1659 ,  H01L2924/165 ,  H01L24/73

摘要： Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a package component with one or more integrated circuits adhered to a package substrate, a hybrid thermal interface material utilizing a combination of polymer based material with high elongation values and metal based material with high thermal conductivity values. The polymer based thermal interface material placed on the edge of the package component contains the metal based thermal interface material in liquid form.