公开(公告)号：US20240120252A1

公开(公告)日：2024-04-11

申请号：US18358411

申请日：2023-07-25

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Nobuhiro KINOSHITA ,  Mitsunobu WANSAWA

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/3675 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16598 ,  H01L2924/3512

摘要： A semiconductor device according to one embodiment, includes: a wiring substrate having a core insulating layer; a semiconductor chip mounted on an upper surface of the wiring substrate; a plurality of solder balls formed on a lower surface of the wiring substrate; and a heat sink having a first portion fixed to a back surface of the semiconductor chip via a first adhesive layer, and a second portion located around the first portion and fixed to the wiring substrate via a second adhesive layer. Here, a portion of the plurality of solder balls is arranged at a position overlapping with each of the second portion of the heat sink and the second adhesive layer. Also, a second thickness of the second adhesive layer is greater than two times a first thickness of the first adhesive layer.

公开(公告)号：US20240088093A1

公开(公告)日：2024-03-14

申请号：US18149793

申请日：2023-01-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Wensen Hung ,  Tsung-Yu Chen ,  Wen-Hsin Wei ,  Hsien-Pin Hu

IPC分类号： H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/473 ,  H01L23/498

CPC分类号： H01L25/0655 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/08112 ,  H01L2224/16227 ,  H01L2924/10161 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/1811 ,  H01L2924/182

摘要： In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

公开(公告)号：US20180158794A1

公开(公告)日：2018-06-07

申请号：US15575522

申请日：2016-06-01

申请人： Mitsubishi Electric Corporation

发明人： Kiyoshi ISHIDA ,  Makoto KIMURA ,  Katsumi MIYAWAKI ,  Yukinobu TARUI ,  Keiko SHIRAFUJI

IPC分类号： H01L23/00 ,  H01L23/04

CPC分类号： H01L24/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L24/73 ,  H01L2224/4807 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/1631 ,  H01L2924/3025 ,  H01L2224/45099

摘要： A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.

公开(公告)号：US20180061751A1

公开(公告)日：2018-03-01

申请号：US15680347

申请日：2017-08-18

申请人： KYOCERA Corporation

发明人： Kensaku MURAKAMI ,  Yousuke MORIYAMA

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/057 ,  H01L23/13

CPC分类号： H01L23/49838 ,  H01L23/057 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15323 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2224/45099 ,  H01L2924/014

摘要： An electronic component mounting substrate includes an insulating base having a rectangular shape in plan view and including a first main surface, a second main surface facing the first main surface, and a recess open on the first main surface, a band-shaped metal layer on a sidewall of the recess, and an electrode extending from a bottom surface of the recess into the insulating base. The electrode has an end disposed in the insulating base, and the end includes an inclined portion inclined toward the second main surface.

公开(公告)号：US09673119B2

公开(公告)日：2017-06-06

申请号：US14163000

申请日：2014-01-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Yen Lin ,  Yu-Chih Liu ,  Chin-Liang Chen ,  Wei-Ting Lin ,  Kuan-Lin Ho

IPC分类号： H01L23/34 ,  H01L23/10 ,  H01L23/04 ,  H01L23/31 ,  H01L21/56 ,  H01L23/58 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/498

CPC分类号： H01L23/10 ,  H01L21/563 ,  H01L23/04 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/03002 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/014

摘要： Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill.

公开(公告)号：US20160035637A1

公开(公告)日：2016-02-04

申请号：US14813592

申请日：2015-07-30

申请人： Socionext Inc.

发明人： Kazuyuki URAGO ,  Nobutaka Shimizu

IPC分类号： H01L23/053 ,  H01L23/498 ,  H01L21/52 ,  H01L23/04

CPC分类号： H01L23/053 ,  H01L21/52 ,  H01L23/04 ,  H01L23/10 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16153 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1659 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00

摘要： A semiconductor device includes: a substrate; a semiconductor element disposed on the substrate; a plurality of electrodes disposed on the substrate separately from one another and arranged so as to surround the semiconductor element in a plan view; a lid that cover the semiconductor element, the lid including an inner portion and a periphery portion that is outer than the inner portion in a plan view, the lid including a plurality of first protruding members that is provided separately from one another, the first protruding members being disposed in the inner portion; and conductive members disposed between the plurality of electrodes and the plurality of protruding members disposed in positions opposed to the plurality of electrodes respectively, the conductive members being joined to the plurality of electrodes and the plurality of protruding members respectively.

摘要翻译： 半导体器件包括：衬底; 设置在所述基板上的半导体元件; 多个电极，彼此分离设置在基板上，并且以平面图包围半导体元件; 覆盖所述半导体元件的盖，所述盖包括内部部分和在所述内部部分的外侧部分在平面图中的周边部分，所述盖子包括彼此分开设置的多个第一突出部件，所述第一突出部 构件设置在内部; 以及设置在所述多个电极之间的导电构件和分别设置在与所述多个电极相对的位置的所述多个突出构件，所述导电构件分别与所述多个电极和所述多个突出构件接合。

公开(公告)号：US08638000B2

公开(公告)日：2014-01-28

申请号：US13509163

申请日：2010-09-23

申请人： Achim Trautmann ,  Ralf Reichenbach

发明人： Achim Trautmann ,  Ralf Reichenbach

IPC分类号： H01L23/48

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.

摘要翻译： 用于接合半导体衬底的微机械组件包括具有多个半导体芯片的芯片图案的半导体衬底，每个半导体芯片具有功能区域和围绕功能区域的边缘区域。 存在由边缘区域中的至少两个合金部件制成的接合合金的接合框架，与功能区域间隔开。 在围绕接合框架和功能区域之间的接合框架的边缘区域的部分内，存在至少一个由至少一个合金部件制成的止挡框架，其被构造成使得当接合合金的熔体接触 在接合期间的停止框架，粘结合金固化。

公开(公告)号：US20240128148A1

公开(公告)日：2024-04-18

申请号：US18151222

申请日：2023-01-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chang-Jung Hsueh ,  Po-Yao Lin ,  Hui-Min Huang ,  Ming-Da Cheng ,  Kathy Yan

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H10B80/00

CPC分类号： H01L23/3675 ,  H01L21/4882 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2924/1011 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1611 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1632

摘要： A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

公开(公告)号：US20230378007A1

公开(公告)日：2023-11-23

申请号：US17750428

申请日：2022-05-23

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Yu-Sheng Lin ,  Shu-Shen Yeh ,  Chien-Shen Chen ,  Po-Yao Lin ,  Shin-Puu Jeng ,  Ming-Chih Yew ,  Chin-Hua Wang ,  Po-Chen Lai ,  Chia-Kuei Hsu

IPC分类号： H01L23/055 ,  H01L25/065 ,  H01L23/10 ,  H01L21/48

CPC分类号： H01L23/055 ,  H01L25/0655 ,  H01L23/10 ,  H01L21/4871 ,  H01L2924/35121 ,  H01L2924/1611 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/1631 ,  H01L2924/1811 ,  H01L2924/182 ,  H01L24/73

摘要： A package assembly includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and attached to the package substrate. The package lid includes an outer lid including an outer lid material and including an outer lid plate portion. The package lid further includes an inner lid including an inner lid material different than the outer lid material and including an inner lid plate portion attached to a bottom surface of the outer lid plate portion.

公开(公告)号：US09721859B2

公开(公告)日：2017-08-01

申请号：US14842535

申请日：2015-09-01

申请人： Texas Instruments Incorporated

发明人： Andy Quang Tran ,  Alok Kumar Lohia ,  Reynaldo Corpuz Javier

IPC分类号： H01L21/50 ,  H01L23/10 ,  H01L23/00 ,  H01L23/055

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L23/055 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/89 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1659 ,  H01L2924/1679 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of assembling a semi-hermetic semiconductor package includes bonding a semiconductor die having bond pads to a top side of a base region of a package substrate having vertical side walls that are hollow which define an inner open volume (gap) having an adhesive or thermoplastic material therein. There are a plurality of metal terminals providing top terminal contacts on the top side of the base region and bottom terminal contacts on a bottom side or below the base region. The bond pads are coupled to the top terminal contacts. A lid is placed which provides a top for the semiconductor package, where the lid extends to vertically oriented end protrusions so that the protrusions are positioned within the adhesive or thermoplastic material to secure the protrusions within the adhesive or thermoplastic material to provide a seal for the semiconductor package.