公开(公告)号：US11637087B2

公开(公告)日：2023-04-25

申请号：US17458702

申请日：2021-08-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Chin-Hua Wang ,  Po-Chen Lai ,  Shu-Shen Yeh ,  Tsung-Yen Lee ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/49 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/373

摘要： A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

公开(公告)号：US12040267B2

公开(公告)日：2024-07-16

申请号：US18121189

申请日：2023-03-14

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Li-Ling Liao ,  Ming-Chih Yew ,  Chia-Kuei Hsu ,  Shu-Shen Yeh ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L21/00 ,  H01L23/498 ,  H10K71/00

CPC分类号： H01L23/49838 ,  H01L23/49805 ,  H01L23/49822 ,  H10K71/621 ,  H01L23/49816

摘要： An organic interposer includes dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the dielectric material layers, and die-side bump structures located on a second side of the dielectric material layers. A gap region is present between a first area including first die-side bump structures and a second area including second die-side bump structures. Stress-relief line structures are located on, or within, the dielectric material layers within an area of the gap region in the plan view. Each stress-relief line structures may include straight line segments that laterally extend along a respective horizontal direction and is not electrically connected to the redistribution interconnect structures. The stress-relief line structures may include the same material as, or may include a different material from, a metallic material of the redistribution interconnect structures or bump structures that are located at a same level.

公开(公告)号：US11997842B2

公开(公告)日：2024-05-28

申请号：US17462066

申请日：2021-08-31

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Ming-Chih Yew ,  Shu-Shen Yeh ,  Chin-Hua Wang ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H10B10/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528 ,  H01L23/535 ,  H01L23/538 ,  H01L25/065

CPC分类号： H10B10/00 ,  H01L21/563 ,  H01L23/5283 ,  H01L23/535 ,  H01L23/5386 ,  H01L24/09 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/32137

摘要： A fan-out package includes a redistribution structure having redistribution-side bonding structures, a plurality of semiconductor dies including a respective set of die-side bonding structures that is attached to a respective subset of the redistribution-side bonding structures through a respective set of solder material portions, and an underfill material portion laterally surrounding the redistribution-side bonding structures and the die-side bonding structures of the plurality of semiconductor dies. A subset of the redistribution-side bonding structures is not bonded to any of the die-side bonding structures of the plurality of semiconductor dies and is laterally surrounded by the underfill material portion, and is used to provide uniform distribution of the underfill material during formation of the underfill material portion.

公开(公告)号：US20240055321A1

公开(公告)日：2024-02-15

申请号：US17885033

申请日：2022-08-10

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Po-Yao Lin ,  Sheng-Liang Kuo ,  Yu-Sheng Lin ,  Kathy Yan

IPC分类号： H01L23/427 ,  H01L23/473

CPC分类号： H01L23/427 ,  H01L23/473

摘要： A thermal module may include a cold plate including a cold plate base having a cold plate base protruding portion, and a cold plate cover on the cold plate base, and a heat pipe between the cold plate base and the cold plate cover, and including an upper heat pipe portion and a lower heat pipe portion in the cold plate base protruding portion.

公开(公告)号：US20230395519A1

公开(公告)日：2023-12-07

申请号：US17829552

申请日：2022-06-01

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Ming-Chih Yew ,  Shu-Shen Yeh ,  Yu-Sheng Lin ,  Po-Yao Lin ,  Shih-Puu Jeng

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L25/18 ,  H01L23/498 ,  H01L25/00

CPC分类号： H01L23/5389 ,  H01L23/5386 ,  H01L23/5385 ,  H01L23/3121 ,  H01L25/18 ,  H01L23/49811 ,  H01L23/5383 ,  H01L25/50 ,  H01L2224/16227 ,  H01L24/16

摘要： Semiconductor packages and methods of fabricating semiconductor packages include a package substrate having a recess formed in a surface of the package substrate and at least one channel in a bottom surface of the recess. The recess may be configured to accommodate a semiconductor device located over a surface of an interposer that is bonded to the package substrate. Accordingly, a minimum gap distance may be maintained between the semiconductor device and the package substrate, which may ensure that sufficient underfill material may flow between the semiconductor device and the package substrate and within the at least one channel, thereby improving of the structural coupling between the interposer and the package substrate, and reducing the likelihood of package defects, such as delamination, cracking, and/or popcorn defects.

公开(公告)号：US11282756B2

公开(公告)日：2022-03-22

申请号：US16994711

申请日：2020-08-17

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Tsung-Yen Lee ,  Chin-Hua Wang ,  Ming-Chih Yew ,  Chia-Kuei Hsu ,  Po-Chen Lai ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/14 ,  H01L23/00 ,  H01L21/768 ,  H01L23/538 ,  H01L23/60

摘要： An organic interposer includes polymer matrix layers embedding redistribution interconnect structures, package-side bump structures, die-side bump structures and connected to a distal subset of the redistribution interconnect structures through a respective bump connection via structure. At least one metallic shield structure may laterally surround a respective one of the die-side bump structures. Shield support via structures may laterally surround a respective one of the bump connection via structures. Each metallic shield structure and the shield support via structures may be used to reduce mechanical stress applied to the redistribution interconnect structures during subsequent attachment of a semiconductor die to the die-side bump structures.

公开(公告)号：US20230378042A1

公开(公告)日：2023-11-23

申请号：US17750429

申请日：2022-05-23

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chin-Hua Wang ,  Shu-Shen Yeh ,  Chia-Kuei Hsu ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L23/13 ,  H01L23/14

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/13 ,  H01L23/145 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L21/486 ,  H01L24/16

摘要： An embodiment package substrate may include a core portion including a first material having a first bulk modulus and a first coefficient of thermal expansion, and a reinforcing portion including a second material having a second bulk modulus and a second coefficient of thermal expansion. The second bulk modulus may be chosen to be greater than the first bulk modulus and the second coefficient of thermal expansion may be chosen to be less than the first coefficient of thermal expansion. The core portion may include a fiber-reinforced polymer material and the reinforcing portion may include silicon, silicon nitride, or a ceramic material. The second bulk modulus may be greater than or equal to 100 GPa and the second coefficient of thermal expansion may be less than 10 ppm/° C. The reinforcing portion may include four components each respectively located proximate to a respective corner of the package substrate.

公开(公告)号：US11610835B2

公开(公告)日：2023-03-21

申请号：US17085186

申请日：2020-10-30

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Li-Ling Liao ,  Ming-Chih Yew ,  Chia-Kuei Hsu ,  Shu-Shen Yeh ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L51/00

摘要： An organic interposer includes dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the dielectric material layers, and die-side bump structures located on a second side of the dielectric material layers. A gap region is present between a first area including first die-side bump structures and a second area including second die-side bump structures. Stress-relief line structures are located on, or within, the dielectric material layers within an area of the gap region in the plan view. Each stress-relief line structures may include straight line segments that laterally extend along a respective horizontal direction and is not electrically connected to the redistribution interconnect structures. The stress-relief line structures may include the same material as, or may include a different material from, a metallic material of the redistribution interconnect structures or bump structures that are located at a same level.

公开(公告)号：US20230057025A1

公开(公告)日：2023-02-23

申请号：US17407224

申请日：2021-08-20

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Yu-Sheng LIN ,  Shu-Shen Yeh ,  Chin-Hua Wang ,  Po-Yao Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/053 ,  H01L23/427 ,  H01L25/18 ,  H01L23/498 ,  H01L21/52

摘要： A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.

公开(公告)号：US20230018343A1

公开(公告)日：2023-01-19

申请号：US17748335

申请日：2022-05-19

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Yu-Sheng LIN ,  Shu-Shen Yeh ,  Chin-Hua Wang ,  Po-Yao Lin ,  Shin-Puu Jeng ,  Chien Hung Chen ,  Chia-Kuei Hsu

IPC分类号： H01L23/055 ,  H01L25/065 ,  H01L23/10 ,  H01L21/48

摘要： A package assembly includes a package substrate, a package lid located on the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot having a height greater than or equal to a height of the outer foot, extending from the plate portion and including a first inner foot corner portion located inside a first corner of the outer foot, and an adhesive that adheres the outer foot to the package substrate and adheres the inner foot to the package substrate.